Patents by Inventor Hong-Cheng Yang

Hong-Cheng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220153574
    Abstract: A preclean process may be omitted from a eutectic bonding sequence. To remove oxide from one or more surfaces of a device wafer of a micro-electromechanical-system (MEMS) structure, a duration of an acid-based etch process in the eutectic bonding sequence may be increased relative to the duration of the acid-based etch process when the preclean process is performed. The increased duration of the acid-based etch process enables the acid-based etch process to remove the oxide from the one or more surfaces of the device wafer without the use of a preceding preclean process. This reduces the complexity and cycle time of the eutectic bonding sequence, reduces the risk of stiction between suspended mechanical components of the MEMS structure, and/or reduces the likelihood that the MEMS structure may be rendered defective or inoperable during manufacturing, which increases process yield.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 19, 2022
    Inventors: Hong-Ta KUO, I-Shi WANG, Tzu-Ping YANG, Hsing-Yu WANG, Shu-Han CHAO, Hsi-Cheng HSU, Yin-Tun CHOU, Yuan-Hsin CHI, Sheng-Yuan LIN
  • Patent number: 8413714
    Abstract: A heat dissipation device includes a heat sink forming an engaging portion along an outer periphery thereof, a fan holder attached to the heat sink and a fan secured to the heat sink via the fan holder. The fan holder includes an elastic main body, a first clip pivotally connected to a free end of the elastic main body and a second clip connected with the first clip and engaging with an opposite free end of the elastic main body. The elastic main body includes a pair of fixing portions formed at upper and lower sides thereof. The lower fixing portion of the fan holder is tightly engaged with the engaging portion of the heat sink and the upper fixing portion presses the fan towards the heat sink when the second clip is tightly locked to the opposite free end of the elastic main body.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: April 9, 2013
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei-Cheng Nie, Hong-Cheng Yang
  • Patent number: 8069908
    Abstract: An exemplary heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base having two first fixing ears at its two lateral sides, and fins on the base. An engaging notch is defined in a top end of four of the fins. The fan holder includes a top panel, and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has a pair of inserting protrusions at a bottom surface thereof. The two sidewalls have two fixing flanges at lower ends thereof. The top panel is partially placed on the front portion of the top ends of the fins, and the inserting protrusions are inserted into the engaging notches of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two fixing flanges are disposed on the two first fixing ears.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: December 6, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, He-Ping Liu
  • Patent number: 8059410
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: November 15, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, Cheng Kong, Wei-Cheng Nie
  • Patent number: 8047271
    Abstract: A heat dissipation device includes a heat sink, a fan holder, and a fan secured on a front side of the fan holder. The heat sink includes a base and fins on the base. An engaging groove is defined in top ends of the fins. The fan holder includes a top panel and two sidewalls extending downwardly from two lateral edges of the top panel. The top panel has an inserting protrusion at a bottom surface thereof. The two sidewalls have two latching legs at lower ends thereof. The top panel is partially placed on a front portion of the top ends of the fins, and the inserting protrusion is inserted into the engaging groove of the fins. The two sidewalls abut against two lateral sides of the heat sink, and the two latching legs fasten to two lateral sides of the base of the heat sink.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, He-Ping Liu
  • Patent number: 8050038
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
    Type: Grant
    Filed: July 17, 2009
    Date of Patent: November 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, Xin-Lei Liu
  • Patent number: 7990713
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
    Type: Grant
    Filed: July 10, 2009
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Xin-Lei Liu, Jin-Biao Liu, Hong-Cheng Yang, Chun-Chi Chen
  • Publication number: 20110157831
    Abstract: A locking structure for assembling a first component to a second component. The locking structure includes a nut embedded into the first component and a bolt. The nut defines a groove in a circumferential periphery thereof. The first component forms a protrusion engaging into the grove of the nut. The bolt extends through the second component and screws into the nut.
    Type: Application
    Filed: May 18, 2010
    Publication date: June 30, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-CHENG NIE, HONG-CHENG YANG
  • Publication number: 20110146949
    Abstract: An exemplary heat dissipation device includes a heat-absorbing plate, a fin unit, a heat pipe connected to the heat-absorbing plate and the fin unit, and a clip spanning over the heat-absorbing plate and resting on the heat pipe. A fastening tab and a positioning tab are formed on the heat-absorbing plate. A fastening hole and a positioning hole are defined in the clip respectively corresponding to the fastening and positioning tabs. The fastening tab is engaged in the fastening hole. The positioning tab is received in the positioning hole.
    Type: Application
    Filed: May 18, 2010
    Publication date: June 23, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: HONG-CHENG YANG, LEI CAO, JIAN GUO
  • Patent number: 7965507
    Abstract: A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs.
    Type: Grant
    Filed: May 25, 2009
    Date of Patent: June 21, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei-Cheng Nie, Hong-Cheng Yang
  • Patent number: 7924566
    Abstract: A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: April 12, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Wei-Cheng Nie, Hong-Cheng Yang
  • Patent number: 7869212
    Abstract: A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink, and a wire clip pivotally engaging with the heat sink and pressing the fan toward the heat sink. The heat sink includes a base, and a plurality of fins extending from the base. The fan includes a bracket. The clip includes a pivoting portion pivotally engaging with a fin of the heat sink, an engaging portion connecting with an end of the pivoting portion and an operating portion extending from another end of the pivoting portion. The operating portion is pressed downwardly to engage with the heat sink and to cause the engaging portion to rotate towards the fan and press the bracket of the fan toward the heat sink thereby securing the fan to the heat sink.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: January 11, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Cheng Kong, Hong-Cheng Yang
  • Patent number: 7869217
    Abstract: A locking device is used for securing a heat sink to an electronic device mounted on a first face of a printed circuit board which defines a first hole. The heat sink defines a second hole therein. The locking device has a fastener including a head portion located aside the heat sink, a foot portion located aside a second face of the printed circuit board, and a body portion extending through the holes of the heat sink and the printed circuit board and interconnecting the head portion and the foot portion. The foot portion includes a buckling part abutting against the second face of the printed circuit board, and a positioning part extending towards the head portion to a position above the buckling part. When the buckling part abuts against the printed circuit board, the positioning part has a portion thereof entering into the first hole.
    Type: Grant
    Filed: September 1, 2008
    Date of Patent: January 11, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, Jin-Biao Liu, He-Ping Liu
  • Publication number: 20100307719
    Abstract: A heat dissipation device includes a heat sink, a heat-absorbing plate with two slots defined in two lateral sides thereof, a heat pipe connecting the heat-absorbing plate and the heat sink, and a clip having an abutting portion and two locking portions extending from two ends of the abutting portion. The abutting portion presses on the heat pipe, and the locking portions insert through the slots of the heat-absorbing plate and are then bent to lock on the heat-absorbing plate to thereby secure the heat pipe on the heat-absorbing plate.
    Type: Application
    Filed: August 18, 2009
    Publication date: December 9, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: HONG-CHENG YANG, WEI-CHENG NIE, CHENG KONG
  • Publication number: 20100294463
    Abstract: A heat dissipation device includes a heat sink and a blower. The heat sink has a base and a plurality of fins formed on the base. The blower includes a frame and an impeller rotatably secured to the frame. The frame faces and is secured to the base of the heat sink to define an airflow passage between the base of the heat sink and the blower. An airflow inlet is defined through the frame of the blower. Another airflow inlet is defined through the base of the heat sink. An airflow produced by the blower passes through the airflow passage via the airflow inlets and then blows towards channels defined between the fins of the heat sink.
    Type: Application
    Filed: July 22, 2009
    Publication date: November 25, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-CHENG NIE, HONG-CHENG YANG, LEI CAO
  • Publication number: 20100258281
    Abstract: A heat dissipation device includes a heat sink forming an engaging portion along an outer periphery thereof, a fan holder attached to the heat sink and a fan secured to the heat sink via the fan holder. The fan holder includes an elastic main body, a first clip pivotally connected to a free end of the elastic main body and a second clip connected with the first clip and engaging with an opposite free end of the elastic main body. The elastic main body includes a pair of fixing portions formed at upper and lower sides thereof. The lower fixing portion of the fan holder is tightly engaged with the engaging portion of the heat sink and the upper fixing portion presses the fan towards the heat sink when the second clip is tightly locked to the opposite free end of the elastic main body.
    Type: Application
    Filed: June 11, 2009
    Publication date: October 14, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-CHENG NIE, HONG-CHENG YANG
  • Publication number: 20100258277
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. A pair of engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The clip secures the heat pipe to the top face of the heat-conducting board. The clip includes a pivoting portion which is pivotally fixed to the heat-conducting board, a clasping portion detachably engaging with the engaging portions, and a main body interconnecting the pivoting portion and the clasping portion and abutting against the heat pipe toward the heat-conducting board.
    Type: Application
    Filed: July 17, 2009
    Publication date: October 14, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, Cheng Kong, Wei-Cheng Nie
  • Publication number: 20100258282
    Abstract: A heat dissipation device includes a heat sink, a fan and two fan holders securing the fan on a top of the heat sink. Two locking parts are defined at two opposite lateral sides of the heat sink. Each fan holder includes an operating plate and a wire clip. The operating plate has first fastening parts formed at an upper edge of the operating plate and second fastening parts formed at a lower edge of the operating plate. The wire clip has a tensile part pivotally connected to the first fastening parts of the operating plate and two latching arms extending upwardly from two opposite ends of the tensile part. Upper ends of the latching arms of the wire clips are fastened to the fan. The second fastening parts of the operating plate engage with one of the two locking parts of the heat sink.
    Type: Application
    Filed: July 20, 2009
    Publication date: October 14, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHENG KONG, HONG-CHENG YANG
  • Publication number: 20100259896
    Abstract: A heat dissipation device includes a heat sink having a plurality of fins, a fan holder attached to the heat sink and a fan mounted to the heat sink via the fan holder. The fan holder includes a plurality of separated brackets located at sides of the heat sink. Each bracket includes a plurality of mounting plates engaging with the fins of the heat sink and a plurality of elastic tabs formed on two opposite ends thereof. The fan is mounted on the fan holder by engaging with the elastic tabs.
    Type: Application
    Filed: May 25, 2009
    Publication date: October 14, 2010
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEI-CHENG NIE, Hong-Cheng Yang
  • Publication number: 20100258276
    Abstract: A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a heat-conducting board attached to the electronic component, a heat pipe thermally connecting the fin unit and the heat-conducting board, and a clip disposed on the heat pipe. Two engaging portions protrude upwardly from a top face of the heat-conducting board towards each other. The heat pipe extends between the two engaging portions. The two engaging portions press two opposite ends of the clip downwardly, thereby securing the heat pipe to the top face of the heat-conducting board.
    Type: Application
    Filed: July 17, 2009
    Publication date: October 14, 2010
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Chun-Chi Chen, Hong-Cheng Yang, Xin-Lei Liu