Patents by Inventor Hongyong AN

Hongyong AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10833021
    Abstract: A method comprises the steps of providing a semiconductor device wafer; forming a first plurality of alignment marks on a first side of the semiconductor device wafer; forming a first pattern of a first conductivity type; forming a second plurality of alignment marks on a second side of the semiconductor device wafer; forming a bonded wafer by bonding a carrier wafer to the semiconductor device wafer; forming a third plurality of alignment marks on a free side of the carrier wafer; applying a grinding process; forming a plurality of device structure members; removing the carrier wafer; applying an implanting process and an annealing process; applying a metallization process and applying a singulation process.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: November 10, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Lei Zhang, Hongyong Xue, Jian Wang, Runtao Ning
  • Patent number: 10774036
    Abstract: The invention relates to a new enantioselective process for producing useful intermediates for the manufacture of NEP inhibitors or prodrugs thereof, in particular NEP inhibitors comprising a ?-amino-?-biphenyl-?-methylalkanoic acid, or acid ester, backbone.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: September 15, 2020
    Assignee: Novartis AG
    Inventors: Florian Karl Kleinbeck-Riniker, Tobias Kapferer, Hongyong Kim, Jie Ku, Kurt Laumen, Yunzhong Li, Wei Peng, Thomas Ruch, Thierry Schlama, Yao Yang
  • Patent number: 10763125
    Abstract: A semiconductor device comprising a substrate layer, an epitaxial layer, a dielectric layer, a first aluminum layer, a first titanium interlayer and a second aluminum layer. The first titanium interlayer is disposed between the first aluminum layer and the second aluminum layer. A process for fabricating a semiconductor device comprising the steps of: preparing a semiconductor wafer; depositing a first aluminum layer onto the semiconductor wafer; depositing a first titanium interlayer onto the first aluminum layer; depositing a second aluminum layer onto the first titanium interlayer; applying an etching process so that a plurality of trenches are formed so as to expose a plurality of top surfaces of a dielectric layer; and applying a singulation process so as to form a plurality of separated semiconductor devices.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: September 1, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD.
    Inventors: Wei He, Chris Wiebe, Hongyong Xue
  • Publication number: 20200197368
    Abstract: Provided are methods and compositions for prolonging survival and/or reducing or inhibiting tumor growth in a cancer subject receiving a regimen of one or more chemotherapeutic agents, an inhibitor of soluble epoxide hydrolase (sEHi) and a non-steroidal anti-inflammatory drug (NSAID) that inhibits one or more enzymes selected from the group consisting of cyclo-oxygenase (“COX”)-1, COX-2, and 5-lipoxygenase (“5-LOX”). The methods and compositions decrease toxicity and/or adverse side effects in subjects receiving a regimen of one or more chemotherapeutic agents.
    Type: Application
    Filed: August 14, 2018
    Publication date: June 25, 2020
    Inventors: Bruce D. HAMMOCK, Sung Hee HWANG, Ralph W. de VERE WHITE, Chong-xian PAN, Hongyong ZHANG, Paul HENDERSON, Ai-Hong MA, Maike ZIMMERMAN, Fuli WANG
  • Publication number: 20200195847
    Abstract: Image processing method, drone, and drone-camera system are provided. The method includes acquiring, according to a current environmental parameter of the drone, a target sky image that matches the current environmental parameter; and determining a direction parameter of the camera device when capturing a to-be-stitched image. The to-be-stitched image is an image captured under the current environmental parameter. The method further includes stitching the target sky image with the to-be-stitched image according to the direction parameter to obtain a panoramic image.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 18, 2020
    Inventors: Hongyong ZHENG, Zhenbo LU, Pan HU, Zisheng CAO
  • Patent number: 10686038
    Abstract: An RC-IGBT includes a semiconductor body incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process and the field stop zone has an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In alternate embodiments, RC-IGBT device, including the epitaxial layer field stop zone, are realized through a fabrication process that uses front side processing only to form the backside contact regions and the front side device region. The fabrication method forms an RC-IGBT device using front side processing to form the backside contact regions and then using wafer bonding process to flip the semiconductor structure onto a carrier wafer so that front side processing is used again to form the device region.
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: June 16, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Hongyong Xue, Lei Zhang, Brian Schorr, Chris Wiebe, Wenjun Li
  • Patent number: 10644118
    Abstract: Embodiments of the present disclosure provide a self-aligned contact for a trench power MOSFET device. The device has a layer of nitride provided over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. Alternatively, the device has an oxide layer over the conductive material in the gate trenches and over portions of mesas between every two adjacent contact structures. It is emphasized that this abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: May 5, 2020
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: Hongyong Xue, Sik Lui, Terence Huang, Ching-Kai Lin, Wenjun Li, Yi Chang Yang, Jowei Dun
  • Patent number: 10600594
    Abstract: The present disclosure provides a gas-insulated vacuum load break switch, including a high-voltage conductive loop having three phases independent from each other and of the same design, a control operating mechanism, a support box and a transmission apparatus. Each phase of the high-voltage conductive loop includes a load break switch unit with a vacuum interrupter, an isolating switch unit with an isolator, a plastic housing supporting the load break switch unit and the isolating switch unit, and an earthing switch unit; the control operating mechanism includes an operating mechanism for controlling the load break switch unit, an operating rod for controlling the isolating switch unit, and an operating mechanism for controlling the earthing switch unit.
    Type: Grant
    Filed: September 17, 2018
    Date of Patent: March 24, 2020
    Assignee: ABB Schweiz AG
    Inventors: Huihuang Yang, Hongyong Wang
  • Patent number: 10568360
    Abstract: A press puffing device includes a piston support, a nozzle holder, and a sealing fixer. In the press puffing device, a power supply start button is pressed to produce an aroma gas, and the aroma gas is contained in the cylindrical inner cavity. By pressing the piston support, the contained smoke is compressed and flows to the air outlet through the lateral gas channel to spurt out.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: February 25, 2020
    Assignee: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Jianguo Tang, Xudong Zheng, Xu Zeng, Ru Wang, Chengya Wang, Weimin Gong, Zhiqiang Li, Ping Lei, Shanzhai Shang, Jingmei Han, Dalin Yuan, Shunliang Tang, Yongkuan Chen, Hongyong Luo
  • Patent number: 10568361
    Abstract: A press-type and nasal-inhaling-type smoking paraphernalia for heating cigarettes includes a roasting-type heating device and a press puffing device, wherein the roasting-type heating device heats the cigarette in the radiated manner; and the press puffing device drives the relevant mechanism to compress the smoke by the user pressing the piston support, and the compressed smoke spurts out from the air outlet for snorting by the user, which avoids the design of the complicated gas channel in the traditional electric heating smoking paraphernalia, the local overheating of the cigarette, and the direct contact of the mouth with the cigarette filter.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: February 25, 2020
    Assignee: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Jianguo Tang, Xudong Zheng, Xu Zeng, Ru Wang, Chengya Wang, Tao Wang, Zhiqiang Li, Ping Lei, Shanzhai Shang, Jingmei Han, Dalin Yuan, Shunliang Tang, Yongkuan Chen, Hongyong Luo
  • Publication number: 20190385863
    Abstract: A semiconductor device comprising a substrate layer, an epitaxial layer, a dielectric layer, a first aluminum layer, a first titanium interlayer and a second aluminum layer. The first titanium interlayer is disposed between the first aluminum layer and the second aluminum layer. A process for fabricating a semiconductor device comprising the steps of: preparing a semiconductor wafer; depositing a first aluminum layer onto the semiconductor wafer; depositing a first titanium interlayer onto the first aluminum layer; depositing a second aluminum layer onto the first titanium interlayer; applying an etching process so that a plurality of trenches are formed so as to expose a plurality of top surfaces of a dielectric layer; and applying a singulation process so as to form a plurality of separated semiconductor devices.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 19, 2019
    Applicant: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Wei He, Chris Wiebe, Hongyong Xue
  • Publication number: 20190359554
    Abstract: The invention relates to a new enantioselective process for producing useful intermediates for the manufacture of NEP inhibitors or prodrugs thereof, in particular NEP inhibitors comprising a ?-amino-?-biphenyl-?-methylalkanoic acid, or acid ester, backbone.
    Type: Application
    Filed: December 20, 2017
    Publication date: November 28, 2019
    Inventors: Florian Karl KLEINBECK-RINIKER, Tobias KAPFERER, Hongyong KIM, Jie KU, Kurt LAUMEN, Yunzhong LI, Wei PENG, Thomas RUCH, Thierry SCHLAMA, Yao YANG
  • Publication number: 20190335807
    Abstract: A sliding cover-opening device includes a top support, a sliding-resistant device, and a rotatable cover opening device. The rotatable cover opening device further includes a rotatable pushing cover and a rotating torsional spring. According to the sliding cover-opening device, the rotatable pushing cover can automatically rotate to 90 degrees to open completely after sliding over a certain distance. Also, with the sliding-resistant device, users can experience a sliding feeling by hands.
    Type: Application
    Filed: October 17, 2017
    Publication date: November 7, 2019
    Applicant: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Jianguo TANG, Xudong ZHENG, Xu ZENG, Ru WANG, Chengya Wang, Shanzhai SHANG, Ping LEI, Jingmei HAN, Zhiqiang LI, Dalin YUAN, Changshan ZHAO, Shiwei LI, Yongkuan CHEN, Hongyong LUO, Fengren FANG
  • Patent number: 10463073
    Abstract: A sliding cover-opening device includes a top support, a sliding-resistant device, and a rotatable cover opening device. The rotatable cover opening device further includes a rotatable pushing cover and a rotating torsional spring. According to the sliding cover-opening device, the rotatable pushing cover can automatically rotate to 90 degrees to open completely after sliding over a certain distance. Also, with the sliding-resistant device, users can experience a sliding feeling by hands.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: November 5, 2019
    Assignee: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Jianguo Tang, Xudong Zheng, Xu Zeng, Ru Wang, Chengya Wang, Shanzhai Shang, Ping Lei, Jingmei Han, Zhiqiang Li, Dalin Yuan, Changshan Zhao, Shiwei Li, Yongkuan Chen, Hongyong Luo, Fengren Fang
  • Patent number: 10438813
    Abstract: A semiconductor device comprising a substrate layer, an epitaxial layer, a dielectric layer, a first aluminum layer, a first titanium interlayer and a second aluminum layer. The first titanium interlayer is disposed between the first aluminum layer and the second aluminum layer. A process for fabricating a semiconductor device comprising the steps of: preparing a semiconductor wafer; depositing a first aluminum layer onto the semiconductor wafer; depositing a first titanium interlayer onto the first aluminum layer; depositing a second aluminum layer onto the first titanium interlayer; applying an etching process so that a plurality of trenches are formed so as to expose a plurality of top surfaces of a dielectric layer; and applying a singulation process so as to form a plurality of separated semiconductor devices.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: October 8, 2019
    Assignee: Alpha and Omega Semiconductor (Cayman) Ltd.
    Inventors: Wei He, Chris Wiebe, Hongyong Xue
  • Patent number: 10424654
    Abstract: This invention discloses a semiconductor power device disposed in a semiconductor substrate including an active cell areas and a termination area. The semiconductor power device further comprises a plurality of gate trenches formed at a top portion of the semiconductor substrate in the active cell area wherein each of the gate trenches is partially filled with a conductive gate material with a top portion of the trenches filled by a high density plasma (HDP) insulation layer. The semiconductor power device further comprises mesa areas of the semiconductor substrate disposed between the gate trenches wherein the mesa areas are recessed and having a top mesa surface disposed vertically below a top surface of the HDP insulation layer wherein the HDP insulation layer covering over the conductive gate material constituting a stick-out boundary-defining layer surrounding the recessed mesa areas in the active cell areas between the gate trenches.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 24, 2019
    Assignee: Alpha and Omega Semiconductor Incorporated
    Inventors: Wenjun Li, Paul Thorup, Hong Chang, Yeeheng Lee, Yang Xiang, Jowei Dun, Hongyong Xue, Yiming Gu
  • Publication number: 20190273131
    Abstract: A semiconductor device includes a semiconductor body having a base region incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process. Furthermore, the epitaxial layer field stop zone is formed with an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In some embodiments, the enhanced doping profile formed in the field stop zone includes varying, non-constant doping levels. In some embodiments, the enhanced doping profile includes one of an extended graded doping profile, a multiple stepped flat doping profile, or a multiple spike doping profile. The epitaxial layer field stop zone of the present invention enables complex field stop zone doping profiles to be used to obtain the desired soft-switching characteristics in the semiconductor device.
    Type: Application
    Filed: May 22, 2019
    Publication date: September 5, 2019
    Inventors: Lei Zhang, Karthik Padmanabhan, Lingpeng Guan, Jian Wang, Lingbing Chen, Wim Aarts, Hongyong Xue, Wenjun Li, Madhur Bobde
  • Publication number: 20190267823
    Abstract: A compression charging device includes a cigarette case charging part and a cigarette set charging part. The cigarette case charging part includes a positive electrode cover, a positive spring, a negative spring, a charging insulation sleeve, and a PCB. The cigarette set charging part includes a filter holding seat, a charging base, and an insulation fixing sleeve. The compression charging device is configured for cigarette set charging. The negative spring and the positive spring have a double function of electrical conduction and bouncing.
    Type: Application
    Filed: October 17, 2017
    Publication date: August 29, 2019
    Applicant: CHINA TOBACCO YUNNAN INDUSTRIAL CO., LTD
    Inventors: Xudong ZHENG, Jianguo TANG, Ru WANG, Chengya Wang, Xu ZENG, Jingmei HAN, Ping LEI, Shanzhai SHANG, Zhiqiang LI, Dalin YUAN, Changshan ZHAO, Shiwei LI, Yongkuan CHEN, Hongyong LUO, Fengren FANG
  • Patent number: D896226
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: September 15, 2020
    Assignee: SHENZHEN GULI TECHNOLOGY CO., LTD
    Inventor: Hongyong Yu
  • Patent number: D898745
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: October 13, 2020
    Inventor: Hongyong Ye