Abstract: A memory device includes a memory cell array including a plurality of memory cells, each including a bidirectional variable resistance element and an input/output circuit configured to determine a polarity for a read voltage to be applied to a selected memory cell among the plurality of memory cells and to apply the read voltage with the determined polarity to the selected memory cell. The input/output circuit may include a polarity determination circuit configured to determine the polarity responsive to a determination mode signal and a driver circuit configured to apply the read voltage with the determined polarity to the selected memory cell.

Abstract: A semiconductor memory device includes at least one memory cell block and at least one connection unit. The at least one memory cell block has a first region including at least one first memory cell connected to a first bit line, and a second region including at least one second memory cell connected to a second bit line. The at least one connection unit is configured to selectively connect the first bit line to a corresponding bit line sense amplifier based on a first control signal, and configured to selectively connect the second bit line to the corresponding bit line sense amplifier via a corresponding global bit line based on a second control signal.

Abstract: A memory module can include a plurality of dynamic memory devices that each can include a dynamic memory cell array with respective regions therein, where the plurality of dynamic memory devices can be configured to operate the respective regions responsive to a command. A DRAM management unit can be on the module and coupled to the plurality of dynamic memory devices, and can include a memory device operational parameter storage circuit that is configured to store memory device operational parameters for the respective regions to affect operation of the respective regions responsive to the command.

Abstract: A resistive memory device and method of initialization are provided. The resistive memory device includes a first group of resistive memory cells connected between bit lines and a first plate and a second group connected between bit lines and a second plate. First and second initialization voltages are respectively applied to the first and second plates outside a normal path associated with a normal operation of the resistive memory cells.

Abstract: A semiconductor memory device includes a memory cell and a first reference memory cell. The memory cell includes a first switching element and a first capacitor for storing data. The first switching element is controlled by a first wordline, and has a first terminal connected to a first terminal of the first capacitor and a second terminal connected to a first bitline. The first capacitor has a second terminal for receiving a first plate voltage. The first reference memory cell includes a first reference switching element and a first capacitor. The first switching element is controlled by a first reference wordline, and has a first terminal connected to a first terminal of the first reference capacitor and a second terminal connected to a second bitline. The first reference capacitor has a second terminal receiving a first reference plate voltage different from the first plate voltage.

Abstract: A resistive memory device comprises a memory cell array comprising a plurality of memory units. The memory device performs a refresh read operation to check a condition of each of the memory units. Then, it determines whether to refresh each memory unit based on data read by performing the refresh read operation, and refreshes the memory unit according to a result of the determination. The refresh read operation uses a reference resistance with a smaller margin from a resistance distribution than a normal read operation.

Abstract: Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion.

Abstract: Provided is a semiconductor resistive memory device. The resistive memory device includes a plurality of unit cells. A source line and a data input/output line of the unit cells may be selectively connected to have a substantially same voltage level for equalization when the unit cells are in inactive or unselected state. The equalization may decrease current consumption and protect write error, and protect leakage current.

Abstract: A semiconductor memory device including a plurality of layers each including a memory cell array and which are stacked over each other; and at least one power plane for supplying power to the layers. The power plane includes a region to which a power voltage is applied and a region to which a ground voltage is applied.

Abstract: Semiconductor memory devices include a first storage layer and a second storage layer, each of which includes at least one array, and a control layer for controlling access to the first storage layer and the second storage layer so as to write data to or read data from the array included in the first storage layer or the second storage layer in correspondence to a control signal. A memory capacity of the array included in the first storage layer is different from a memory capacity of the array included in the second storage layer.

Abstract: A semiconductor memory device having a 3D stacked structure includes: a first semiconductor area with a stacked structure of a first layer having first data and a second layer having second data; a first line for delivering an access signal for accessing the first semiconductor area; and a second line for outputting the first and/or second data from the first semiconductor area, wherein access timings of accessing the first and second layers are controlled so that a first time delay from the delivery of the access signal to the first layer to the output of the first data is substantially identical to a second time delay from the delivery of the access signal to the second layer to the output of the second data, thereby compensating for skew according to an inter-layer timing delay and thus performing a normal operation. Accordingly, the advantage of high-integration according to a stacked structure can be maximized by satisfying data input/output within a predetermined standard.

Abstract: A stacked semiconductor memory device comprises a semiconductor substrate having a functional circuit, a plurality of memory cell array layers, and at least one connection layer. The memory cell array layers are stacked above the semiconductor substrate. The connection layers are stacked above the semiconductor substrate independent of the memory cell array layers. The connection layers electrically connect memory cell selecting lines arranged on the memory cell array layers to the functional circuit.

Abstract: A stacked semiconductor memory device comprises memory cell array layers that are stacked in an inverted wedge shape and have different redundancy sizes from each other. The stacked semiconductor memory device has space for vertical connection between layers, a relatively small size, and a relatively high yield.

Abstract: A stacked semiconductor memory device comprises an error correction code (ECC) controller that controls the number of bits in an ECC word and corrects errors in memory cell array layers using the ECC word.

Abstract: A memory core and method thereof are provided. The example memory core may include an edge sub-array including a plurality of word lines, a plurality of bit lines, and a plurality of dummy bit lines, a sense amplifier circuit configured to amplify voltages of the plurality of dummy bit lines and a switching circuit configured to transfer at least one input data through the plurality of dummy bit lines, in response to at least one column select signal. The example method may include generating test input data in response to a test enable signal and a write signal, transferring the test input data to a plurality of dummy bit lines, in response to at least one column select signal and amplifying the test input data transferred to the plurality of dummy bit lines.

Abstract: A full-stress testable memory device having an open bit line architecture and a method of testing the memory device. The memory device of the invention includes dummy bit lines, and a voltage controller connected to the dummy bit lines. The voltage controller alternately provides a first variable control voltage and a second variable control voltage to the dummy bit lines during a test mode. In accordance with a method of testing the memory device, a fixed voltage is provided to the dummy bit lines of the edge sub-arrays during a normal operation mode. However, during a test mode, the fixed voltage being applied to the dummy bit line is replaced with a supply voltage and/or a ground voltage, so that all of the sub-arrays can be equally tested.

Abstract: Apparatus and methods are provided for repairing semiconductor memory devices having an open bit line sense amplifier architecture with cell array blocks having memory blocks formed of edge sub-blocks, main sub-blocks, dummy sub-blocks. Row defects can be processed using a straight edge block when DQ data are outputted by enabling three word lines such that a repair process for the memory device in an edge sub-block or a dummy sub-block has the same repair efficiency as that of a case where defects occur in a main sub-block.

Abstract: A memory core and method thereof are provided. The example memory core may include an edge sub-array including a plurality of word lines, a plurality of bit lines, and a plurality of dummy bit lines, a sense amplifier circuit configured to amplify voltages of the plurality of dummy bit lines and a switching circuit configured to transfer at least one input data through the plurality of dummy bit lines, in response to at least one column select signal. The example method may include generating test input data in response to a test enable signal and a write signal, transferring the test input data to a plurality of dummy bit lines, in response to at least one column select signal and amplifying the test input data transferred to the plurality of dummy bit lines.

Abstract: A full-stress testable memory device having an open bit line architecture and a method of testing the memory device. The memory device of the invention includes dummy bit lines, and a voltage controller connected to the dummy bit lines. The voltage controller alternately provides a first variable control voltage and a second variable control voltage to the dummy bit lines during a test mode. In accordance with a method of testing the memory device, a fixed voltage is provided to the dummy bit lines of the edge sub-arrays during a normal operation mode. However, during a test mode, the fixed voltage being applied to the dummy bit line is replaced with a supply voltage and/or a ground voltage, so that all of the sub-arrays can be equally tested.

Abstract: Apparatus and methods are provided for repairing semiconductor memory devices having an open bit line sense amplifier architecture with cell array blocks having memory blocks formed of edge sub-blocks, main sub-blocks, dummy sub-blocks. Row defects can be processed using a straight edge block when DQ data are outputted by enabling three word lines such that a repair process for the memory device in an edge sub-block or a dummy sub-block has the same repair efficiency as that of a case where defects occur in a main sub-block.