Abstract: An automatic nucleic acid detection system and a method thereof are disclosed. The automatic nucleic acid detection method includes: performing, by an automatic control subsystem, on a nucleic acid extraction machine platform, a nucleic acid extraction on one or more specimens in a sample tray to generate one or more corresponding nucleic acids in the sample tray; distributing, by the automatic control subsystem, on a nucleic acid distribution machine platform, the nucleic acid in each hole of the sample tray and a first reagent into a plurality of holes of a detection tray, wherein the number of holes of the detection tray is greater than that of the sample tray; and performing, by the automatic control subsystem, on a nucleic acid detection machine platform, a nucleic acid detection on the detection tray.

Abstract: A switching circuit includes a main circuit including a number of first transistors. The main circuit has a first node, a second node, and a third node and is operative in response to a control signal received by the first node, and the second node is configured to receive a supply voltage. The switching circuit also includes an auxiliary circuit electrically coupled to the second node of the main circuit and configured to provide surge protection for the main circuit. The auxiliary circuit includes a second transistor. A breakdown voltage of the second transistor is different than a breakdown voltage of each first transistor of the number of first transistors.

Abstract: An integrated circuit includes a first circuit, formed based on one or more Group III-V compound materials, that is configured to operate with a first voltage range. The integrated circuit includes a second circuit, also formed based on the one or more Group III-V compound materials, that is operatively coupled to the first circuit and configured to operate with a second voltage range, wherein the second voltage range is substantially higher than the first voltage range. The integrated circuit includes a set of first test terminals connected to the first circuit. The integrated circuit includes a set of second test terminals connected to the second circuit. Test signals applied to the set of first test terminals and to the set of second test terminals, respectively, are independent from each other.

Abstract: The present disclosure generally relates to methods and system used to collect waste fluids. A system controller is disclosed to control the operation of at least a portion of the system. The controller has a CPU. The fabrication facility includes a first processing system having fluid dispensed therein for processing a material on a part. A first drain is configured to collect the processing fluid as waste fluid after processing the part. The fabrication facility also includes a waste collection system fluidly coupled to the system drain. The waste collection system has two or more valves configured to couple the system drain and two or more facility drains. Each facility drain is uniquely coupled to one of the two or more valves. The CPU is configured to operate the valves between an open and a closed state in response to the fluid entering the system drain.

Abstract: Applications of butylidenephthalide (BP), comprising the use of BP in providing a kit for promoting differentiation of stem cells into brown adipose cells, and the use of BP in preparing a medicament, wherein the medicament is used for inhibiting the accumulation of white adipose cells, promoting the conversion of white adipose cells into brown adipose cells, inhibiting weight gain and/or reducing the content of triglycerides, glucose, and total cholesterol in blood.

Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.

Abstract: A communication method for earphones which include a first earphone and a second earphone includes: the first earphone and the second earphone synchronously monitoring data sent from an intelligent terminal in a preset time sequence and performing feedback processing according to a data receiving condition; the first earphone sending out a first response signal if receiving the data; or the first earphone sending no response signal if not receiving the data; and the second earphone sending no response signal if receiving the data or the second earphone sending a second response signal if not receiving the data. By implementing embodiments of the present disclosure, the two earphones can synchronously receive data sent from the intelligent terminal, so that the communication reliability is improved. In addition, the two earphones give responses in different manners, so that power consumption of the earphones is reduced.

Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

Abstract: A package substrate includes a substrate, an interposer and an insulating protective layer. The substrate has a first surface and a second surface opposing to the first surface. The first surface includes a plurality of first conductive pads. The interposer is disposed on the first surface of the substrate such that the first conductive pads are partially covered by the interposer. The interposer includes a plurality of penetrating conductive vias electrically connected to the substrate. The insulating protective layer is disposed on the first surface of the substrate and surrounding the interposer. The insulating protective layer includes at least one penetrating conductive column, wherein a first width of the respective penetrating conductive column is greater than a second width of each of the penetrating conductive vias of the interposer.

Abstract: The present invention discloses a mangosteen pericarp extract and process for its preparation thereof. The mangosteen pericarp extract containing ?-mangostin and ?-mangostin which obtains from preparation steps comprising fragmentation, organic solvent soaking, aqueous solution, or acidic solution soaking, concentration, spray drying and grinding steps from the rind of the mangosteen. The present invention has advantages of simple preparation process to address efficiency issue, no need to have heating under reflux in extraction steps and the solvents which used are friendly to human body and environment. The mangosteen pericarp extract (?-Xones Prime) can significantly decrease insulin resistance, and bodyweight gain induced by daily high fat diet intake. In addition, administration of the mangosteen pericarp ethanolic extract can reduce fat accumulation in the adipose and muscle tissue of rats with daily high fat diet intake.

Abstract: The present invention discloses a mangosteen pericarp extract and process for its preparation thereof. The mangosteen pericarp extract containing ?-mangostin and ?-mangostin which obtains from preparation steps comprising fragmentation, organic solvent soaking, aqueous solution, or acidic solution soaking, concentration, spray drying and grinding steps from the rind of the mangosteen. The present invention has advantages of simple preparation process to address efficiency issue, no need to have heating under reflux in extraction steps and the solvents which used are friendly to human body and environment. The mangosteen pericarp hydrophilic extract (?-Xones Aqua Choice) inhibits intracellular melanin production, and cellular tyrosinase activity. Mangosteen pericarp hydrophilic extract could be used as a cosmic composition for skin while, or even prevention of hyperpigmentation, as well as could be developed into a candidate drug composition for therapy of hyperpigmentation.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A semiconductor arrangement includes a heat source above an interconnect layer and below a heat conductor. The heat conductor is coupled to a heat sink by a thermally conductive bonding layer. Heat from the heat source is conducted through the heat conductor in a direction opposite the direction of the interconnect layer, through the thermally conductive bonding layer, and to a heat sink. The heat conductor includes an arrangement of dielectric layers, dummy metal layers, and dummy VIA layers.

Abstract: The present invention discloses a mangosteen pericarp extract and process for its preparation thereof. The mangosteen pericarp extract containing ?-mangostin and ?-mangostin which obtains from preparation steps comprising fragmentation, organic solvent soaking, aqueous solution, or acidic solution soaking, concentration, spray drying and grinding steps from the rind of the mangosteen. The present invention has advantages of simple preparation process to address efficiency issue, no need to have heating under reflux in extraction steps and the solvents which used are friendly to human body and environment.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a package structure. The package structure includes a passivation layer formed over an interconnect structure; an electrically-conductive structure formed on the passivation layer and extending through the passivation layer to electrically contact the interconnect structure; a dielectric structure formed over the passivation layer and surrounding the electrically-conductive structure to expose at least a portion of a top surface of the electrically-conductive structure; and a metallic protection structure formed on the top surface of the electrically-conductive structure exposed from the dielectric structure. The top surface of the metallic protection structure is aligned with or lower than a top surface of the dielectric structure.

Abstract: A wireless communication method for earphones includes: based on a standard communication protocol, extending a standard reception time for a communication between the master earphone and an audio source device to obtain an extended reception time, and extending a standard transmission time for the communication between the master earphone and the audio source device to obtain an extended transmission time; the master earphone wirelessly communicating with the slave earphone within the extended reception time; and the master earphone wirelessly communicating with the slave earphone within the extended transmission time. The master earphone establishes a wireless communication with the slave earphone within the extended reception time or the extended transmission time, so that the data reception reliability of the slave earphone and the communication efficiency between the master earphone and the slave earphone are improved.

Abstract: The present invention discloses a mangosteen pericarp extract and process for its preparation thereof. The mangosteen pericarp extract containing ?-mangostin and ?-mangostin which obtains from preparation steps comprising fragmentation, organic solvent soaking, aqueous solution, or acidic solution soaking, concentration, spray drying and grinding steps from the rind of the mangosteen. The present invention has advantages of simple preparation process to address efficiency issue, no need to have heating under reflux in extraction steps and the solvents which used are friendly to human body and environment.