Patents by Inventor Hong-Ik Kim

Hong-Ik Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20220015245
    Abstract: A jig for processing a via hole according to an embodiment is an auxiliary member having a plate shape disposed between a processing plate in which a suction portion is disposed at a lower portion and a workpiece, wherein the auxiliary member includes a plurality of first suction holes for sucking and supporting the workpiece by suction air provided through the suction portion, and each of the plurality of first suction holes includes a first suction hole portion extending in a first direction, and a second hole portion extending in a second direction different from the first direction, wherein the first direction is perpendicular to the second direction.
    Type: Application
    Filed: November 14, 2019
    Publication date: January 13, 2022
    Inventors: Jong Heum YOON, Jee Hee LIM, Hong Ik KIM, Se Woong NA
  • Patent number: 9911605
    Abstract: A method of forming fine patterns includes forming pillars arrayed in rows and columns on an underlying layer and forming a spacer layer on the underlying layer to cover the pillars. Portions of the spacer layer respectively covering the pillars arrayed in each row or in each column are in contact with each other to provide first interstitial spaces disposed between the pillars arrayed in a diagonal direction between a row direction and a column direction as well as to provide cleavages at corners of each of the first interstitial spaces in a plan view. A healing layer is formed on the spacer layer to fill the cleavages of the first interstitial spaces. The healing layer is formed to provide second interstitial spaces respectively located in the first interstitial spaces as well as to include a polymer material.
    Type: Grant
    Filed: August 15, 2016
    Date of Patent: March 6, 2018
    Assignee: SK Hynix Inc.
    Inventors: Jung Gun Heo, Hong Ik Kim, Keun Do Ban, Cheol Kyu Bok, Young Sik Kim
  • Publication number: 20170271149
    Abstract: A method of forming fine patterns includes forming pillars arrayed in rows and columns on an underlying layer and forming a spacer layer on the underlying layer to cover the pillars. Portions of the spacer layer respectively covering the pillars arrayed in each row or in each column are in contact with each other to provide first interstitial s paces disposed between the pillars arrayed in a diagonal direction between a row direction and a column direction as well as to provide cleavages at corners of each of the first interstitial spaces in a plan view. A healing layer is formed on the spacer layer to fill the cleavages of the first interstitial spaces. The healing layer is formed to provide second interstitial spaces respectively located in the first interstitial spaces as well as to include a polymer material.
    Type: Application
    Filed: August 15, 2016
    Publication date: September 21, 2017
    Inventors: Jung Gun HEO, Hong Ik KIM, Keun Do BAN, Cheol Kyu BOK, Young Sik KIM
  • Patent number: 9691614
    Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends fro
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: June 27, 2017
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Jong Cheon Park, Jung Gun Heo, Hong Ik Kim, Cheol Kyu Bok
  • Patent number: 9666448
    Abstract: A method of forming patterns includes forming an array of pillars on an underlying layer stacked on an etch target layer, forming a separation wall layer on the pillars to provide separation walls covering sidewalls of the pillars, forming a block copolymer layer on the separation wall layer, annealing the block copolymer layer to form first domains located between the pillars, and a second domain surrounding and isolating the first domains, selectively removing the first domains to form second openings, selectively removing the pillars to form fourth openings, forming fifth openings that extend from the second and fourth openings to penetrate the underlying layer, forming a sealing pattern that covers and seals dummy openings among the fifth openings, and forming seventh openings that extend from the fifth openings exposed by the sealing pattern to penetrate the etch target layer.
    Type: Grant
    Filed: August 27, 2015
    Date of Patent: May 30, 2017
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Hong Ik Kim, Jung Gun Heo, Cheol Kyu Bok
  • Patent number: 9640399
    Abstract: A method of forming patterns includes forming a guide pattern and first peripheral patterns on an underlying layer. The guide pattern provides first openings and the first peripheral patterns provide a fifth opening used in alignment of the guide pattern. An alignment status of the guide pattern is verified using the fifth opening. A block copolymer layer is formed to fill the first and fifth openings. The block copolymer layer is annealed to provide a blocking portion sealing the fifth opening and to form first domains in each first opening and a second domain surrounding the first domains formed in each first opening. The first domains are removed to form third openings. The underlying layer is etched using the blocking portion and sidewalls of the second domains as etch barriers to form fourth openings that extend from the third openings to penetrate the underlying layer.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: May 2, 2017
    Assignee: SK Hynix Inc.
    Inventors: Jung Gun Heo, Hong Ik Kim, Keun Do Ban, Cheol Kyu Bok
  • Patent number: 9523917
    Abstract: Methods of forming patterns includes guide patterns on a neutral layer. A self-assembling block copolymer (BCP) layer on the guide patterns and the neutral layer. By annealing the self-assembling BCP layer, first polymer block domains and second polymer block domains are formed The guide patterns are formed of a developable antireflective material. The neutral layer is formed of a cross-linked polymeric material.
    Type: Grant
    Filed: April 25, 2016
    Date of Patent: December 20, 2016
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Cheol Kyu Bok, Jung Gun Heo, Hong Ik Kim
  • Publication number: 20160358771
    Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends fro
    Type: Application
    Filed: August 22, 2016
    Publication date: December 8, 2016
    Inventors: Keun Do BAN, Jong Cheon PARK, Jung Gun HEO, Hong Ik KIM, Cheol Kyu BOK
  • Publication number: 20160293442
    Abstract: A method of forming patterns includes forming an array of pillars on an underlying layer stacked on an etch target layer, forming a separation wall layer on the pillars to provide separation walls covering sidewalls of the pillars, forming a block copolymer layer on the separation wall layer, annealing the block copolymer layer to form first domains located between the pillars, and a second domain surrounding and isolating the first domains, selectively removing the first domains to form second openings, selectively removing the pillars to form fourth openings, forming fifth openings that extend from the second and fourth openings to penetrate the underlying layer, forming a sealing pattern that covers and seals dummy openings among the fifth openings, and forming seventh openings that extend from the fifth openings exposed by the sealing pattern to penetrate the etch target layer.
    Type: Application
    Filed: August 27, 2015
    Publication date: October 6, 2016
    Inventors: Keun Do BAN, Hong Ik KIM, Jung Gun HEO, Cheol Kyu BOK
  • Publication number: 20160293443
    Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends fro
    Type: Application
    Filed: September 10, 2015
    Publication date: October 6, 2016
    Inventors: Keun Do BAN, Jong Cheon PARK, Jung Gun HEO, Hong Ik KIM, Cheol Kyu BOK
  • Patent number: 9449840
    Abstract: A method includes forming a template portion to provide a first opening trench portion surrounding a first isolated pattern, and forming an array of pillars on an underlying layer; forming a separation wall layer including first separation wall portions surrounding sidewalls of the pillars, and forming second separation wall portions covering sidewalls of the first opening trench portion; forming a block copolymer layer on the separation wall layer; forming first domains in gaps between the pillars, and forming second domains surrounding and separating the first domains by annealing the block copolymer layer; forming second openings by selectively removing the first domains; forming third openings between the second openings, and forming a fourth opening adjacent to the first isolated pattern by selectively removing the pillars and the template portion; and forming fifth openings, which extend from the second and third openings and penetrate the underlying layer, and forming a sixth opening, which extends fro
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: September 20, 2016
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Jong Cheon Park, Jung Gun Heo, Hong Ik Kim, Cheol Kyu Bok
  • Publication number: 20160254154
    Abstract: A method of forming patterns includes forming a guide pattern and first peripheral patterns on an underlying layer. The guide pattern provides first openings and the first peripheral patterns provide a fifth opening used in alignment of the guide pattern. An alignment status of the guide pattern is verified using the fifth opening. A block copolymer layer is formed to fill the first and fifth openings. The block copolymer layer is annealed to provide a blocking portion sealing the fifth opening and to form first domains in each first opening and a second domain surrounding the first domains formed in each first opening. The first domains are removed to form third openings. The underlying layer is etched using the blocking portion and sidewalls of the second domains as etch barriers to form fourth openings that extend from the third openings to penetrate the underlying layer.
    Type: Application
    Filed: August 11, 2015
    Publication date: September 1, 2016
    Inventors: Jung Gun HEO, Hong Ik KIM, Keun Do BAN, Cheol Kyu BOK
  • Publication number: 20160238938
    Abstract: Methods of forming patterns includes guide patterns on a neutral layer. A self-assembling block copolymer (BCP) layer on the guide patterns and the neutral layer. By annealing the self-assembling BCP layer, first polymer block domains and second polymer block domains are formed The guide patterns are formed of a developable antireflective material. The neutral layer is formed of a cross-linked polymeric material.
    Type: Application
    Filed: April 25, 2016
    Publication date: August 18, 2016
    Inventors: Keun Do BAN, Cheol Kyu BOK, Jung Gun HEO, Hong Ik KIM
  • Patent number: 9354519
    Abstract: A method of forming patterns includes: forming guide patterns on an underlying layer, forming a self-assembling block copolymer (BCP) layer on the guide patterns and the underlying layer, annealing the self-assembling BCP layer to form first polymer block domains and second polymer block domains which are alternately and repeatedly arrayed, and selectively removing the first polymer block domains. The guide patterns are formed of a developable antireflective material. In addition, the guide patterns are spaced apart from each other such that a width of each of the guide patterns is less than a distance between the guide patterns.
    Type: Grant
    Filed: February 12, 2015
    Date of Patent: May 31, 2016
    Assignee: SK Hynix Inc.
    Inventors: Keun Do Ban, Cheol Kyu Bok, Jung Gun Heo, Hong Ik Kim
  • Publication number: 20160077435
    Abstract: A method of forming patterns includes: forming guide patterns on an underlying layer, forming a self-assembling block copolymer (BCP) layer on the guide patterns and the underlying layer, annealing the self-assembling BCP layer to form first polymer block domains and second polymer block domains which are alternately and repeatedly arrayed, and selectively removing the first polymer block domains. The guide patterns are formed of a developable antireflective material. In addition, the guide patterns are spaced apart from each other such that a width of each of the guide patterns is less than a distance between the guide patterns.
    Type: Application
    Filed: February 12, 2015
    Publication date: March 17, 2016
    Inventors: Keun Do BAN, Cheol Kyu BOK, Jung Gun HEO, Hong Ik KIM
  • Patent number: 8161507
    Abstract: A channel-switching apparatus and method in a digital broadcasting system omits conditional access control in logical channel-switching in one physical channel from processes that are executed for channel-switching in a digital broadcasting system, thereby reducing channel-switching time.
    Type: Grant
    Filed: May 30, 2006
    Date of Patent: April 17, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-Jin Shin, Sung-Kwon Park, Hong-Ik Kim, Tae-Woong Kim, Su-Kyung Kim, Joon-Soon Im
  • Patent number: 8034606
    Abstract: Disclosed are a novel tactic acid bacterium, Lactobacillus sakei Probio-65, and the use thereof. The L. sakei Probio-65 strain has acid tolerance, bile acid tolerance and antibiotic resistance, inhibits the growth of harmful pathogenic microorganisms in the body and the intestine of animals, and has immunuenhancing activity. In particular, the novel strain inhibits the growth of Staphylocccus aureus, which is known to be a factor aggravating atopic dermatitis. Thus, the novel strain is useful for preventing or treating atopic dermatitis and allergy-related disorders. Also, the novel strain stabilizes intestinal microflors by inhibiting the abnormal proliferation of harmful microorganisms in the intestine. The L. sakei Probio-65 strain or a culture thereof is useful in pharmaceutical, feed, food, and cosmetic compositions.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: October 11, 2011
    Assignee: Probionic Inc.
    Inventors: Yong Ha Park, In-seon Lee, Hong-ik Kim, Kook-hee Kang
  • Publication number: 20110102347
    Abstract: A display filter having a touch input function includes a base substrate, a conductive film coating layer formed on the base substrate, and a touch sheet. The touch sheet and the conductive film coating layer are arranged with an air gap therebetween, and are in contact with each other in response to a touch pressure. A first electrode is formed on a surface of the touch sheet that faces the conductive film coating layer. The first electrode includes a first electrode part to which a first input voltage is applied to generate potential distribution in the x direction, and a second electrode part to which a second input voltage is applied to generate potential distribution in the y direction. A second electrode is formed on the periphery of the conductive film coating layer, and allows electrical current to flow through when the touch sheet is in contact with the conductive film coating layer.
    Type: Application
    Filed: October 29, 2010
    Publication date: May 5, 2011
    Inventors: Jin Sung LIM, Dae Chul Park, Hong Ik Kim, Shin Wook Kim, Ho Woo Kim
  • Patent number: 7932546
    Abstract: The method for manufacturing a CMOS image sensor is employed to prevent bridge phenomenon between adjacent microlenses by employing openings between the microlenses. The method includes the steps of: preparing a semiconductor substrate including isolation regions and photodiodes therein obtained by a predetermined process; forming an interlayer dielectric (ILD), metal interconnections and a passivation layer formed on the semiconductor substrate in sequence; forming a color filter array having a plurality of color filters on the passivation layer; forming an over-coating layer (OCL) on the color filter array by using a positive photoresist or a negative photoresist; forming openings in the OCL by patterning the OCL by using a predetermined mask; and forming dome-typed microlenses on a patterned OCL.
    Type: Grant
    Filed: October 27, 2009
    Date of Patent: April 26, 2011
    Assignee: Crosstek Capital, LLC
    Inventors: Chang-Young Jeong, Dai-Ung Shin, Hong-Ik Kim