Patents by Inventor Horng-Kuang Fan
Horng-Kuang Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10436818Abstract: A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.Type: GrantFiled: July 18, 2017Date of Patent: October 8, 2019Assignee: MPI CORPORATIONInventors: Yu-Chen Hsu, Yu-Wen Wang, Horng-Kuang Fan, Mao-Fa Shen
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Patent number: 10393773Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.Type: GrantFiled: September 23, 2016Date of Patent: August 27, 2019Assignee: MPI CorporationInventors: Tsung-Yi Chen, Ting-Hsin Kuo, Yi-Lung Lee, Shih-Shin Chen, Horng-Chuan Sun, Horng-Kuang Fan
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Publication number: 20190212368Abstract: A probe card includes a space transformer, a printed circuit board and a plurality of welding elements. The space transformer is disposed with a plurality of first conductive protrusions. Each of the first conductive protrusions has a first end surface. The printed circuit board is disposed with a plurality of second conductive protrusions. Each of the second conductive protrusions has a second end surface. The welding elements are respectively and electrically connected between each of the second end surfaces and the corresponding first end surface. A first surface of the space transformer away from the printed circuit board has a first degree of flatness. A second surface of the printed circuit board away from the space transformer has a second degree of flatness. The first degree of flatness is less than the second degree of flatness.Type: ApplicationFiled: January 4, 2019Publication date: July 11, 2019Inventors: Hsien-Ta HSU, Yu-Chen HSU, Ching-Hua WU, Kuan-Chun CHOU, Horng-Kuang FAN
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Patent number: 10119991Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.Type: GrantFiled: March 25, 2015Date of Patent: November 6, 2018Assignee: MPI CORPORATIONInventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu, Shang-Jung Hsieh
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Publication number: 20180024163Abstract: A method of making a cantilever MEMS probe module includes the steps of forming a cantilever MEMS probe on a first surface of a circuit substrate by a MEMS fabrication process in a way that the cantilever MEMS probe has a support post electrically and mechanically connected with an electric contact of the first surface, a cantilever arm connected with the support post, and a needle connected with the cantilever arm, and forming a through hole penetrating through the first surface and a second surface opposite to the first surface of the circuit substrate and corresponding in position to the needle and a part of the cantilever arm by using a cutting tool to cut the circuit substrate from the second surface toward the first surface of the circuit substrate. A probe module made by the method is disclosed too.Type: ApplicationFiled: July 18, 2017Publication date: January 25, 2018Inventors: YU-CHEN HSU, YU-WEN WANG, HORNG-KUANG FAN, MAO-FA SHEN
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Publication number: 20170192036Abstract: A probe structure includes a tube body and a pin body. The tube body has a central axis and includes a first rigid section, a first spring section, a second rigid section, and a second spring section. The first spring section surrounds the central axis and extends in a direction along the central axis. Two ends of the first spring section connect to one end of the first rigid section and one end of the second rigid section. The first spring section and the second spring section are different in spring constant. The pin body passes through and is disposed in the tube body. The pin body has a head section protruding out of the first rigid section, and the head section is fastened to the first rigid section.Type: ApplicationFiled: October 26, 2016Publication date: July 6, 2017Inventors: Yi-Chien Tsai, Yi-Lung Lee, Horng-Kuang Fan
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Publication number: 20170082656Abstract: A probe card includes a probe seat having upper and lower dies and a probe accommodating hole, a spring probe inserted through the probe accommodating hole and including a spring sleeve having upper and lower non-spring sections, and a circuit board disposed on the upper die and having a contact pad against which the spring probe is abutted. At least one of the upper and lower dies has a stopping surface partially facing the probe accommodating hole and an extended portion inserting hole in alignment with the probe accommodating hole. At least one of the upper and lower non-spring sections has a cylinder portion abutted on the stopping surface and an extended portion inserted through the extended portion inserting hole.Type: ApplicationFiled: September 23, 2016Publication date: March 23, 2017Inventors: Tsung-Yi CHEN, Ting-Hsin KUO, Yi-Lung LEE, Shih-Shin CHEN, Horng-Chuan SUN, Horng-Kuang FAN
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Patent number: 9506949Abstract: A spring probe includes a spring sleeve and a needle having a body located inside the spring sleeve and a head protruded out of a lower non-spring section of the spring sleeve and having a stopping block. The lower non-spring section is abutted against and fixed to the stopping block, facilitating assembly of the spring probe. A method for manufacturing the spring probe is disclosed including the steps of forming a spring sleeve having a lower non-spring section with a slot and a guiding sheet adjacent to the slot by photolithography technique, manufacturing a needle having a stopping block with a bonding pad and an engagement rib by MEMS manufacturing process, sleeving the spring sleeve onto the needle to engage the engagement rib into the slot, and fixing the guiding sheet and the needle together by reflow soldering the bonding pad.Type: GrantFiled: January 26, 2015Date of Patent: November 29, 2016Assignee: MPI CORPORATIONInventors: Yi-Lung Lee, Horng-Kuang Fan
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Patent number: 9470715Abstract: A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer.Type: GrantFiled: January 8, 2014Date of Patent: October 18, 2016Assignee: MPI CorporationInventors: Horng-Kuang Fan, Hsien-Ta Hsu
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Patent number: 9465050Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.Type: GrantFiled: March 10, 2015Date of Patent: October 11, 2016Assignee: MPI CORPORATIONInventors: Tsung-Yi Chen, Horng-Kuang Fan, Ching-Hung Yang, Chung-Tse Lee, Chia-Yuan Kuo, Tien-Chia Li, Ting-Ju Wu
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Patent number: 9423424Abstract: A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current.Type: GrantFiled: January 10, 2014Date of Patent: August 23, 2016Assignee: MPI CORPORATIONInventors: Hsien-Ta Hsu, Horng-Kuang Fan
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Publication number: 20150355235Abstract: A probe for a probe head having lower and upper dies includes a main portion, a conductive portion stacked on at least a part of the main portion, an attachment layer covering the main portion and the conductive portion, a skin effect layer covering the attachment layer, and a stopping portion for being abutted against the lower or upper die. The main portion includes a first material. The conductive portion includes a second material. The skin effect layer includes a third material. The electrical conductivity of the third material is greater than that of the second material. The electrical conductivity of the second material is greater than that of the first material. The hardness of the first material is greater than that of the second material, and also greater than that of the third material.Type: ApplicationFiled: June 5, 2015Publication date: December 10, 2015Inventors: Yu-Chen HSU, Shao-Lun WEI, Horng-Kuang FAN
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Publication number: 20150276800Abstract: A vertical probe device includes a lower die having engaging holes and needle holes, a positioning film having limiting holes and needle holes, probe needles inserted through the needle holes, and supporters having at least an upper stopping surface and at least a lower stopping surface for moveably limiting the positioning film therebetween. Each supporter has a head, a neck passing through the limiting hole and having a length longer than the thickness of the positioning film, a body, and a tail inserted into the engaging hole, which are connected in order, and at least one of the upper and lower stopping surfaces. The supporters can prevent the positioning film from being lifted and flipped over and enables the positioning film to move so that the probe needles are reliable.Type: ApplicationFiled: March 25, 2015Publication date: October 1, 2015Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU, Shang-Jung HSIEH
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Publication number: 20150253358Abstract: An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.Type: ApplicationFiled: March 10, 2015Publication date: September 10, 2015Inventors: Tsung-Yi CHEN, Horng-Kuang FAN, Ching-Hung YANG, Chung-Tse LEE, Chia-Yuan KUO, Tien-Chia LI, Ting-Ju WU
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Publication number: 20150247882Abstract: A spring probe includes a spring sleeve and a needle having a body located inside the spring sleeve and a head protruded out of a lower non-spring section of the spring sleeve and having a stopping block. The lower non-spring section is abutted against and fixed to the stopping block, facilitating assembly of the spring probe. A method for manufacturing the spring probe is disclosed including the steps of forming a spring sleeve having a lower non-spring section with a slot and a guiding sheet adjacent to the slot by photolithography technique, manufacturing a needle having a stopping block with a bonding pad and an engagement rib by MEMS manufacturing process, sleeving the spring sleeve onto the needle to engage the engagement rib into the slot, and fixing the guiding sheet and the needle together by reflow soldering the bonding pad.Type: ApplicationFiled: January 26, 2015Publication date: September 3, 2015Inventors: Yi-Lung LEE, Horng-Kuang FAN
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Patent number: 9110130Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.Type: GrantFiled: July 8, 2011Date of Patent: August 18, 2015Assignee: MPI CorporationInventors: Ming-Chi Chen, Horng-Kuang Fan, Mao-Fa Shen, Ming-Chu Chueh, Bang-Shun Liu, Che-Wei Lin
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Patent number: 9000794Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.Type: GrantFiled: May 22, 2012Date of Patent: April 7, 2015Assignee: MPI CorporationInventors: Yi-Lung Lee, Chih-Chung Chen, Tsung-Yi Chen, Horng-Kuang Fan
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Publication number: 20140197860Abstract: A current-diverting guide plate for use in a probe module is disclosed to include a plate body having a first surface, a second surface opposite to the first surface, and a plurality of through holes penetrating through the first and second surfaces. A conducting layer is provided at a periphery wall of each through hole of the plate body and electrically coupled to a probe slidably inserted through the through holes. A current-diverting circuit trace is disposed on the first surface of the plate body and electrically connected with the conducting layers for diverting the electric current flowing through probes. Thus, the current-diverting guide plate can be used to prevent the probes from possible damage due to an excessive instantaneous current.Type: ApplicationFiled: January 10, 2014Publication date: July 17, 2014Applicant: MPI CORPORATIONInventors: Hsien-Ta HSU, Horng-Kuang FAN
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Publication number: 20140197859Abstract: A probe head includes a plate, a probe, and at least one composite coating layer. The plate has at least one through hole therein. The probe is at least partially disposed in the through hole of the plate. The composite coating layer includes a metal layer and a plurality of lubricating particles. The metal layer is disposed in the through hole of the plate and between the plate and the probe. The lubricating particles are dispersed in the metal layer.Type: ApplicationFiled: January 8, 2014Publication date: July 17, 2014Applicant: MPI CorporationInventors: Horng- Kuang FAN, Hsien-Ta HSU
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Publication number: 20120299612Abstract: An elastic micro high frequency probe includes a conductor, which includes a stationary body and a movable body. The stationary body has a conductive terminal, a contacting end, and a guider. The movable body has a conductive terminal, a spring mechanism, and a guider. The spring mechanism is connected to the stationary body and to one conductive terminal. The second guider connects to the spring mechanism in such a manner that the compression direction of the spring mechanism is confined by a guiding rail. Since the width of the spring mechanism is not limited by the first and second guiders, the width of the spring mechanism can be enlarged to maximize within limited space. Therefore, the HF probe as a whole can have shortest length while acquiring the predetermined total length of the elastic stroke, such that the transmission performance of the high frequency signals can be effectively enhanced.Type: ApplicationFiled: May 22, 2012Publication date: November 29, 2012Inventors: Yi-Lung Lee, Chih-Chung Chen, Tsung-Yi Chen, Horng-Kuang Fan