Abstract: A capacitance sensing structure includes a substrate, a sensing electrode layer, at least one stack layer and a conductive body. The sensing electrode layer is formed on or in the substrate. The stack layer is formed on the sensing electrode layer. The conductive body is disposed over and corresponding to the sensing electrode layer and the stack layer.

Abstract: A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: An optical film includes a substrate and at least one pyramid-like structure. The pyramid-like structure is disposed on one surface of the substrate and has a base, a first face, a second face and a third face. The first, second and third faces are connected together and disposed along the base.

Abstract: A light-emitting diode (LED) apparatus includes an epitaxial layer and a current spreading layer. The epitaxial layer has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed on the first semiconductor layer of the epitaxial layer and has a micro/nano roughing structure layer and a transparent conductive layer. The micro/nano roughing structure layer has a plurality of hollow parts, and the transparent conductive layer covers a surface of the micro/nano roughing structure layer and is filled within the hollow parts. In addition, a manufacturing method of the LED apparatus and a current spreading layer with a micro/nano structure are also disclosed.

Abstract: A light-emitting diode (LED) apparatus includes an epitaxial multilayer, a micro/nano rugged layer and an anti-reflection layer. The epitaxial multilayer has a first semiconductor layer, an active layer and a second semiconductor layer in sequence. The micro/nano rugged layer is disposed on the first semiconductor layer of the epitaxial multilayer. The anti-reflection layer is disposed on the micro/nano rugged layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: A micro-electromechanical device includes a substrate, a first patterned conductive layer, a second patterned conductive layer and a first patterned blocking layer. The first patterned conductive layer is disposed on the substrate. The second patterned conductive layer is disposed on the first patterned conductive layer. The first patterned blocking layer is connected with the first patterned conductive layer and the second patterned conductive layer. In addition, a method of manufacturing the micro-electromechanical device is also disclosed.

Abstract: An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

Abstract: A light-emitting diode (LED) package includes a thermal-conducting substrate, a LED element, a package body, and an optical modulation device. The LED element is formed on the thermal-conducting substrate. The package body is formed on the LED element and the thermal-conducting substrate, and the optical modulation device is disposed on a light outputting surface of the package body and has a plurality of stepped protrusions for adjusting a shape of an optical field of the light beam. The optical modulation device and the package body can be two separate components and be connected together, or the optical modulation device and the package body can be integrally formed as a single piece when they are made. In addition, a manufacturing method of the LED package is also disclosed.

Abstract: A light-emitting diode (LED) device includes a substrate, at least one LED element and an optical modulation structure. The LED element is disposed on the substrate and generates a light beam. The optical modulation structure is disposed at one side of the LED element for adjusting a shape of an optical field of the light beam and an intensity distribution of the optical field. The optical modulation structure is formed with a plurality of stepped protrusions.

Abstract: A capacitance sensing structure includes a substrate, a sensing electrode layer, at least one stack layer and a conductive body. The sensing electrode layer is formed on or in the substrate. The stack layer is formed on the sensing electrode layer. The conductive body is disposed over and corresponding to the sensing electrode layer and the stack layer.

Abstract: An accelerometer includes a fixing unit and a movable unit. The fixing unit has a plurality of first electrode parts and a plurality of second electrode parts. The movable unit is connected with the fixing unit and includes a body having an opening, a plurality of third electrode parts and a plurality of fourth electrode parts. The third electrode parts are disposed at an outer side of the body with respect to the first electrode parts, respectively. The fourth electrode parts are disposed at the inner side of the body in the opening, and are disposed respectively with respect to the second electrode parts, respectively.

Abstract: A heat dissipation module includes a heat pipe and at least one fin, which is connected to and disposed on an external surface of the heat pipe. The heat pipe includes a casing, a wick and a working fluid. The casing has an accommodating space and a bottom portion. The bottom portion has an uneven surface facing the accommodating space. The wick is disposed over the uneven surface of the bottom portion and the working fluid is filled within the casing.

Abstract: A method for manufacturing a heat dissipation apparatus comprises the following steps: A substrate is provided. A pressure is exerted on the substrate by a roller mold to form a plurality of grooves on one surface of the substrate. A sealed chamber is formed out of the substrate so that the grooves are formed on an inner wall of the sealed chamber.

Abstract: This invention id related to a heat dissipation device comprises a case having a heat dissipation path, a backflow path, a first link path, and a second link path for working fluid to circulate therein. The heat dissipation path and the backflow path are positioned in the different height levels individually. The working fluid will not be more easily have turbulence. The reduction of heat dissipation efficiency will be improved. And the working fluid will not be necessary to limit covering the liquid state and gaseous state both.

Abstract: A micro-switch. The micro-switch comprises at least one base, at least one fixed portion, and at least one switch component. The base comprises at least one first terminal and at least one first drive unit. The fixed portion is protruded higher than the base. The switch component comprises at least one deflection structure and at least one reverse structure. The deflection structure comprises at least one second terminal and at least one second drive unit. The second terminal corresponds to the first terminal and the second drive unit corresponds to the first drive unit. The reverse structure comprises one end connected to the fixed portion and another end connected to the deflection structure.

Abstract: A heat dissipation apparatus. The heat-dissipation apparatus comprises a chamber, a working fluid, an evaporation section and a condensing section. The chamber has an inner wall, and the working fluid is sealed in the chamber. The evaporation section and the condensing section are located at the inner wall. The first grooves are disposed on the inner wall and connected to the evaporation section and the condensing section. The working fluid is vaporized at the evaporation section when absorbing heat from the heat source and condenses to a liquid phase and releases the heat at the condensing section, and the first groove provides a capillary force to drive the working fluid from the condensing section back to the evaporation section.

Abstract: A method for forming a die, including forming a pre-formed mold by providing a preliminary layer on a substrate and performing a micro-machining process on the preliminary layer. Due to the micro-machining process, the method can fabricate a pre-formed mold with high precision for forming a mold. The die is fabricated by the mold for performing a molding process to obtain a workpiece with a predetermined shape.