Patents by Inventor Hongwen Zhang
Hongwen Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145022Abstract: A memory is provided. The memory includes: a storage array that includes multiple bit lines, each of the multiple bit lines is connected to multiple storage cells in the storage array; multiple column select signal units that are connected to sensitive amplifiers, the sensitive amplifiers and the multiple bit lines are disposed in one-to-one correspondence; local data buses that are divided into local data buses O and local data buses E, adjacent bit lines are electrically connected to a respective local data bus O and a respective local data bus E, respectively, through a respective sensitive amplifier and a respective column select signal unit; and a first error checking and correcting unit and a second error checking and correcting unit that are configured to check and correct errors of data.Type: ApplicationFiled: December 22, 2023Publication date: May 2, 2024Inventors: Weibing SHANG, Hongwen Li, Liang Zhang, Kangling Ji, Sungsoo Chi, Daoxun Wu, Ying Wang
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Patent number: 11966672Abstract: A method and a system for simulating contact and interaction between a support member and a chamber surrounding rock mass are provided in the application.Type: GrantFiled: July 14, 2023Date of Patent: April 23, 2024Assignee: China University of Mining and TechnologyInventors: Qian Yin, Jiangyu Wu, Hongwen Jing, Zheng Jiang, Tianci Deng, Hai Pu, Qiang Zhang, Bo Meng
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Patent number: 11929464Abstract: The present disclosure relates to a conveying roller for conveying a cell pole piece, the cell pole piece comprising a main body and pole tabs, the main body comprising a bearing area and a transition area, each of the pole tabs comprising a root portion connected to the transition area, a middle section and a top portion, and the conveying roller comprising: a central axis, a first end face and a second end face disposed opposite to each other along the central axis, a transmission portion and an avoidance position provided between the first end face and the second end face, wherein the transmission portion is rotatable around the central axis, the bearing area is contactable with the transmission portion, so that the transmission portion applies a transmission friction force to the cell pole piece, and the avoidance position is capable of avoiding the transition area and the pole tabs.Type: GrantFiled: October 12, 2019Date of Patent: March 12, 2024Assignee: Contemporary Amperex Technology Co., LimitedInventors: Yiruo Wang, Xiaowei Zhang, Hongwen Chang, Xiao Wang, Peichao Wang, Xi Chen
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Patent number: 11752579Abstract: High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.Type: GrantFiled: February 26, 2020Date of Patent: September 12, 2023Assignee: INDIUM CORPORATIONInventors: Jie Geng, Hongwen Zhang, Ning-Cheng Lee
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Patent number: 11738411Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.Type: GrantFiled: April 29, 2021Date of Patent: August 29, 2023Assignee: INDIUM CORPORATIONInventors: Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee
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Patent number: 11712762Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.Type: GrantFiled: March 7, 2022Date of Patent: August 1, 2023Assignee: INDIUM CORPORATIONInventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
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Publication number: 20220395936Abstract: Some implementations of the disclosure describe a solder paste consisting essentially of: 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of a Sn—Sb alloy, a Sn—Ag—Cu—Sb alloy, a Sn—Ag—Cu—Sb—In alloy, a Sn—Ag—Cu—Sb—Bi alloy, or Sn—Ag—Cu—Sb—Bi—In alloy; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn—Ag—Cu alloy or Sn—Ag—Cu—Bi alloy, and the second solder alloy powder having a lower solidus temperature than the first solder alloy powder; and flux.Type: ApplicationFiled: June 7, 2022Publication date: December 15, 2022Inventors: Jie Geng, Hongwen Zhang
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Publication number: 20220362890Abstract: Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnIn solder alloys. A SnIn solder alloy may consist of: 8 to 20 wt % In; greater than 0 wt % to 4 wt % Ag; optionally, one or more of greater than 0 wt % to 5 wt % Sb, greater than 0 wt % to 3 wt % Cu, greater than 0 wt % to 2.5 wt % Zn, greater than 0 wt % to 1.5 wt % Ni, greater than 0 wt % to 1.5 wt % Co, greater than 0 wt % to 1.5 wt % Ge, greater than 0 wt % to 1.5 wt % P, and greater than 0 wt % to 1.5 wt % Mn; and a remainder of Sn.Type: ApplicationFiled: July 29, 2022Publication date: November 17, 2022Inventors: Francis M. Mutuku, Ning-Cheng Lee, Hongwen Zhang
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Patent number: 11436745Abstract: A reconstruction method of a three-dimensional (3D) human body model includes: acquiring, by a fully convolutional network (FCN) module, a global UVI map and a local UVI map of a body part according to a human body image (S1); estimating, by a first neural network, a camera parameter and a shape parameter of the human body model based on the global UVI map (S2); extracting, by a second neural network, rotation features of joints of a human body based on the local UVI map (S3); refining, by using a position-aided feature refinement strategy, the rotation features of the joints of the human body to acquire refined rotation features (S4); and estimating, by a third neural network, a pose parameter of the human body model based on the refined rotation features (S5). The reconstruction method achieves accurate and efficient reconstruction of the human body model, and improves robustness of pose estimation.Type: GrantFiled: October 22, 2019Date of Patent: September 6, 2022Assignee: INSTITUTE OF AUTOMATION, CHINESE ACADEMY OF SCIENCESInventors: Zhenan Sun, Hongwen Zhang, Wanli Ouyang, Jie Cao
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Publication number: 20220262024Abstract: A reconstruction method of a three-dimensional (3D) human body model includes: acquiring, by a fully convolutional network (FCN) module, a global UVI map and a local UVI map of a body part according to a human body image (S1); estimating, by a first neural network, a camera parameter and a shape parameter of the human body model based on the global UVI map (S2); extracting, by a second neural network, rotation features of joints of a human body based on the local UVI map (S3); refining, by using a position-aided feature refinement strategy, the rotation features of the joints of the human body to acquire refined rotation features (S4); and estimating, by a third neural network, a pose parameter of the human body model based on the refined rotation features (S5). The reconstruction method achieves accurate and efficient reconstruction of the human body model, and improves robustness of pose estimation.Type: ApplicationFiled: October 22, 2019Publication date: August 18, 2022Applicant: INSTITUTE OF AUTOMATION, CHINESE ACADEMY OF SCIENCESInventors: Zhenan SUN, Hongwen ZHANG, Wanli OUYANG, Jie CAO
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Publication number: 20220184749Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.Type: ApplicationFiled: March 7, 2022Publication date: June 16, 2022Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
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Patent number: 11349852Abstract: A network-based line-rate method and apparatus for detecting and managing potential malware utilizing a black list of possible malware to scan content and detect potential malware content based upon characteristics that match the preliminary signature. The undetected content is then subjected to an inference-based processes and methods to determine whether the undetected content is safe for release. Typical to inference-based processes and method, the verdict is a numerical value within a predetermined range, out of which content is not safe. The network content released if the verdict is within safe range, otherwise, the apparatus provides various options of handling such presumably unsafe content; options including, soliciting user input whether to release, block, or subject the content to further offline behavioral analysis.Type: GrantFiled: August 30, 2017Date of Patent: May 31, 2022Assignee: Wedge Networks Inc.Inventors: Hongwen Zhang, Mark Koob, Kevin Chmilar, Husam Kinawi
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Patent number: 11267080Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.Type: GrantFiled: July 22, 2019Date of Patent: March 8, 2022Assignee: INDIUM CORPORATIONInventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
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Publication number: 20210339344Abstract: Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.Type: ApplicationFiled: April 29, 2021Publication date: November 4, 2021Inventors: Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee
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Patent number: 10888958Abstract: A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both high temperature performance and improved wetting in high-temperature solder applications such as die attach. The core layer may be formed of a Bi Alloy having a solidus temperature above 260° C., and the adhesion layer may be formed of Sn, a Sn alloy, a Bi alloy, In, or an In alloy having a solidus temperature below 245° C. The solder preform may be formed using techniques such as: (1) electroplating a core ribbon with an adhesion material, (2) cladding an adhesion material foil onto a core ribbon, and/or (3) dipping a core ribbon in a molten adhesion alloy bath to allow thin layers of adhesion material to adhere to a core ribbon.Type: GrantFiled: May 29, 2018Date of Patent: January 12, 2021Assignee: INDIUM CORPORATIONInventors: Hongwen Zhang, Joseph Wu, Jonathan Minter, Ning-Cheng Lee
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Publication number: 20200353572Abstract: Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.Type: ApplicationFiled: July 22, 2019Publication date: November 12, 2020Inventors: Hongwen Zhang, Fen Chen, Francis Mutuku, Jie Geng, Ning-Cheng Lee
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Publication number: 20200269360Abstract: High reliability leadfree solder alloys for harsh service conditions are disclosed. In some embodiments, a solder alloy comprises 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a component comprising: a main ceramic body, and a side surface having disposed thereon an electrode and a thermal pad; a copper substrate; and a solder alloy electrically coupling the component and the copper substrate, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn. In some embodiments, an apparatus comprises: a light-emitting diode (LED) component; a Metal Core Printed Circuit Board (MCPCB); and a solder alloy electrically coupling the LED component and the MCPCB, wherein the solder alloy comprises: 2.5-4.0 wt % Ag; 0.4-0.8 wt % Cu; 5.0-9.0 wt % Sb; 1.5-3.5 wt % Bi; 0.05-0.35 wt % Ni; and a remainder of Sn.Type: ApplicationFiled: February 26, 2020Publication date: August 27, 2020Inventors: Jie Geng, Hongwen Zhang, Ning-Cheng Lee
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Publication number: 20200070287Abstract: Some implementations of the disclosure are directed to low melting temperature (e.g., liquidus temperature below 210° C.) SnBi or Snln solder alloys. A SnBi solder alloy may consist of 2 to 60 wt % Bi; optionally, one or more of: up to 16 wt % In, up to 4.5 wt % Ag, up to 2 wt % Cu, up to 12 wt % Sb, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn. A Snln solder alloy may consist of: 8 to 20 wt % In; optionally, one or more of: up to 12 wt % Bi, up to 4 wt % Ag, up to 5 wt % Sb, up to 3 wt % Cu, up to 2.5 wt % Zn, up to 1.5 wt % Ni, up to 1.5 wt % Co, up to 1.5 wt % Ge, up to 1.5 wt % P, and up to 1.5 wt % Mn; and a remainder of Sn.Type: ApplicationFiled: August 30, 2019Publication date: March 5, 2020Inventors: Francis M. Mutuku, Ning-Cheng Lee, Hongwen Zhang
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Publication number: 20190366486Abstract: A lead-free solder preform includes a core layer and adhesion layer coated over surfaces of the core layer, where the preform delivers the combined merits from constituent solder alloys of the core and adhesion layers to provide both high temperature performance and improved wetting in high-temperature solder applications such as die attach. The core layer may be formed of a Bi Alloy having a solidus temperature above 260° C., and the adhesion layer may be formed of Sn, a Sn alloy, a Bi alloy, In, or an In alloy having a solidus temperature below 245° C. The solder preform may be formed using techniques such as: (1) electroplating a core ribbon with an adhesion material, (2) cladding an adhesion material foil onto a core ribbon, and/or (3) dipping a core ribbon in a molten adhesion alloy bath to allow thin layers of adhesion material to adhere to a core ribbon.Type: ApplicationFiled: May 29, 2018Publication date: December 5, 2019Inventors: HONGWEN ZHANG, JOSEPH WU, JONATHAN MINTER, NING-CHENG LEE
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Publication number: 20190199740Abstract: A network-based line-rate method and apparatus for detecting and managing potential malware utilizing a black list of possible malware to scan content and detect potential malware content based upon characteristics that match the preliminary signature. The undetected content is then subjected to an inference-based processes and methods to determine whether the undetected content is safe for release. Typical to inference-based processes and method, the verdict is a numerical value within a predetermined range, out of which content is not safe. The network content released if the verdict is within safe range, otherwise, the apparatus provides various options of handling such presumably unsafe content; options including, soliciting user input whether to release, block, or subject the content to further offline behavioral analysis.Type: ApplicationFiled: August 30, 2017Publication date: June 27, 2019Inventors: Hongwen Zhang, Mark Koob, Kevin Chmilar, Husam Kinawi