Patents by Inventor Hong Xie
Hong Xie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10135098Abstract: The present invention provides a method for dynamically adjusting battery undervoltage protection, including: real time acquiring a current operation environment temperature value of a battery; real time selecting a preset undervoltage protection voltage and a preset undervoltage protection delay time according to the temperature value; real time determining whether an output voltage of the battery is less than the undervoltage protection voltage; if yes, then: determining whether a time interval when the output voltage of the battery is less than the undervoltage protection voltage satisfies the undervoltage protection delay time, if yes, then: enabling the battery undervoltage protection. The present invention is capable of performing a flexible battery undervoltage protection according to a current operation environment temperature of the battery. The present invention also provides a system for dynamically adjusting battery undervoltage protection.Type: GrantFiled: July 1, 2016Date of Patent: November 20, 2018Assignee: Dongguan NVT Technology Co., Ltd.Inventors: Hong Xie, Guanghui Chen
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Publication number: 20180327832Abstract: An example of a method includes providing a substrate with an exposed surface comprising a first chemical group, wherein the providing optionally comprises modifying the exposed surface of the substrate to incorporate the first chemical group; reacting the first chemical group with a first reactive group of a functionalized polymer molecule to form a functionalized polymer coating layer covalently bound to the exposed surface of the substrate; grafting a primer to the functionalized polymer coating layer by reacting the primer with a second reactive group of the functionalized polymer coating layer; and forming a water-soluble protective coating on the primer and the functionalized polymer coating layer. Examples of flow cells incorporating examples of the water-soluble protective coating are also disclosed herein.Type: ApplicationFiled: May 2, 2018Publication date: November 15, 2018Inventors: Sean M. Ramirez, Brian D. Mather, Edwin Li, Sojeong Moon, Innsu Daniel Kim, Alexandre Richez, Ludovic Vincent, Xavier von Hatten, Hai Quang Tran, Maxwell Zimmerley, Julia Morrison, Gianluca Andrea Artioli, Krystal Sly, Hayden Black, Lewis J. Kraft, Hong Xie, Wei Wei, Ryan Sanford
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Patent number: 10112997Abstract: Agents that specifically bind TIGIT are disclosed. The TIGIT-binding agents may include polypeptides, antibodies, and/or bispecific agents. Also disclosed are methods of using the agents for enhancing the immune response and/or treatment of diseases such as cancer.Type: GrantFiled: May 27, 2016Date of Patent: October 30, 2018Assignee: ONCOMED PHARMACEUTICALS, INC.Inventors: Austin L. Gurney, Ming-Hong Xie
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Patent number: 10044115Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.Type: GrantFiled: December 23, 2015Date of Patent: August 7, 2018Assignee: Intel CorporationInventors: Donald T. Tran, Gregorio Murtagian, Kuang Liu, Srikant Nekkanty, Feroz Mohammad, Karumbu Meyyappan, Hong Xie, Russell S. Aoki, Gaurav Chawla
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Publication number: 20180207626Abstract: The present disclosure relates generally processes and systems for converting a mixture of light hydrocarbons to liquid transportation fuels by first cracking the light hydrocarbons to an intermediate comprising olefins, which is converted by contacting with a catalyst comprising at least one zeolite in two separate conversion stages with an intervening recovery of liquid product. The first stage conversion favors oligomerization of larger olefins to form diesel range products that are collected prior to directing unconverted smaller olefins to be oligomerized in a second stage conversion conducted at a higher temperature and lower pressure.Type: ApplicationFiled: January 15, 2018Publication date: July 26, 2018Applicant: PHILLIPS 66 COMPANYInventors: Jianhua YAO, Hong XIE, Bruce B. RANDOLPH, Steven E. LUSK, Dhananjay B. GHONASGI, Jonathan R. MARDA
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Publication number: 20180208861Abstract: The present disclosure relates generally processes and systems for converting a mixture of light hydrocarbons to liquid transportation fuels by first cracking the light hydrocarbons to an intermediate comprising olefins, which is converted by contacting with a catalyst comprising at least one zeolite in two separate conversion stages with an intervening recovery of liquid product. The first stage conversion favors oligomerization of larger olefins to form diesel range products that are collected prior to directing unconverted smaller olefins to be oligomerized in a second stage conversion conducted at a higher temperature and lower pressure.Type: ApplicationFiled: January 15, 2018Publication date: July 26, 2018Applicant: PHILLIPS 66 COMPANYInventors: Jianhua YAO, Hong XIE, Bruce B. RANDOLPH, Steven E. LUSK, Dhananjay B. GHONASGI, Jonathan R. MARDA
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Patent number: 10017878Abstract: The present invention provides a growth method of grapheme, which at least comprises the following steps: S1: providing an insulating substrate, placing the insulating substrate in a growth chamber; S2: heating the insulating substrate to a preset temperature, and introducing a gas containing catalytic element into the growth chamber; S3: feeding carbon source into the growth chamber and growing a graphene thin film on the insulating substrate. The present invention adopts a catalytic manner of introducing catalytic element, and rapid grows a high quality graphene on the insulating substrate, which avoids the transition process of the graphene, enables to improve the production yield of the graphene, reduces the growth cost of the graphene, and thus the mass production can be facilitated. The graphene grown by the present invention may be applied in the field of novel graphene electronic devices, graphene transparent conducting film, transparent conducting coating and the like.Type: GrantFiled: March 26, 2015Date of Patent: July 10, 2018Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCESInventors: Haomin Wang, Shujie Tang, Guangyuan Lu, Tianru Wu, Da Jiang, Guqiao Ding, Xuefu Zhang, Hong Xie, Xiaoming Xie, Mianheng Jiang
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Publication number: 20180192519Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 27, 2017Publication date: July 5, 2018Inventors: Fay HUA, Hong XIE, Gregorio R. MURTAGIAN, Amit ABRAHAM, Alan C. MCALLISTER, Ting ZHONG
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Patent number: 10001442Abstract: An optical probe includes an optical fiber with a first end and a second end, and an enhanced surface on a portion of the first end of the optical fiber. The enhanced surface includes a patterned base layer including multiple protruding nano-pyramids, an intermediate layer over the patterned base layer, and a graphene layer over the intermediate layer. Using a layer of graphene to cover the enhanced surface increases the sensitivity of a surface-enhanced Raman spectroscopy (SERS) process performed in conjunction with the enhanced surface, and further increases the chemical stability and bio-compatibility of the enhanced surface. Further, placing the enhanced surface at the end of the optical fiber provides a self-contained probe for use with a SERS process, thereby allowing for in-vivo characterization of a sample.Type: GrantFiled: June 13, 2014Date of Patent: June 19, 2018Assignee: The Regents of the University of CaliforniaInventors: Ya-Hong Xie, Pu Wang
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Publication number: 20180002831Abstract: The present invention provides a growth method of grapheme, which at least comprises the following steps: S1: providing an insulating substrate, placing the insulating substrate in a growth chamber; S2: heating the insulating substrate to a preset temperature, and introducing a gas containing catalytic element into the growth chamber; S3: feeding carbon source into the growth chamber and growing a graphene thin film on the insulating substrate. The present invention adopts a catalytic manner of introducing catalytic element, and rapid grows a high quality graphene on the insulating substrate, which avoids the transition process of the graphene, enables to improve the production yield of the graphene, reduces the growth cost of the graphene, and thus the mass production can be facilitated. The graphene grown by the present invention may be applied in the field of novel graphene electronic devices, graphene transparent conducting film, transparent conducting coating and the like.Type: ApplicationFiled: March 26, 2015Publication date: January 4, 2018Applicant: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCESInventors: HAOMIN WANG, SHUJIE TANG, GUANGYUAN LU, TIANRU WU, DA JIANG, GUQIAO DING, XUEFU ZHANG, HONG XIE, XIAOMING XIE, MIANHENG JIANG
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Patent number: 9860988Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.Type: GrantFiled: December 20, 2014Date of Patent: January 2, 2018Assignee: Intel CorporationInventors: Fay Hua, Hong Xie, Gregorio R. Murtagian, Amit Abraham, Alan C. Mcallister, Ting Zhong
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Publication number: 20170287873Abstract: An IC package, an electronic assembly, and methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly are shown. An IC package including an adhesive disposed at or near at least one of four corners of a die of the IC package is shown. An electronic assembly including an IC package that includes an adhesive disposed at or near at least one of four corners of a second surface of a first substrate is shown. Methods of preventing warpage of components of an electronic assembly during fabrication of the electronic assembly that include applying an adhesive to at least one of four corners of a first surface of a first component are shown.Type: ApplicationFiled: March 29, 2016Publication date: October 5, 2017Inventors: Santosh Sankarasubramanian, Hong Xie, Nachiket R. Raravikar, Steven A. Klein, Pramod Malatkar
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Publication number: 20170267758Abstract: Binding agents that modulate the immune response are disclosed. The binding agents may include antibodies, soluble receptors, and/or polypeptides. Also disclosed are methods of using the binding agents for the treatment of diseases such as cancer.Type: ApplicationFiled: May 13, 2015Publication date: September 21, 2017Applicant: ONCOMED PHARMACEUTICALS, INC.Inventors: Austin L. GURNEY, Ming-hong XIE, James Gordon PORTER
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Publication number: 20170250450Abstract: The present invention provides a method for dynamically adjusting battery undervoltage protection, including: real time acquiring a current operation environment temperature value of a battery; real time selecting a preset undervoltage protection voltage and a preset undervoltage protection delay time according to the temperature value; real time determining whether an output voltage of the battery is less than the undervoltage protection voltage; if yes, then: determining whether a time interval when the output voltage of the battery is less than the undervoltage protection voltage satisfies the undervoltage protection delay time, if yes, then: enabling the battery undervoltage protection. The present invention is capable of performing a flexible battery undervoltage protection according to a current operation environment temperature of the battery. The present invention also provides a system for dynamically adjusting battery undervoltage protection.Type: ApplicationFiled: July 1, 2016Publication date: August 31, 2017Applicant: Dongguan NVT Technology Co., LTD.Inventors: Hong XIE, Guanghui CHEN
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Publication number: 20170187147Abstract: An apparatus comprises a cable connector including: a first connector body portion including a first plurality of electrical contacts arranged to contact electrical contacts of a first surface of an edge connector substrate; a second connector body portion separate from the first connector body portion and including a second plurality of electrical contacts arranged to oppose the first plurality of electrical contacts of the first connector body portion and to contact electrical contacts of a second surface of the edge connector substrate, wherein the first and second plurality of electrical contacts are electrically coupled to one or more cables; and a joining mechanism configured to join the first connector body portion and the second connector body portion together and to apply a bias force to the edge connector substrate when the edge connector substrate is arranged between the first connector body portion and the second connector body portion.Type: ApplicationFiled: December 23, 2015Publication date: June 29, 2017Inventors: Donald T. Tran, Gregorio Murtagian, Kuang Liu, Srikant Nekkanty, Feroz Mohammad, Karumbu Meyyappan, Hong Xie, Russell S. Aoki, Gaurav Chawla
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Publication number: 20170044268Abstract: The present invention provides agents, such as soluble receptors, antibodies, and small molecules that modulate the immune response. In some embodiments, the agents activate or increase the immune response to cancer and/or a tumor. In some embodiments, the agents inhibit or suppress the immune response to cancer and/or a tumor. The invention also provides compositions, such as pharmaceutical compositions, comprising the agents. The invention further provides methods of administering the agents so a subject in need thereof. In some embodiments, the invention provides methods of using the agents for cancer immunotherapy. In some embodiments, the invention provides methods of using the agents for treatment of autoimmune diseases.Type: ApplicationFiled: December 22, 2014Publication date: February 16, 2017Applicant: ONCOMED PHARMACEUTICALSInventors: Austin L. GURNEY, Ming-Hong XIE, Julie Michelle RODA
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Patent number: 9570294Abstract: A preparation method of a graphene nanoribbon on h-BN, comprising: 1) forming a h-BN groove template with a nano ribbon-shaped groove structure on the h-BN by adopting a metal catalysis etching method; 2) growing a graphene nanoribbon in the h-BN groove template by adopting a chemical vapor deposition method. In the present invention, a CVD method is adopted to directly prepare a morphology controllable graphene nanoribbon on the h-BN, which helps to solve the long-term critical problem that the graphene is difficult to nucleate and grow on an insulating substrate, and to avoid the series of problems introduced by the complicated processes of the transferring of the graphene and the subsequent clipping manufacturing for a nanoribbon and the like.Type: GrantFiled: July 20, 2015Date of Patent: February 14, 2017Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY, CHINESE ACADEMY OF SCIENCESInventors: Haomin Wang, Li He, Lingxiu Chen, Hong Xie, Huishan Wang, Shujie Tang, Lei Li, Daoli Zhang, Xiaoming Xie, Mianheng Jiang
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Publication number: 20160376365Abstract: Agents that specifically bind TIGIT are disclosed. The TIGIT-binding agents may include polypeptides, antibodies, and/or bispecific agents. Also disclosed are methods of using the agents for enhancing the immune response and/or treatment of diseases such as cancer.Type: ApplicationFiled: May 27, 2016Publication date: December 29, 2016Applicant: OncoMed Pharmaceuticals, Inc.Inventors: Austin L. Gurney, Ming-Hong Xie
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Publication number: 20160338199Abstract: Embodiments of the present disclosure are directed towards techniques and configurations to provide solder contacts for electrical connection in socket assemblies. In one embodiment, a solder contact may be disposed on the bottom surface of a die package such that the solder contact is conductively coupled to electrical contacts of the die package. The solder contacts may be disposed to be coupled to pins of a socket assembly, to provide conductive coupling of the electrical contacts of the die package and the pins of the socket assembly. The solder may be selected to be sufficiently soft to provide for better electrical conduction. The pins may also be configured to penetrate the solder contact to provide for better electrical conduction. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 20, 2014Publication date: November 17, 2016Inventors: Fay HUA, Hong XIE, Gregorio R. MURTAGIAN, Amit ABRAHAM, Alan C. MCALLISTER, Ting ZHONG
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Publication number: 20160328617Abstract: A protection method includes controlling a camera unit to acquire video and/or image information surrounding the electronic device and controlling a positioning unit to acquire location information of the electronic device in response to an operation input via a triggering unit; acquiring the video and/or image information surrounding the electronic device from the camera unit and acquiring the location information of the electronic device from the positioning unit; and sending the acquired video and/or image information surrounding the electronic device and the location information of the electronic device to a contact person designated by a user via a communication unit.Type: ApplicationFiled: September 2, 2015Publication date: November 10, 2016Inventors: QIU-HONG XIE, YAO-CHANG LAN, FU-YEN HSIEH