Patents by Inventor Hongyu Chen

Hongyu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240012007
    Abstract: An assay method for detecting the presence or amounts of VCAM-1 and A2M in a sample using fluorescence resonance energy transfer (FRET).
    Type: Application
    Filed: October 22, 2021
    Publication date: January 11, 2024
    Applicant: PROCISEDX INC.
    Inventors: Hongyu CHEN, Limin LIU, Stefan WESTIN, Michael HALE, Larry MIMMS
  • Patent number: 11866557
    Abstract: Composite articles that can resist discoloration or color changes are described. In some instances, the composite articles can include a compounded material that is substantially free of an antioxidant that changes from a first color to a second color upon exposure to an environment comprising an oxidizing agent. The composite articles can be flame retardant and may provide sound reduction as well.
    Type: Grant
    Filed: July 18, 2020
    Date of Patent: January 9, 2024
    Assignee: Hanwha Azdel, Inc.
    Inventors: Peng Cheng, Hongyu Chen, Liqing Wei, Ruomiao Wang
  • Patent number: 11860170
    Abstract: An assay method for detecting the presence or amounts of VCAM-1 and A2M in a sample using fluorescence resonance energy transfer (FRET).
    Type: Grant
    Filed: October 22, 2021
    Date of Patent: January 2, 2024
    Assignee: ProciseDX Inc.
    Inventors: Hongyu Chen, Limin Liu, Stefan Westin, Michael Hale, Larry Mimms
  • Patent number: 11851603
    Abstract: A highly thermally conductive composition is provided, such composition comprising: (A) An organopolysiloxane composition; (B) a filler treating agent; (C) a thermal stabilizer; and (D) thermally conductive filler mixture, comprising: (D-1) a small-particulate thermally conductive filler having a mean size of up to 3 ?m, (D-2) spherical aluminum nitride having a mean size of from 50 to 150 ?m, (D-3) boron nitride having a mean size of from 20 to 200 ?m.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: December 26, 2023
    Assignees: DOW SILICONES CORPORATION, DOW GLOBAL TECHNOLOGIES LLC (DGTL)
    Inventors: Xiaolian Hu, Jiguang Zhang, Yan Zheng, Hongyu Chen, Chen Chen, Dorab Bhagwagar, Darren Hansen
  • Publication number: 20230406985
    Abstract: This disclosure includes a polymer blend comprising. The polymer blend includes at least 60% by weight olefin-based polymer, and a diblock copolymer comprising an non-polar block and a polar block, wherein the diblock copolymer has a number average molecular weight number (Mn) less than 5000 g/mol as determined by proton nuclear magnetic resonance (1H NMR); and wherein the non-polar block and the polar block are connected by a thiol linkage.
    Type: Application
    Filed: November 10, 2021
    Publication date: December 21, 2023
    Applicant: Dow Global Technologies LLC
    Inventors: Tao Wang, Hongyu Chen, Zachary Kean, Todd Senecal
  • Publication number: 20230349865
    Abstract: Disclosed is a method for pretreating Ranitidine hydrochloride sample, comprising steps: S1, weighing the Ranitidine hydrochloride sample containing an impurity of N-nitrosodimethylamine; S2, preparing a test solution of Ranitidine hydrochloride so that the concentration of N-nitrosodimethylamine in the test solution reaches the detection limit of high-performance liquid chromatography; S3, adding an alkaline solution to the Ranitidine hydrochloride test solution, wherein the alkaline solution reacts completely with hydrochloric acid in Ranitidine hydrochloride to give a Ranitidine neutralizing solution; S4, adding a silver ion solution to the Ranitidine neutralizing solution, and silver ions undergo a complete complexation reaction with secondary amino groups in Ranitidine to generate a precipitate.
    Type: Application
    Filed: April 24, 2023
    Publication date: November 2, 2023
    Inventors: Shuai LI, Bin LIAO, Hongyu CHEN, Yuxin LI, Yanming LIU, Guipeng TANG, Yang GAO
  • Patent number: 11787924
    Abstract: A composition comprising at least the following: A) an olefin multi-block copolymer; B) a silicone rubber; C) a tackifier.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: October 17, 2023
    Assignee: Dow Global Technologies LLC
    Inventors: Xiaolian Hu, Haiyang Yu, Kyle G. Kummer, Wanfu Ma, Hongyu Chen
  • Patent number: 11781050
    Abstract: An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive. The aqueous dispersion of the silicone pressure sensitive adhesive base includes a bis-hydroxyl-terminated polydiorganosiloxane; a polyorganosilicate resin; cumene; a surfactant; and water. A curing agent such as a peroxide compound or an aminosilane may be combined with the aqueous disperison of the silicone pressure sensitive adhesive base to form a silicone pressure sensitive adhesive composition. A pressure sensitive adhesive article may be formed by a method including coating a surface of a substrate with the silicone pressure sensitive adhesive composition, removing water, and curing the silicon pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: October 10, 2023
    Assignees: DOW GLOBAL TECHNOLOGIES LLC, Dow Silicones Corporation
    Inventors: Qiangqiang Yan, Yunlong Guo, Wenjie Chen, Li Ding, Hongyu Chen, Cheng Shen, Ruihua Lu, Yan Zhou, Zhihua Liu
  • Publication number: 20230313014
    Abstract: A process includes immersing a device in a cooling fluid, the cooling fluid comprising an alkyl modified silicone oil having the following average chemical structure (I) : (CH 3) 3SiO- [ (CH 3) 2) SiO] m- [R (CH 3) SiO] n-Si (CH 3) 3 (I) where: R in each occurrence is an alkyl or substituted alkyl having 6 or more and at the same time 17 or fewer carbon atoms; subscript m has a value of one or higher and at the same time less than 22, subscript n has a value of one or higher, and the sum of m+n is greater than 5 and at the same time less than 50.
    Type: Application
    Filed: October 14, 2021
    Publication date: October 5, 2023
    Inventors: Zhengming Tang, Shreyas Bhide, Hongyu Chen, Peng Wei, Patricia Ansems Bancroft, Zhihua Liu, Son Phan
  • Publication number: 20230272201
    Abstract: A process to form a crosslinked composition, said process comprising thermally treating a composition comprising the following: a) an elastomer; b) a siloxy-modified silica; c) a hydrosilylation catalyst. A composition comprising the following: a) an elastomer; b) a siloxy-modified silica; c) a hydrosilylation catalyst.
    Type: Application
    Filed: July 22, 2020
    Publication date: August 31, 2023
    Inventors: Kainan Zhang, Hongyu Chen, Tao Han, Xiaomei Song, Jie Ji, Linfei Wang, Chao He, Xin Tan
  • Publication number: 20230257582
    Abstract: Provided is a thermal interface material containing a divinyl polydimethylsiloxane, a chain extender, a crosslinker, 80 volume-percent or more thermally conductive filler, treating agent composition, platinum hydrosilylation catalyst, and up to 0.2 weight-percent hydrosilylation inhibitor; where the wherein weight-percent values are relative to thermal interface material composition weight, volume-percent values are relative to thermal interface material composition volume, the molar ratio of silyl hydride groups to vinyl groups in the thermal interface material composition is 0.4 or more and at the same time is 1.0 or less, and the molar ratio of silyl hydride functionality from the chain extender to silyl hydride functionality from the crosslinker is 13 or more and at the same time 70 or less.
    Type: Application
    Filed: September 23, 2020
    Publication date: August 17, 2023
    Inventors: Jiguang Zhang, Yan Zheng, Chao He, Xuedong Gao, Qianqing Ge, Dorab Bhagwagar, Peng Wei, Chen Chen, Hongyu Chen
  • Patent number: D993209
    Type: Grant
    Filed: November 27, 2020
    Date of Patent: July 25, 2023
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Hongyu Chen, Long Chen, Xu Wei
  • Patent number: D993933
    Type: Grant
    Filed: November 26, 2020
    Date of Patent: August 1, 2023
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventors: Hongyu Chen, Long Chen, Xu Wei
  • Patent number: D1003265
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: October 31, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Hongyu Chen, Long Chen
  • Patent number: D1003266
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: October 31, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Hongyu Chen, Long Chen
  • Patent number: D1003267
    Type: Grant
    Filed: May 20, 2020
    Date of Patent: October 31, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Hongyu Chen, Long Chen
  • Patent number: D1003268
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: October 31, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Hongyu Chen, Long Chen
  • Patent number: D1003850
    Type: Grant
    Filed: May 21, 2020
    Date of Patent: November 7, 2023
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Hongyu Chen, Long Chen
  • Patent number: D1007480
    Type: Grant
    Filed: March 17, 2022
    Date of Patent: December 12, 2023
    Assignee: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD.
    Inventor: Hongyu Chen
  • Patent number: D1009822
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: January 2, 2024
    Assignee: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Huacan Cui, Hongyu Chen, Xu Wei