Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser 150 module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object an

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention describes a laser sensor module (100) for detecting ultra-fine particles (10) with a particle size of 300 nm or less, more preferably 200 nm or less, most preferably 100 nm or less, the laser sensor module (100) comprising: —at least one laser (110) being adapted to emit laser light to at least one focus region in reaction to signals provided by at least one electrical driver (130), —at least one detector (120) being adapted to determine a self-mixing interference signal of an optical wave within a laser cavity of the at least one laser (110), wherein the self-mixing interference signal is caused by reflected laser light reentering the laser cavity, the reflected laser light being reflected by a particle receiving at least a part of the laser light, —the laser sensor module (100) being arranged to perform at least one self-mixing interference measurement, —the laser sensor module (100) being adapted to determine a first particle size distribution function with a first sensitivity by means of at

Abstract: The invention describes a laser sensor module (100) for particle density detection. The laser sensor module (100) comprising at least one first laser (110), at least one first detector (120) and at least one electrical driver (130). The first laser (110) is adapted to emit first laser light in reaction to signals provided by the at least one electrical driver (130). The at least one first detector (120) is adapted to detect a first self-mixing interference signal of an optical wave within a first laser cavity of the first laser (110). The first self-mixing interference signal is caused by first reflected laser light reentering the first laser cavity, the first reflected laser light being reflected by a particle receiving at least a part of the first laser light. The laser sensor module (100) is adapted to reduce multiple counts of the particle. The invention further describes a related method and computer program product.

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention describes a laser sensor module (100) for detecting ultra-fine particles (10) with a particle size of 300 nm or less, more preferably 200 nm or less, most preferably 100 nm or less, the laser sensor module (100) comprising: —at least one laser (110) being adapted to emit laser light to at least one focus region in reaction to signals provided by at least one electrical driver (130),—at least one detector (120) being adapted to determine a self-mixing interference signal of an optical wave within a laser cavity of the at least one laser (110), wherein the self-mixing interference signal is caused by reflected laser light reentering the laser cavity, the reflected laser light being reflected by a particle receiving at least a part of the laser light,—the laser sensor module (100) being arranged to perform at least one self-mixing interference measurement,—the laser sensor module (100) being adapted to determine a first particle size distribution function with a first sensitivity by means of at lea

Abstract: The invention relates to a heating system for heating a living being, for instance, a person (2) within a vehicle (1) being preferentially a hybrid car or an electric car. The heating system comprises an infrared laser system (5, 6) for illuminating the living being with infrared laser light, thereby heating the living being. Thus, heating radiation is used, which has a high collimation and which can be focused relatively easily. The heating can therefore be confined to a certain region, in which the living being is located. The heating can even be confined to the living being or to parts of the living being only. This more focused heating allows for a reduction of the energy consumption.

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention describes a laser sensor module comprising at least one Vertical Cavity Surface Emitting Laser (100) and at least one driving circuit (120). The driving circuit (120) is adapted to provide electrical energy to the Vertical Cavity Surface Emitting Laser (100) such that the Vertical Cavity Surface Emitting Laser (100) emits laser pulses (345) with a pulse length (356) of less than 100 ns and a duty cycle of less than 5% in comparison to a continuous laser emission. The driving circuit (120) is further adapted to provide additional energy to the Vertical Cavity Surface Emitting Laser (100) at least 100 ns prior to at least a part of the laser pulses (345) such that the part of the laser pulses (345) are emitted under defined optical conditions. The invention further describes a distance detection device comprising the laser sensor module and a method of driving the laser sensor module.

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180) and a corresponding method of laser printing. The laser module comprises at least two laser arrays (110) of semiconductor lasers (115) and at least one optical element (170). The optical element (170) is adapted to image laser light emitted by the laser arrays (110), such that laser light of semiconductor lasers (115) of one laser array (110) is imaged to one pixel in a working plane (180) of the laser printing system (100) and an area element of the pixel is illuminated by means of at least two semiconductor lasers (115). The optical element does not project or focus laser light of each single semiconductor laser (115) to the working plane (180) but images the whole laser arrays to the working plane.

Abstract: The present invention relates to a laser sensor for self-mixing interferometry. The laser sensor comprises at least one semiconductor laser light source emitting laser radiation and at least one photodetector (6) monitoring the laser radiation of the laser light source. The laser light source is a VECSEL having a gain medium (3) arranged in a layer structure (15) on a front side of a first end mirror (4), said first end mirror (4) forming an external cavity with an external second end mirror (5). The proposed laser sensor provides an increased detection range and can be manufactured in a low-cost production process.

Abstract: The invention describes an illumination device (100) for illuminating a three dimensional arrangement (250) in an infrared wavelength spectrum. The illumination device (100) comprises at least a first group of laser devices (110) comprising at least one laser device (105) and at least a second group of laser devices (120) comprising at least one laser device (105). The first and the second group of laser devices (110, 120) are adapted to be operated independent with respect to each other. The first group of laser devices (110) is adapted to emit laser light with a first emission characteristic and the second group of laser devices (120) is adapted to emit laser light with a second emission characteristic different from the first emission characteristic. The invention further describes a distance detection device (150) and a camera system (300) comprising such an illumination device (100).

Abstract: The present invention relates to a laser device (10) for projecting a structured light pattern (9) onto a scene (15). The device is formed of several arrays (1) of semiconductor lasers (2), each array (1) comprising an irregular distribution of emission areas (2a) of the semiconductor lasers (2). One or several imaging optics (4) image said arrays (1) to an imaging space and superpose the images of said arrays (1) in the imaging space to form said light pattern (9). The proposed laser device generates a light pattern with high contrast and efficiency which may be used for 3D imaging systems, e. g. in automotive applications.

Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).

Abstract: The invention describes a light emitting semiconductor device (100) comprising a substrate (120), a light emitting layer structure (155) and an AlGaAs getter layer (190) for reducing an impurity in the light emitting layer structure (155), the light emitting layer structure (155) comprising an active layer (140) and layers of varying Aluminum content, wherein the growth conditions of the layers of the light emitting layer structure (155) comprising Aluminum are different in comparison to the growth conditions of the AlGaAs getter layer (190). The AlGaAs getter layer (190) enables a reduction of the concentration of impurities like Sulfur etc. in the gas phase of a deposition equipment or growth reactor. The reduction of such impurities reduces the probability of incorporation of the impurities in the light emitting layer structure (155) which may affect the lifetime of the light emitting semiconductor device (100).

Abstract: The invention describes a laser sensor module comprising at least one Vertical Cavity Surface Emitting Laser (100) and at least one driving circuit (120). The driving circuit (120) is adapted to provide electrical energy to the Vertical Cavity Surface Emitting Laser (100) such that the Vertical Cavity Surface Emitting Laser (100) emits laser pulses (345) with a pulse length (356) of less than 100 ns and a duty cycle of less than 5% in comparison to a continuous laser emission. The driving circuit (120) is further adapted to provide additional energy to the Vertical Cavity Surface Emitting Laser (100) at least 100 ns prior to at least a part of the laser pulses (345) such that the part of the laser pulses (345) are emitted under defined optical conditions. The invention further describes a distance detection device comprising the laser sensor module and a method of driving the laser sensor module.

Abstract: The invention describes a laser device (100) comprising between two and six mesas (120) provided on one semiconductor chip (110), wherein the mesas (120) are electrically connected in parallel. The laser device (100) is adapted such that degradation of at least one mesa (120) results in a decreased laser power emitted by the laser device (100) in a defined solid angle when driven at the defined electrical input power. The laser device (100) is adapted such that eye safety of the laser device (100) is guaranteed during life time of the laser device (100). Eye safety may be guaranteed by designing the semiconductor structure or more general layer structure of mesas (120) of the laser device (100) in a way that degradation of one or more layers of the layer structure results in a reduction of the maximum optical power emitted in a defined solid angle.

Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.