Abstract: A thermal management module includes a component carrier, at least two, typically multiple electrically controllable function components for temperature-controlling at least one vehicle component of a motor vehicle, which are detachably or non-detachably connected to the component carrier, at least one electrical control unit, which for electrically controlling at least two, typically multiple, particularly typically all of the function components include a control electronic system, which via at least one electrical control line path and/or via a component field bus is electrically connected to the respective function component and arranged in a housing of the control unit, wherein the housing of the control unit is detachably or non-detachably fastened to the component carrier and/or to at least one of the function components.

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Abstract: A method for operating a thermo-management module for a motor vehicle, wherein the module includes switching over a control unit between a first operating mode and at least a second operating mode, passing on in the first operating mode, control commands received from the vehicle field bus by the control electronics for actuation of the respective functional component directly to the component field bus, in at least one second operating mode, processing control commands received from the vehicle field us by the control electronics, so that the actuation of the functional components is carried out in a self-sufficient manner by the control unit. In addition, thermo-management module includes a component carrier, electrically controllable functional components, and an electric control unit for controlling the functional components.

Abstract: A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Abstract: A thermal management module includes a component carrier, at least two, typically multiple electrically controllable function components for temperature-controlling at least one vehicle component of a motor vehicle, which are detachably or non-detachably connected to the component carrier, at least one electrical control unit, which for electrically controlling at least two, typically multiple, particularly typically all of the function components include a control electronic system, which via at least one electrical control line path and/or via a component field bus is electrically connected to the respective function component and arranged in a housing of the control unit, wherein the housing of the control unit is detachably or non-detachably fastened to the component carrier and/or to at least one of the function components.

Abstract: A method for operating a thermo-management module for a motor vehicle, wherein the module includes switching over a control unit between a first operating mode and at least a second operating mode, passing on in the first operating mode, control commands received from the vehicle field bus by the control electronics for actuation of the respective functional component directly to the component field bus, in at least one second operating mode, processing control commands received from the vehicle field us by the control electronics, so that the actuation of the functional components is carried out in a self-sufficient manner by the control unit. In addition, thermo-management module includes a component carrier, electrically controllable functional components, and an electric control unit for controlling the functional components.

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: A component node for a vehicle is provided. The component node has an electric drive motor and an electric energy store. The component node includes at least one function component of a cooling circuit of the vehicle that can be flowed through by cooling liquid and a component carrier. On the component carrier, a component interface or the respective function component is moulded and the respective function component is detachably fastened to the component carrier via the component interface.

Abstract: A longitudinal driver assistance system in a motor vehicle includes a capture system configured to detect upcoming relevant events which require adaptation of a predefined maximum permissible top speed, and a functional unit which, upon detecting an upcoming relevant event, is configured to determine, based on a location of the upcoming relevant event, a first location or first time, the reaching of which causes the functional unit to output a notification to a driver of the vehicle relating to an automatic adaptation of the maximum permissible top speed. The functional unit is also configured to determine a second location or time to be reached after the first location or first time, respectively, the reaching of which causes the functional unit to intervene in a longitudinal guidance of the motor vehicle in a direction of a new maximum permissible top speed at the location of the upcoming relevant event if there is no driver-initiated refusal of the automatic adaptation of the maximum permissible top speed.

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: A method of assembling a semiconductor power module component 30 and a manufacturing system comprising such a semiconductor power module component and a pressing apparatus 20 for manufacturing a semiconductor power module component are described. The semiconductor power module component 30 comprises at least a first element 1, a second element 2 and a third element 3 arranged in a stack 10. The first element 1 and the second element 2 are joined by sintering in a sintering area 4 and the second element 2 and the third element 3 are joined by soldering in a soldering area 6. The sintering and the soldering are simultaneously executed, wherein the soldering area 6 is heated to a temperature of soldering and the sintering area 4 is heated to a temperature of sintering, the temperature of soldering and the temperature of sintering being harmonized to each other.

Abstract: Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: One aspect relates to a method for manufacturing a substrate assembly for attachment to an electronic component A substrate is provided with a first side and a second side. A contact material layer is applied to the first side of the substrate. A pre-fixing agent is applied at least to sections of a side of the contact material layer facing away from the substrate.

Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).

Abstract: Sintering device for sintering at least one electronic assembly, having a lower die and an upper die which is slidable towards the lower die, or a lower die which is slidable towards the upper die. The lower die forms a support for the assembly to be sintered and the upper die includes a receptacle for a pressure pad for exerting pressure directed towards the lower die, and a delimitation wall which laterally surrounds the pressure pad. The delimitation wall having an outer delimitation wall and an inner delimitation wall surrounded by the outer delimitation wall, the inner delimitation wall mounted so as to be slidable towards the outer delimitation wall and so as to be slid in the direction of the lower die such that, following the placing of the inner delimitation wall on the lower die, the pressure pad is displaceable in the direction of the lower die.

Abstract: A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.

Abstract: The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.