Abstract: An optical reflective component and an optical encoder using the same are disclosed. The optical reflective component includes a main body, an optical pattern, a first attaching portion and a second attaching portion. The main body has a first central axis and a reflective surface perpendicular to each other. The optical pattern is disposed on the reflective surface and centered at the central axis. The first attaching portion is centered at the first central axis of the main body and extends from the man body in a direction parallel to the first central axis. The first attaching portion has an inner wall. The second attaching portion has a plane perpendicular to the first central axis. The plane is connected to the inner wall. The main body, the first attaching portion and the second attaching portion are formed of a metal material and are integrally formed with the optical pattern.

Abstract: An encoder includes a carrier disc, a coded disc, a rotating shaft, a bearing, a bracket, a housing and a sensing assembly is disclosed. The coded disc is disposed on the carrier disc. The rotating shaft includes a first attaching portion and a second attaching portion, and the first attaching portion is partially penetrated through the carrier disc. The bearing includes a bearing inner surface and a bearing outer surface, and the bearing inner surface is connected with the second attaching portion. The bracket includes a bearing attaching portion and a bracket curved feature portion, and the bearing attaching portion is connected with the bearing outer surface. The housing includes a housing curved feature portion, which is connected with the bracket curved feature portion.

Abstract: A rotation detecting device includes a magnet, a first magnetic sensing assembly and a second magnetic sensing assembly. The magnet is rotatable about a rotation axis. As the magnet is rotated for one turn, a magnetic characteristic of the magnet is correspondingly changed for a cycle. The first magnetic sensing assembly is located over the magnet, wherein the rotation axis of the magnet passes through the first magnetic sensing assembly. A first lengthwise direction of the first magnetic sensing assembly is in parallel with a rotation radius direction of the magnet. The second magnetic sensing assembly is arranged beside the first magnetic sensing assembly. A second lengthwise direction of the second magnetic sensing assembly is in parallel with a rotation tangential direction of the magnet. An included angle between the second lengthwise direction and the first lengthwise direction is (90+?) degrees, wherein ?30???30.

Abstract: An encoder includes a magnet, an optical coded disc, a magnetic sensing assembly, an optical sensing assembly and a signal processing unit. The optical coded disc has a first incremental pattern track and a second incremental pattern track. The magnet and the optical coded disc are structurally coaxial and rotatable. The magnet sensing assembly senses the magnet rotation to obtain an absolute position signal. The optical sensing assembly senses the optical coded disc rotation to obtain a first incremental position signal and a second incremental position signal. The signal processing unit receives and integrates those signals to obtain a high precision absolute position information.

Abstract: An optical reflective component and an optical encoder using the same are disclosed. The optical reflective component includes a main body, an optical pattern, a first attaching portion and a second attaching portion. The main body has a first central axis and a reflective surface perpendicular to each other. The optical pattern is disposed on the reflective surface and centered at the central axis. The first attaching portion is centered at the first central axis of the main body and extends from the man body in a direction parallel to the first central axis. The first attaching portion has an inner wall. The second attaching portion has a plane perpendicular to the first central axis. The plane is connected to the inner wall. The main body, the first attaching portion and the second attaching portion are formed of a metal material and are integrally formed with the optical pattern.

Abstract: A rotation detecting device includes a magnet, a first magnetic sensing assembly and a second magnetic sensing assembly. The magnet is rotatable about a rotation axis. As the magnet is rotated for one turn, a magnetic characteristic of the magnet is correspondingly changed for a cycle. The first magnetic sensing assembly is located over the magnet, wherein the rotation axis of the magnet passes through the first magnetic sensing assembly. A first lengthwise direction of the first magnetic sensing assembly is in parallel with a rotation radius direction of the magnet. The second magnetic sensing assembly is arranged beside the first magnetic sensing assembly. A second lengthwise direction of the second magnetic sensing assembly is in parallel with a rotation tangential direction of the magnet. An included angle between the second lengthwise direction and the first lengthwise direction is (90+?) degrees, wherein ?30???30.

Abstract: An encoder includes a magnet, an optical coded disc, a magnetic sensing assembly, an optical sensing assembly and a signal processing unit. The optical coded disc has a first incremental pattern track and a second incremental pattern track. The magnet and the optical coded disc are structurally coaxial and rotatable. The magnet sensing assembly senses the magnet rotation to obtain an absolute position signal. The optical sensing assembly senses the optical coded disc rotation to obtain a first incremental position signal and a second incremental position signal. The signal processing unit receives and integrates those signals to obtain a high precision absolute position information.

Abstract: An encoder includes a carrier disc, a coded disc, a rotating shaft, a bearing, a bracket, a housing and a sensing assembly is disclosed. The coded disc is disposed on the carrier disc. The rotating shaft includes a first attaching portion and a second attaching portion, and the first attaching portion is partially penetrated through the carrier disc. The bearing includes a bearing inner surface and a bearing outer surface, and the bearing inner surface is connected with the second attaching portion. The bracket includes a bearing attaching portion and a bracket curved feature portion, and the bearing attaching portion is connected with the bearing outer surface. The housing includes a housing curved feature portion, which is connected with the bracket curved feature portion.

Abstract: According to an embodiment of the invention, an optoelectronic device is provided. The optoelectronic device includes: a lead frame having a reflective structure, wherein the reflective structure has an opening; an optoelectronic element disposed in the opening; at least one electrode disposed in the lead frame and electrically connected to the optoelectronic element; a lens disposed on the lead frame and having an adhesive portion having a holding surface, an alignment surface, and an adhesive surface, wherein the adhesive surface has a convex surface or a concave surface; and a covering adhesive layer filling a region defined by the reflective structure, covering the optoelectronic element, and adhering the lens to the lead frame through the adhesive portion of the lens.

Abstract: A light emitting device includes a body, at least one light emitting unit, at least one heat dissipating element and a power connecting element. The body has a supporting portion and a locking portion. The supporting portion is disposed on one end of the locking portion. The light emitting unit is disposed on the supporting portion. The heat dissipating element has an opening. The heat dissipating element is connected detachably with the locking portion. The power connecting element is connected with the body. The light emitting device having detachable heat dissipating elements can not only reduce the cost and time of research/development and manufacture but also increase the flexibility of the products.

Abstract: A light emitting device and manufacturing method thereof are disclosed. The light emitting device includes a substrate, a LED die, a first transparent layer, an optical wavelength conversion layer and a second transparent layer. The substrate has a die glue part. The LED die is disposed on the die glue part and has a base which is made of a transparent material. The first transparent layer is disposed on the side surface of the LED die. The optical wavelength conversion layer is evenly formed on the first transparent layer and the LED die. The second transparent layer is formed on the optical wavelength conversion layer.

Abstract: The invention provides a light emitting diode package structure and a method for fabricating the same. The package structure includes: a light emitting diode chip formed on a substrate; a first hydrophobic rib layer formed on the substrate and surrounding the light emitting diode; and a first cover layer formed on the substrate and covering the light emitting diode, wherein the first hydrophobic rib layer is used as a border of the first cover layer and an angle between the facet of the first cover layer and the substrate is about 60-90 degrees.

Abstract: A lighting device includes a lighting engine and at least a wavelength-converting element. The lighting engine includes a circuit board, a blue light emitting diode and a red light emitting diode. The blue light emitting diode and a red light emitting diode are disposed on the circuit board. The wavelength-converting element covers at least the blue light emitting diode. A wavelength-converted light is generated by converting a part of light emitted by the lighting engine through the wavelength-converting element. White light having a color temperature within a range from 2580K to 3220K on the black-body radiation of the CIE-1931 chromaticity diagram is generated by mixing the wavelength-converted light and non-converted light emitted by the lighting engine.

Abstract: A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: A light source module is provided. The light source module includes a full wave rectifier, a constant current output integrated circuit (IC) and at least one high operating voltage light emitting diode (HVLED) die coupled between the constant current output IC and a ground. The full wave rectifier generates a rectified signal according to an alternating current (AC) power. The constant current output IC outputs a constant current signal according to the rectified signal. A brightness of the HVLED die is determined by the constant current signal.

Abstract: A LED light source in a single package for raising the color-rendering index is provided. The LED light source comprises a substrate, at least one covering layer, a primary light source, and a secondary light source. The primary and the secondary light sources are formed on the substrate and coated with the at least one covering layer to provide a first output light and a second output light, respectively. The total output light is a mixed color of the first output light and the second output light.

Abstract: A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.

Abstract: A light-emitting diode (LED) apparatus includes an epitaxial multilayer, a micro/nano rugged layer and an anti-reflection layer. The epitaxial multilayer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The micro/nano rugged layer is disposed on the first semiconductor layer of the epitaxial multilayer. The anti-reflection layer is disposed on the micro/nano rugged layer. In addition, a manufacturing method of the LED apparatus is also disclosed.