Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

Abstract: The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).

Abstract: The invention describes a laser sensor module (100) for particle density detection. The laser sensor module (100) comprising at least one first laser (110), at least one first detector (120) and at least one electrical driver (130). The first laser (110) is adapted to emit first laser light in reaction to signals provided by the at least one electrical driver (130). The at least one first detector (120) is adapted to detect a first self-mixing interference signal of an optical wave within a first laser cavity of the first laser (110). The first self-mixing interference signal is caused by first reflected laser light reentering the first laser cavity, the first reflected laser light being reflected by a particle receiving at least a part of the first laser light. The laser sensor module (100) is adapted to reduce multiple counts of the particle. The invention further describes a related method and computer program product.

Abstract: The invention relates to a heating system for heating a living being, for instance, a person (2) within a vehicle (1) being preferentially a hybrid car or an electric car. The heating system comprises an infrared laser system (5, 6) for illuminating the living being with infrared laser light, thereby heating the living being. Thus, heating radiation is used, which has a high collimation and which can be focused relatively easily. The heating can therefore be confined to a certain region, in which the living being is located. The heating can even be confined to the living being or to parts of the living being only. This more focused heating allows for a reduction of the energy consumption.

Abstract: The invention describes a laser device (100) comprising between two and six mesas (120) provided on one semiconductor chip (110), wherein the mesas (120) are electrically connected in parallel. The laser device (100) is adapted such that degradation of at least one mesa (120) results in a decreased laser power emitted by the laser device (100) in a defined solid angle when driven at the defined electrical input power. The laser device (100) is adapted such that eye safety of the laser device (100) is guaranteed during life time of the laser device (100). Eye safety may be guaranteed by designing the semiconductor structure or more general layer structure of mesas (120) of the laser device (100) in a way that degradation of one or more layers of the layer structure results in a reduction of the maximum optical power emitted in a defined solid angle.

Abstract: The invention describes an illumination device (100) for illuminating a three dimensional arrangement (250) in an infrared wavelength spectrum. The illumination device (100) comprises at least a first group of laser devices (110) comprising at least one laser device (105) and at least a second group of laser devices (120) comprising at least one laser device (105). The first and the second group of laser devices (110, 120) are adapted to be operated independent with respect to each other. The first group of laser devices (110) is adapted to emit laser light with a first emission characteristic and the second group of laser devices (120) is adapted to emit laser light with a second emission characteristic different from the first emission characteristic. The invention further describes a distance detection device (150) and a camera system (300) comprising such an illumination device (100).

Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip.

Abstract: The invention relates to a heating system for heating a living being, for instance, a person (2) within a vehicle (1) being preferentially a hybrid car or an electric car. The heating system comprises an infrared laser system (5, 6) for illuminating the living being with infrared laser light, thereby heating the living being. Thus, heating radiation is used, which has a high collimation and which can be focused relatively easily. The heating can therefore be confined to a certain region, in which the living being is located. The heating can even be confined to the living being or to parts of the living being only. This more focused heating allows for a reduction of the energy consumption.

Abstract: A system and method (10) for heating objects (O) during a thermal treatment process in a production line (P) is described. The system (10) comprises a transport system (11), a minor arrangement (201, 202, 203, 204, 205, 206) comprising a first mirror surface (21, 21?, 21?) and a second minor surface (22, 22?, 22?) arranged at opposite sides, so that the objects (O) may be transported between the minor surfaces (21, 22, 21?, 22?, 21?, 22?) along the production line and a radiation device (30) comprising a number of lasers for generating light (L).

Abstract: The invention describes a light emitting semiconductor device (100) comprising a substrate (120), a light emitting layer structure (155) and an AlGaAs getter layer (190) for reducing an impurity in the light emitting layer structure (155), the light emitting layer structure (155) comprising an active layer (140) and layers of varying Aluminum content, wherein the growth conditions of the layers of the light emitting layer structure (155) comprising Aluminum are different in comparison to the growth conditions of the AlGaAs getter layer (190). The AlGaAs getter layer (190) enables a reduction of the concentration of impurities like Sulfur etc. in the gas phase of a deposition equipment or growth reactor. The reduction of such impurities reduces the probability of incorporation of the impurities in the light emitting layer structure (155) which may affect the lifetime of the light emitting semiconductor device (100).

Abstract: The invention relates to a laser based printing apparatus (100) using laser light sources (111, 112, 113, 402, 404, 406, 604, 606, 808, 810) for supplying energy to a target object (120) to form an image.

Abstract: The invention describes a heating system (100) and a corresponding method of heating a heating surface (180) of an object (150, 950) to a processing temperature of at least 100° C., wherein the heating system (100) comprises semiconductor light sources (115), and wherein the heating system (100) is adapted to heat an area element of the heating surface (180) with at least 50 semiconductor light sources (115) at the same time. The heating system (100) may be part of a reactor for processing semiconductor structures. The light emitted by means of the semiconductor light sources (115) overlaps at the heating surface (180). Differences of the characteristic of one single semiconductor light source (115) may be blurred at the heating surface (180) such that a homogeneous temperature distribution across a processing surface of a, for example, wafer may be enabled.

Abstract: The invention describes carrier structure (100, 200) for assembling a semiconductor lighting module, comprising at least two sub carriers (110, 210) and an alignment structure (120, 130, 230, 232) mechanically coupling the sub carriers (110, 210). The alignment structure (120, 130, 230, 232) is adapted such that the mechanical coupling to at least a part of the sub carriers (110, 210) disappears during thermal mating the carrier structure (100, 200) on a carrier (110, 250). The alignment structure (120, 130, 230, 232) is further adapted to compensate a coefficient of thermal expansion of a material of the carrier (110, 250) being higher than a coefficient of thermal expansion of a material of the carrier structure (100, 200). The invention further describes a semiconductor chip comprising such a carrier structure (100, 200) and a semiconductor lighting module comprising the carrier structure (100, 200) or the semiconductor chip.

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180) and a corresponding method of laser printing. The laser module comprises at least two laser arrays (110) of semiconductor lasers (115) and at least one optical element (170). The optical element (170) is adapted to image laser light emitted by the laser arrays (110), such that laser light of semiconductor lasers (115) of one laser array (110) is imaged to one pixel in a working plane (180) of the laser printing system (100) and an area element of the pixel is illuminated by means of at least two semiconductor lasers (115). The optical element does not project or focus laser light of each single semiconductor laser (115) to the working plane (180) but images the whole laser arrays to the working plane.

Abstract: The present invention relates to a laser sensor for self-mixing interferometry. The laser sensor comprises at least one semiconductor laser light source emitting laser radiation and at least one photodetector (6) monitoring the laser radiation of the laser light source. The laser light source is a VECSEL having a gain medium (3) arranged in a layer structure (15) on a front side of a first end mirror (4), said first end mirror (4) forming an external cavity with an external second end mirror (5). The proposed laser sensor provides an increased detection range and can be manufactured in a low-cost production process.

Abstract: The invention describes a laser printing system (100) for illuminating an object moving relative to a laser module of the laser printing system (100) in a working plane (180), the laser module comprising at least two laser arrays of semiconductor lasers and at least one optical element, wherein the optical element is adapted to image laser light emitted by the laser arrays, such that laser light of semiconductor lasers of one laser array is imaged to one pixel in the working plane of the laser printing system, and wherein the laser printing system is a 3D printing system for additive manufacturing and wherein two, three, four or a multitude of laser modules (201, 202) are provided, which are arranged in columns (c1, c2) perpendicular to a direction of movement (250) of the object in the working plane (180), and wherein the columns are staggered with respect to each other such that a first laser module (201) of a first column of laser modules (c1) is adapted to illuminate a first area (y1) of the object and a

Abstract: The invention relates to a light application apparatus (1) for applying light to an object (3). A light source (4) generates processing light (2) and sensing light (5), which are coupled into the object (3). A light detector (8) detects the sensing light (5) after having left the object (3), and a control unit (9) controls the light source (4) such that processing light (2) in a processing time interval and sensing light (5) in a sensing time interval are alternately generated. Since processing light and sensing light are generated alternately, the generation of the processing light and of the sensing light is decoupled, i.e. the processing light can be optimized for processing purposes and the sensing light can be optimized for sensing purposes. This allows improving the quality of sensing the object and, thus, the quality of controlling the application of light depending on properties of the object.

Abstract: The present invention relates to a laser sensor for self-mixing interferometry. The laser sensor comprises at least one semiconductor laser light source emitting laser radiation and at least one photodetector (6) monitoring the laser radiation of the laser light source. The laser light source is a VECSEL having a gain medium (3) arranged in a layer structure (15) on a front side of a first end mirror (4), said first end mirror (4) forming an external cavity with an external second end mirror (5). The proposed laser sensor provides an increased detection range and can be manufactured in a low-cost production process.

Abstract: The invention relates to a light application apparatus (1) for applying light to an object (3). A light source (4) generates processing light (2) and sensing light (5), which are coupled into the object (3). A light detector (8) detects the sensing light (5) after having left the object (3), and a control unit (9) controls the light source (4) such that processing light (2) in a processing time interval and sensing light (5) in a sensing time interval are alternately generated. Since processing light and sensing light are generated alternately, the generation of the processing light and of the sensing light is decoupled, i.e. the processing light can be optimized for processing purposes and the sensing light can be optimized for sensing purposes. This allows improving the quality of sensing the object and, thus, the quality of controlling the application of light depending on properties of the object.

Abstract: The method is based on a determination of the orientation of the sensor to the surface moving with respect to the sensor and then acquiring data where the lateral velocity is small and the forward velocity is large. Then, the orientation of the sensor with respect to the direction of the forward velocity is determined and the velocity data subsequently measured are corrected using the measured orientation of the sensor with respect to the reference surface and the forward velocity direction.