Patents by Inventor Hong-Bo Deng

Hong-Bo Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8256498
    Abstract: A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: September 4, 2012
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hong-Bo Deng, Di-Qiong Zhao, Ye Chen
  • Patent number: 7796387
    Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: September 14, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Hong-Bo Deng, Di-Qiong Zhao, Ye Chen
  • Publication number: 20100051231
    Abstract: A heat dissipation apparatus includes a heat sink and a heat pipe thermally connecting with the heat sink. The heat sink includes a plurality of radial fins. Each of the fins defines a receiving hole therein, and extends out a flange around the receiving hole. A height of the flange increases outwardly in a direction away from a center of the heat sink. The heat pipe includes an evaporation section and an arcuate condensation section. The condensation section of the heat pipe extends through the receiving hole, and is attached to the flanges of the heat sink.
    Type: Application
    Filed: June 11, 2009
    Publication date: March 4, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YE CHEN, HONG-BO DENG, DI-QIONG ZHAO
  • Publication number: 20100051232
    Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of radial first and second fins. The first and second fins each include a main body and an extension arm extending upwardly from the main body. The main bodies and the extension arms cooperatively form a space therebetween for securely receiving the fan therein. Each extension arm defines an engaging groove communicating with the space. A height of the extension arm of each second fin is less than that of the extension arm of each first fin. A fixing recess is defined over the extension arms of the second fins. The fan includes a frame extending downwardly out a plurality of legs and radially out a fixing arm. The legs have hooks engaging in the engaging grooves, and the fixing arm is fixed in the fixing recess.
    Type: Application
    Filed: June 23, 2009
    Publication date: March 4, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: DI-QIONG ZHAO, HONG-BO DENG
  • Publication number: 20090323284
    Abstract: A heat dissipation apparatus includes a heat sink and a fan. The heat sink defines a recessed space at a center of a top end thereof, and an engaging groove in an inner circumference of the top end of the heat sink surrounding and communicating with the space. The fan includes a frame and an impeller assembled to the frame. A plurality of legs extends downwardly from the frame. Each of the legs includes a hook at a free end thereof. The hooks of the legs engage in the engaging groove of the heat sink for securely mounting the fan in the recessed space of the heat sink. Heat pipes extend through the heat sink and connect with a base.
    Type: Application
    Filed: December 9, 2008
    Publication date: December 31, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: HONG-BO DENG, DI-QIONG ZHAO, YE CHEN
  • Publication number: 20090314466
    Abstract: A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening.
    Type: Application
    Filed: December 9, 2008
    Publication date: December 24, 2009
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: HONG-BO DENG, DI-QIONG ZHAO, YE CHEN
  • Patent number: D593511
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: June 2, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Hong-Bo Deng, Di-Qiong Zhao, Ye Chen
  • Patent number: D597498
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: August 4, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Di-Qiong Zhao, Hong-Bo Deng, Ye Chen