Patents by Inventor Hongwen Zhang
Hongwen Zhang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10328533Abstract: A braided solder wire rope includes a first alloy including Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy including Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the second alloy controls an interface reaction chemistry with various metallization surface finish materials without interfering with a high temperature performance of the first alloy. The first alloy may have a solidus temperature around 258° C. and at least the first alloy of the first wire and the second alloy of the second wire may be braided together.Type: GrantFiled: October 4, 2017Date of Patent: June 25, 2019Assignee: INDIUM CORPORATIONInventors: Hongwen Zhang, Ning-Cheng Lee
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Patent number: 10153967Abstract: A network device creates a forwarding table that includes information associated with a set of destinations in a network, and determines next hops for the set of destinations. The network device populates the forwarding table with information associated with the next hops, and stores the forwarding table. The forwarding table is used to forward a multicast packet toward a multiple destinations, and includes separate entries that depend upon routes the multicast packet is to traverse towards destinations with multiple choices for next hops.Type: GrantFiled: June 29, 2015Date of Patent: December 11, 2018Assignee: Juniper Networks, Inc.Inventors: Ross Callon, Zhaohui Zhang, Hongwen Zhang
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Patent number: 10118260Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.Type: GrantFiled: February 23, 2015Date of Patent: November 6, 2018Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
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Publication number: 20180029170Abstract: A braided solder wire rope includes a first alloy including Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy including Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the second alloy controls an interface reaction chemistry with various metallization surface finish materials without interfering with a high temperature performance of the first alloy. The first alloy may have a solidus temperature around 258° C. and at least the first alloy of the first wire and the second alloy of the second wire may be braided together.Type: ApplicationFiled: October 4, 2017Publication date: February 1, 2018Inventors: Hongwen ZHANG, Ning-Cheng LEE
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Patent number: 9802274Abstract: A lead-free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.Type: GrantFiled: March 21, 2016Date of Patent: October 31, 2017Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
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Publication number: 20170266765Abstract: A lead—free solder wire includes a core wire with a first alloy and a shell coating layer with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, In Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the shell coating layer is applied to a surface of the core wire. In another implementation, the lead free solder wire may include a first wire with a first alloy and a second wire with a second alloy. The first alloy may be composed of Bi—Ag, Bi—Cu, Bi—Ag—Cu, or Bi—Sb; and the second alloy may be composed of Sn, Sn—Ag, Sn—Cu, Sn—Ag—Cu, Sn—Zn, Bi—Sn, Sn—In, Sn—Sb or Bi—In, such that the first alloy of the first wire and the second alloy of the second wire are braided together.Type: ApplicationFiled: March 21, 2016Publication date: September 21, 2017Applicant: Indium CorporationInventors: HONGWEN ZHANG, Ning-Cheng Lee
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Patent number: 9636784Abstract: A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.Type: GrantFiled: March 10, 2015Date of Patent: May 2, 2017Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
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Publication number: 20160134518Abstract: A network device creates a forwarding table that includes information associated with a set of destinations in a network, and determines next hops for the set of destinations. The network device populates the forwarding table with information associated with the next hops, and stores the forwarding table. The forwarding table is used to forward a multicast packet toward a multiple destinations, and includes separate entries that depend upon routes the multicast packet is to traverse towards destinations with multiple choices for next hops.Type: ApplicationFiled: June 29, 2015Publication date: May 12, 2016Inventors: Ross CALLON, Zhaohui ZHANG, Hongwen ZHANG
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Publication number: 20150246417Abstract: A solder paste consists of an amount of a first solder alloy powder between 44 wt % to less than 60 wt %; an amount of a second solder alloy powder between greater than 0 wt % and 48 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C. In another implementation, the solder paste consists of an amount of a first solder alloy powder between 44 wt % and 87 wt %; an amount of a second solder alloy powder between 13 wt % and 48 wt %; and flux.Type: ApplicationFiled: March 10, 2015Publication date: September 3, 2015Applicant: Indium CorporationInventors: HONGWEN ZHANG, Ning-Cheng Lee
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Publication number: 20150224602Abstract: A solder paste consists of an amount of a first solder alloy powder between 60 wt % to 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than 250° C.Type: ApplicationFiled: February 23, 2015Publication date: August 13, 2015Applicant: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
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Patent number: 9017446Abstract: A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than about 250° C.Type: GrantFiled: May 3, 2010Date of Patent: April 28, 2015Assignee: Indium CorporationInventors: Hongwen Zhang, Ning-Cheng Lee
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Publication number: 20110268985Abstract: A solder paste comprises an amount of a first solder alloy powder between about 60 wt % to about 92 wt %; an amount of a second solder alloy powder greater than 0 wt % and less than about 12 wt %; and a flux; wherein the first solder alloy powder comprises a first solder alloy that has a solidus temperature above about 260° C.; and wherein the second solder alloy powder comprises a second solder alloy that has a solidus temperature that is less than about 250° C.Type: ApplicationFiled: May 3, 2010Publication date: November 3, 2011Inventors: HONGWEN ZHANG, Ning-Cheng Lee
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Patent number: 7630379Abstract: The invention relates to network based content inspection (NBCI). More specifically, the invention provides systems and methods for improved NBCI in complex networks that are typical for enterprises and service providers. These networks are shared by large numbers of concurrent users who send and retrieve application content of various sizes via a variety of communication protocols. This invention improves the efficiency of the NBCI of an individual communication session by learning from the processing results of other communication sessions which may be carried via different network protocols. In addition, the invention provides methods that do not weaken the overall security for the network and that improve the stability of NBCI systems by minimizing the risk of system resource exhaustion if subjected to a burst of large payloads. The invention also improves perceived network stability by preventing the system resources from being “live-locked” by a few large content inspection tasks.Type: GrantFiled: January 5, 2007Date of Patent: December 8, 2009Assignee: Wedge Networks Inc.Inventors: Isao Morishita, Hongwen Zhang, Husam Kinawi
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Publication number: 20070160062Abstract: The invention relates to network based content inspection (NBCI). More specifically, the invention provides systems and methods for improved NBCI in complex networks that are typical for enterprises and service providers. These networks are shared by large numbers of concurrent users who send and retrieve application content of various sizes via a variety of communication protocols. This invention improves the efficiency of the NBCI of an individual communication session by learning from the processing results of other communication sessions which may be carried via different network protocols. In addition, the invention provides methods that do not weaken the overall security for the network and that improve the stability of NBCI systems by minimizing the risk of system resource exhaustion if subjected to a burst of large payloads. The invention also improves perceived network stability by preventing the system resources from being “live-locked” by a few large content inspection tasks.Type: ApplicationFiled: January 5, 2007Publication date: July 12, 2007Inventors: Isao Morishita, Hongwen Zhang, Husam Kinawi
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Publication number: 20050010697Abstract: This invention is a system and corresponding method having a computer readable medium, a set of content in communications with said computer readable medium containing content for at least one bandwidth, and a set of computer readable instructions embodied in said computer readable medium for receiving a content request from said output device, generating at least one detection packet for transmission to said output device, receiving at least one detection packet return from said output device, determining the bandwidth of said output device according to said at least one detection packet and said at least one detection packet return, retrieving content from said set of content, according to the bandwidth of said output device, and for transmission to said output device so that said output device can receive and display content compatible with the bandwidth of said output device, and formatting said content according to the bandwidth of said output device.Type: ApplicationFiled: December 30, 2003Publication date: January 13, 2005Inventors: Husam Kinawi, Hongwen Zhang