Abstract: A longitudinal driver assistance system in a motor vehicle includes a capture system configured to detect upcoming relevant events which require adaptation of a predefined maximum permissible top speed, and a functional unit which, upon detecting an upcoming relevant event, is configured to determine, based on a location of the upcoming relevant event, a first location or first time, the reaching of which causes the functional unit to output a notification to a driver of the vehicle relating to an automatic adaptation of the maximum permissible top speed. The functional unit is also configured to determine a second location or time to be reached after the first location or first time, respectively, the reaching of which causes the functional unit to intervene in a longitudinal guidance of the motor vehicle in a direction of a new maximum permissible top speed at the location of the upcoming relevant event if there is no driver-initiated refusal of the automatic adaptation of the maximum permissible top speed.

Abstract: A method for manufacturing semiconductor chips (2, 3) having arranged thereon metallic shaped bodies (6), having the following steps: arranging a plurality of metallic shaped bodies (6) on a processed semiconductor wafer while forming a layer arranged between the semiconductor wafer and the metallic shaped bodies (6), exhibiting a first connection material (4) and a second connection material (5), and processing the first connection material (4) for connecting the metallic shaped bodies (6) to the semiconductor wafer without processing the second connecting material (5), wherein the semiconductor chips (2, 3) are separated either prior to arranging the metallic shaped bodies (6) on the semiconductor wafer or after processing the first connection material (4).

Abstract: The present invention discloses a power semiconductor module, comprising: a substrate; a semiconductor provided on a top side of the substrate; and a package formed on the semiconductor and the substrate, wherein the package has openings at a top side thereof, through which terminal contacts of the semiconductor and the substrate are exposed outside and accessible from outside.

Abstract: A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.

Abstract: Sintering device (10) for sintering at least one electronic assembly (BG), having a lower die (20) and an upper die (30) which is slidable towards the lower die (20), or a lower die (20) which is slidable towards the upper die (30), wherein the lower die (20) forms a support for the assembly (BG) to be sintered and the upper die (30) comprises a receptacle which receives a pressure pad (32) for exerting pressure directed towards the lower die (20) and which comprises a delimitation wall (34) which laterally surrounds the pressure pad (32), and wherein the delimitation wall (34) has an outer delimitation wall (34a) and an inner delimitation wall (34b) which is surrounded in an adjacent manner by the outer delimitation wall (34a), and wherein the inner delimitation wall (34b) is mounted so as to be slidable towards the outer delimitation wall (34a) and, when pressure in the direction of the upper die (30) is exerted on the pressure pad (32), is mounted so as to be slid in the direction of the lower die (20), wh

Abstract: Process for producing an electronic subassembly by low-temperature pressure sintering, comprising the following steps: arranging an electronic component on a circuit carrier having a conductor track, connecting the electronic component to the circuit carrier by the low-temperature pressure sintering of a joining material which connects the electronic component to the circuit carrier, characterized in that, to avoid the oxidation of the electronic component or of the conductor track, the low-temperature pressure sintering is carried out in a low-oxygen atmosphere having a relative oxygen content of 0.005 to 0.3%.

Abstract: Sintering tool (10) with a cradle for receiving an electronic subassembly (BG) to be sintered, characterized by at least one support bracket (20), arranged at two locations opposite the cradle, for fixing a protective film (30) covering the electronic subassembly (BG).

Abstract: Tool (10) for the lower die of a sintering device, the tool (10) having a rest (20) for an electronic subassembly (30) comprising a circuit carrier, to be sintered, where the rest (20) is formed from a material with a coefficient of linear expansion that is close to the coefficient of expansion of the circuit carrier of the electronic subassembly (30).

Abstract: A coolant system for machine tools, includes a pump (12) for the coolant, at least one consumer (10), a pressure sensor (24) for detecting an actual pressure (Pi) in the coolant system, a feedback control device (22) acting upon the pump (12) for regulating the pressure in the coolant system to a target pressure (Ps), and a limiting valve (26) for limiting the pressure of the coolant supplied to the consumer, wherein in that the opening pressure (Plim) of the limiting valve (26) is variable and the feedback control device (22) is adapted to adjust the opening pressure in accordance with the target pressure (Ps) such that it is always a certain amount larger than the target pressure.

Abstract: A flow distribution module (1) for distributing a flow of fluid over a surface to be cooled is disclosed. The flow distribution module (1) comprises a housing (2) and a cover plate (3). The housing (2) defines at least one flow cell (5), the flow cell(s) (5) being positioned in such a way that a flow of fluid flowing through a flow cell (5) from an inlet opening (6) to an outlet opening (7) is conveyed over the surface to be cooled, each flow cell (5) being formed to cause at least one change in the direction of flow of the fluid flowing through the flow cell (5). The cover plate (3) is arranged adjacent to the flow cell(s) (5) and defines the surface to be cooled. At least a part of the surface to be cooled defined by the cover plate (3) is provided with a surface pattern (8) of raised and depressed surface portions.

Abstract: A coolant system for machine tools, includes a pump (12) for the coolant, at least one consumer (10), a pressure sensor (24) for detecting an actual pressure (Pi) in the coolant system, a feedback control device (22) acting upon the pump (12) for regulating the pressure in the coolant system to a target pressure (Ps), and a limiting valve (26) for limiting the pressure of the coolant supplied to the consumer, wherein in that the opening pressure (Plim) of the limiting valve (26) is variable and the feedback control device (22) is adapted to adjust the opening pressure in accordance with the target pressure (Ps) such that it is always a certain amount larger than the target pressure.

Abstract: Example issue processing systems and methods are described. In one implementation, a method identifies an issue and accesses rules related to resolving the issue. The method also accesses data associated with previous issue resolutions. The identified issue is analyzed based on the rules and data associated with previous issue resolutions. Based on the analysis, the method determines a first activity to perform and identifies the results of performing the first activity. If the first activity did not resolve the issue, the method further analyzes the issue based on the rules, the data associated with previous issue resolutions, and the results of performing the first activity. Based on this further analysis, the method determines a second activity to perform in an attempt to resolve the issue.

Abstract: An air-conditioning system for a motor vehicle contains a heat exchanger with a heat-exchanger tube that features a profiled central channel and outer channels grouped around the central channel. This heat-exchanger tube is suitable for the construction of counterflow heat exchangers. For this purpose, the heat-exchanger tube is to be cut to corresponding lengths and provided with corresponding end pieces. Such heat exchangers have proven to be light, pressure resistant, and effective.