Abstract: A sensor includes a housing having a accommodating room, a flexible plate provided in the accommodating room and moveable to induce a medium pressure change in the accommodating room, and a pressure sensing component for sensing the pressure change. The pressure sensing component and the flexible plate are assembled and moveable together. In the sensor of the present invention, after an external signal to be sensed is transmitted to the sensor, the flexible plate moves to induce air disturbances, and then the pressure sensing component receives a pressure change induced by the air disturbances and performs signal sensing. Compared with the conventional sound sensor, the sensor of the present invention provides no opening communicating with the external environment. Therefore, the impact of foreign objects, noise and other environmental factors on the sensor can be avoided, and the signal generated by the object not to be sensed can be effectively reduced.

Abstract: An integrated circuit (IC) with through-circuit vias (TCVs) and methods of forming the same are disclosed. The IC includes a semiconductor device, first and second interconnect structures disposed on first and second surfaces of the semiconductor device, respectively, first and second inter-layer dielectric (ILD) layers disposed on front and back surfaces of the substrate, respectively, and a TCV disposed within the first and second interconnect structures, the first and second ILD layers, and the substrate. The TCV is spaced apart from the semiconductor device by a portion of the substrate and portions of the first and second ILD layers. A first end of the TCV, disposed over the front surface of the substrate, is connected to a conductive line of the first interconnect structure and a second end of the TCV, disposed over the back surface of the substrate, is connected to a conductive line of the second interconnect structure.

Abstract: A communication method for earphones which include a first earphone and a second earphone includes: the first earphone and the second earphone synchronously monitoring data sent from an intelligent terminal in a preset time sequence and performing feedback processing according to a data receiving condition; the first earphone sending out a first response signal if receiving the data; or the first earphone sending no response signal if not receiving the data; and the second earphone sending no response signal if receiving the data or the second earphone sending a second response signal if not receiving the data. By implementing embodiments of the present disclosure, the two earphones can synchronously receive data sent from the intelligent terminal, so that the communication reliability is improved. In addition, the two earphones give responses in different manners, so that power consumption of the earphones is reduced.

Abstract: Disclosed are a multiplexing structure for a wireless antenna and a touch pad of a touch sensor, and a wireless wearable device. The multiplexing structure includes a radiating touch pad, a first conductor, a first circuit, a second circuit, and a frequency dividing circuit. The radiating touch pad is configured to receive and transmit an RF signal and receive a touch signal. The first conductor is electrically connected to the radiating touch pad. The first circuit is electrically connected to the radiating touch pad through the first conductor. The frequency dividing circuit is electrically connected to the second circuit and the first conductor, and is located between the second circuit and the first conductor. The multiplexing structure can separate the touch signal and the RF signal, and can solve the problem of mutual signal interference in the wireless wearable device caused by space limitation.

Abstract: An automatic nucleic acid detection system and a method thereof are disclosed. The automatic nucleic acid detection method includes: performing, by an automatic control subsystem, on a nucleic acid extraction machine platform, a nucleic acid extraction on one or more specimens in a sample tray to generate one or more corresponding nucleic acids in the sample tray; distributing, by the automatic control subsystem, on a nucleic acid distribution machine platform, the nucleic acid in each hole of the sample tray and a first reagent into a plurality of holes of a detection tray, wherein the number of holes of the detection tray is greater than that of the sample tray; and performing, by the automatic control subsystem, on a nucleic acid detection machine platform, a nucleic acid detection on the detection tray.

Abstract: A method includes determining, by a processing device, a first eco-efficiency characterization associated with a first design of manufacturing equipment based on one or more of water eco-efficiency characterization, emissions eco-efficiency characterization, or electrical energy eco-efficiency characterization. The water eco-efficiency characterization, the emissions eco-efficiency characterization, the electrical energy eco-efficiency characterization, and the first eco-efficiency characterization are associated with an amount of environmental impact generated by the manufacturing equipment per unit product produced by the manufacturing equipment. The method further includes comparing the first eco-efficiency characterization to a second eco-efficiency characterization that is associated with a second design of the manufacturing equipment.

Abstract: A package substrate includes a substrate, an interposer and an insulating protective layer. The substrate has a first surface and a second surface opposing to the first surface. The first surface includes a plurality of first conductive pads. The interposer is disposed on the first surface of the substrate such that the first conductive pads are partially covered by the interposer. The interposer includes a plurality of penetrating conductive vias electrically connected to the substrate. The insulating protective layer is disposed on the first surface of the substrate and surrounding the interposer. The insulating protective layer includes at least one penetrating conductive column, wherein a first width of the respective penetrating conductive column is greater than a second width of each of the penetrating conductive vias of the interposer.

Abstract: A wireless communication method for earphones includes: based on a standard communication protocol, extending a standard reception time for a communication between the master earphone and an audio source device to obtain an extended reception time, and extending a standard transmission time for the communication between the master earphone and the audio source device to obtain an extended transmission time; the master earphone wirelessly communicating with the slave earphone within the extended reception time; and the master earphone wirelessly communicating with the slave earphone within the extended transmission time. The master earphone establishes a wireless communication with the slave earphone within the extended reception time or the extended transmission time, so that the data reception reliability of the slave earphone and the communication efficiency between the master earphone and the slave earphone are improved.

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.

Abstract: A method includes determining, by a processing device, a first eco-efficiency characterization associated with a first design of manufacturing equipment based on one or more of water eco-efficiency characterization, emissions eco-efficiency characterization, or electrical energy eco-efficiency characterization. The water eco-efficiency characterization, the emissions eco-efficiency characterization, the electrical energy eco-efficiency characterization, and the first eco-efficiency characterization are associated with an amount of environmental impact generated by the manufacturing equipment per unit product produced by the manufacturing equipment. The method further includes comparing the first eco-efficiency characterization to a second eco-efficiency characterization that is associated with a second design of the manufacturing equipment.

Abstract: An earphone includes a housing having a sound output hole, wherein a center axis line of the sound output hole is deviated from a center axis line of the housing by an angle; a drive unit received inside the housing; and a resilient element disposed on the housing, wherein the resilient element can be squeezed and deformed, the resilient element or the housing abuts a cavum conchae of a user.

Abstract: A method for wafer point by point analysis includes receiving a selection of manufacturing equipment, utility use data, and utilization data. A water eco-efficiency characterization is calculated based on the utilization data and the utility use data. An emissions eco-efficiency characterization is calculated based on the utilization data and the utility use data. An electrical energy eco-efficiency characterization is calculated based on the utilization data and the utility use data. A combined eco-efficiency characterization is calculated based on the utilization data and water eco-efficiency characterization, emissions eco-efficiency characterization, and electrical energy eco-efficiency characterizations. The combined eco-efficiency characterization is provided for display by a graphical user interface.

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.

Abstract: A package substrate and a method of fabricating the package substrate are provided. The package substrate includes a substrate having a first surface including a plurality of conductive pads and a second surface; an insulating protective layer formed on the first surface of the substrate; an interposer embedded in and exposed from the insulating protective layer; and at least a passive component provided on the first surface of the substrate. The insulating protective layer includes at least an opening for exposing at least one of the conductive pads, and the at least the passive component is directly provided on the conductive pad exposed from the opening.