Abstract: The invention relates to an electronic module having plug contacts, which has a semiconductor chip embedded in a plastics composition with its rear side and its edge sides. An active top side of the semiconductor chip forms, together with the plastics composition, an overall top side, there being arranged on the latter a rewiring layer with plug contact areas and rewiring lines that connect the plug contact areas to contact areas of the top side of the semiconductor chip.

Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

Abstract: A semiconductor component includes a plastic housing including: plastic outer surfaces; lower outer contact surfaces arranged on an underside of the housing; upper outer contact surfaces arranged on a top side of the housing that is opposite the underside; and outer interconnects electrically connecting the lower outer contact surfaces to the upper outer contact surfaces, the outer interconnects including a layer of solder arranged on conduction paths along an outer contour of the housing.

Abstract: A semiconductor stack and a semiconductor base device with a wiring substrate and an intermediate wiring board for a semiconductor device stack is disclosed. In one embodiment, a semiconductor chip is arranged between the intermediate wiring board and the wiring substrate which is electrically connected by way of the wiring substrate on the one hand to external contacts on the underside of the wiring substrate and on the other hand to contact terminal areas in the edge regions of the wiring substrate. The intermediate wiring board has angled-away external flat conductors, which are electrically connected in the contact terminal areas of the wiring board. Furthermore, on the upper side of the intermediate wiring board, arranged on the free ends of the internal flat conductors are external contact terminal areas, which correspond in size and arrangement to external contacts of a semiconductor device to be stacked.

Abstract: An electronic component with a plastic package and to a method for its production, includes a semiconductor chip. An underside of the plastic package has external contacts. The external contacts are connected to contact areas on an active upper side of the semiconductor chip by contact pillars of the semiconductor chip and wiring lines arranged on the plastic package molding compound. In this case, the contact pillars represent an electrically conducting elevation of the contact areas.

Abstract: A wiring substrate of a semiconductor component includes: an underside with a wiring structure; a top side with cutouts; a rubber-elastic material arranged in the cutouts; and external contact pads arranged on the rubber-elastic material and configured to be coupled to external contacts. A method for producing a wiring substrate of this type, involves pressing the rubber-elastic material pads into a precursor of a polymer plastic during the production process.

Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.

Abstract: A semiconductor device with a wiring substrate as a stacking element for a semiconductor device stack is described herein. The wiring substrate includes a plastic frame of a first plastic compound and a central region of a second plastic compound. A semiconductor chip is embedded with its back side and its edge sides in the second plastic compound, the active upper side of the semiconductor device being in a coplanar area with the first and second plastic compounds.

Abstract: A sensor component and a panel used for the production thereof is disclosed. The sensor component has, in addition to a sensor chip with a sensor region, a rear side and passive components. These are embedded jointly in a plastics composition, in such a way that their respective electrodes can be wired from an overall top side of a plastic plate.

Abstract: A method is described for producing through-contacts through a panel-shaped composite body including semiconductor chips and a plastic mass filled with conductive particles. The panel-shaped composite body is introduced between two high-voltage point electrodes. The point electrodes are oriented at positions at which through-contacts are to be introduced through the plastic mass. A high voltage is applied to the point electrodes thereby, forming the through-contacts through the plastic mass.

Abstract: A semiconductor component includes a thin semiconductor chip and a wiring substrate that carries the semiconductor chip on its upper side and includes external contacts on its underside and/or its edge sides. The semiconductor chip is preferably produced from monocrystalline silicon having a thickness d?25 ?m.

Abstract: A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

Abstract: An external contact material for external contacts of a semiconductor device and a method for producing the same are described. The external contact material includes a lead-free solder material. Provided in the solder material is a filler which forms a plurality of gas pores and/or has plastic particles which are arranged in the volume of the solder material.

Abstract: The invention relates to a method for producing an electronic component, a stack of semiconductor chips, and an electronic component including a stack of semiconductor chips. The stack has at least a lower electronic module connected via flipchip connections to a central area of a rewiring substrate. The stack also has at least an upper electronic module with external contact surfaces connected via bonding connections to outer areas of the rewiring substrate.

Abstract: A semiconductor component includes a media channel and at least the following components: a semiconductor chip on a wiring substrate, electric connecting elements disposed between the semiconductor chip and the wiring substrate, and a plastic housing mass that embeds these components. The media channel is impressed into the plastic housing mass and extends along the interfaces between the plastic housing mass and the components. The media channel is produced by applying a sacrificial polymer including a media channel structure to the components before embedding the components in the plastic housing mass. The sacrificial polymer is then destroyed after the components are embedded, thereby forming the media channel.

Abstract: One aspect of the invention relates to a method for encapsulating a semiconductor device which has at least one semiconductor chip arranged on a substrate. The method includes application of an elastic dam to the semiconductor chip, introduction of the semiconductor chip arranged on the substrate into a mold including a lower mold half and an upper mold half, closing of the mold so that the elastic dam is completely contacted by an inner surface of the upper mold half, and encapsulation of the semiconductor device with a molding compound.

Abstract: The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.

Abstract: A semiconductor device with surface-mountable outer contacts and to a process for producing it is disclosed. In one embodiment, surface-mountable outer contacts are arranged on outer contact connection surfaces on the underside of the semiconductor device. In their respective center region, the outer contact connection surfaces have at least one recess which has a dovetail-like profile, the areal extent of the recess being smaller than the maximum cross section of an outer contact. In a one process, the recess in the center region is achieved by selective deposition of correspondingly patterned metal layers.

Abstract: A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.

Abstract: The invention relates to a semiconductor device with a semiconductor chip and a rewiring layer, the semiconductor chip being embedded in a housing plastics composition by its rear side contact. The active top side of the semiconductor chip forms a coplanar overall top side with the top side of the housing plastics composition. The rear side contact is led to the overall top side via a flat conductor sheet tape, so that the rear side contact of the semiconductor chip can be accessed from the overall top side.