Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

Abstract: A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensor configured to generate a signal indicative of a speed of the power source, and a controller in communication with the clutch and the sensor. The controller may be configured to vary an actuating force of the clutch based on the signal.

Abstract: A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensors configured to generate signals indicative of machine operations, and a controller in communication with the clutch and the sensors. The controller may be configured to determine the current machine application based on the signals, and vary an actuating force of the clutch based on the type of machine application.

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract: A control system for a machine is disclosed. The control system may have a power source, an operator input device configured to generate a first signal indicative of a desired mode of power source operation, and a work implement driven by the power source. The control system may also have a controller in communication with the power source and the operator input device. The controller may be configured to classify a currently performed work implement task and select an output map based on the classification of the currently performed work implement task and the first signal. The controller may further be configured to control the power source operation using the output map.

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract: A hydraulic implement system for a machine is disclosed. The hydraulic implement system may have a boom member, a boom actuator, and a boom operator control device movable to indicate a related operator desired boom member velocity. The hydraulic implement system may also have an implement pivotally connected to the boom member, an implement actuator, and an implement operator control device movable to indicated a related operator desired implement velocity. The range of the implement operator control device may be divided into a first portion and a second portion. The hydraulic implement system may also have a controller configured to selectively limit a velocity of the implement during manipulation of the implement operator control device within the first portion such that a lift velocity of the boom member of at least 65% of the desired boom member velocity is always possible.

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract: A printed circuit board is disclosed. The printed circuit board comprises a substrate having a top surface and a bottom surface. A ground plane is on the bottom surface. A signal trace is on the top surface along a first direction. At least two isolated power planes are on the top surface adjacent to opposite sides of the signal trace, respectively. A conductive connection along a second direction couples to the two power planes, across the signal trace without electrically connecting to the signal trace, wherein the signal trace doesn't pass over any split of the ground plane.

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract: An overspeed system for a vehicle is disclosed. The overspeed system may have a power source, a transmission unit, and a torque converter assembly operatively coupling the power source to the transmission unit. The overspeed system may also have a travel speed sensor configured to generate a signal indicative of a vehicle speed, and a controller in communication with the torque converter assembly and the travel speed sensor. The controller may be configured to prevent a decoupling of the torque converter assembly in response to the signal.

Abstract: A method for controlling a power-shift transmission comprising controlling a vehicle travel speed by simultaneously slipping two or more clutch packs associated with opposing directions of vehicle travel and adjusting an engine speed, according to a programmed response associated with a change in one or more of the engine speed, a torque converter slip, a selected direction of vehicle travel, and an accelerator position.

Abstract: The invention relates to leadframe semiconductor packages mounted on a heat-sink and fabrication thereof. A system in package (SiP) comprises a leadframe having extension leads, configured with divisional heat sinks serving as power and ground nets. A set of semiconductor dies is attached by adhesive on the central region of the lead frame. Pluralities of wire bonds electrically connect the set of semiconductor dies to the leadframe and to the divisional heat sinks respectively. An encapsulation encloses the leadframe, but leaves the extension leads and the divisional heat sink uncovered, exposing a heat dissipating surface.

Abstract: Apparatus and methods are provided for controlling a double-acting hydraulic cylinder during a load-induced rod-extending operation. The apparatus includes a activation circuit and valve for providing a flow path from a pump to the cylinder head end; a flow regeneration circuit and valve fluidly connecting the cylinder rod end and the cylinder head end and configured for providing flow from the rod end to the head end during rod extension; and a controller responsive to rod-extending rate demands and rod-position sensor signals, and operatively connected to the regeneration flow valve and the activation valve. The activation valve also includes a return valve part to control flow from the rod end to the fluid reservoir during rod extension. Both the activation valve and the return valve part are controllable by the controller independently from the regeneration flow valve.

Abstract: A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.

Abstract: A dual mode control system for a hydraulic circuit (200) having a variable displacement pump (216) includes at least two actuators, each controlled by a respective valve. The valves are connected in series with a pressure sensor (250) measuring a pressure of fluid between the first valve (224) and the second valve (234) and relaying a signal to the electronic controller (202). The electronic controller (202) operates in a first mode, varying the displacement of the pump (216) based on a command signal operating at least one of the valves, and operates in a standby mode, varying the displacement of the pump (216) based on the signal from the sensor, when both valves are in their respective neutral positions.

Abstract: A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads.

Abstract: A machine control system for use with a machine having a power source and a transmission is disclosed. The machine control system may have a clutch configured to connect an output of the power source with an input of the transmission. The machine control system may also have a sensors configured to generate signals indicative of machine operations, and a controller in communication with the clutch and the sensors. The controller may be configured to determine the current machine application based on the signals, and vary an actuating force of the clutch based on the type of machine application.