Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract: A probe card mainly includes a circuit board, a probe assembly, an elastic support assembly, a plurality of level maintaining assemblies and a turning secure assembly. The circuit board has pads and spring bores. The probe assembly has a electrical signal transform board and probes on it. The elastic support assembly has a fixed plate, a locking plate and a plurality of springs. The springs are received in the spring bores of the circuit board to urge the electrical signal transform board for absorption of a height difference of the electrical signal transform board when the electrical signal transform board is inclined.

Abstract: A probe card mainly includes a circuit board, a probe assembly, an elastic support assembly, a plurality of level maintaining assemblies and a turning secure assembly. The circuit board has pads and spring bores. The probe assembly has a electrical signal transform board and probes on it. The elastic support assembly has a fixed plate, a locking plate and a plurality of springs. The springs are received in the spring bores of the circuit board to urge the electrical signal transform board for absorption of a height difference of the electrical signal transform board when the electrical signal transform board is inclined.

Abstract: The probe card comprises a primary circuit board with a plurality of signal contacts, a probe assembly including a plurality of probes electrically connected to the signal contact and an adjusting assembly for adjusting the coplanarity between the probe assembly and a device under test. The adjusting assembly comprises a groove plate with a plurality of grooves, a wedge positioned in the groove, at least one adjusting pin connecting the wedge and the probe assembly and at least one screw positioned at one side of the wedge. The wedge comprises an inclined surface, and one end of the adjusting pin contacts the inclined surface of the wedge and the other end contacts the probe assembly. The circuit probe card moves the wedge laterally to further move the adjusting pin upwards and downwards, so that to the coplanarity between the probe assembly and the device under test can be adjusted.

Abstract: The probe card comprises a primary circuit board with a plurality of signal contacts, a probe assembly including a plurality of probes electrically connected to the signal contact and an adjusting assembly for adjusting the coplanarity between the probe assembly and a device under test. The adjusting assembly comprises a groove plate with a plurality of grooves, a wedge positioned in the groove, at least one adjusting pin connecting the wedge and the probe assembly and at least one screw positioned at one side of the wedge. The wedge comprises an inclined surface, and one end of the adjusting pin contacts the inclined surface of the wedge and the other end contacts the probe assembly. The circuit probe card moves the wedge laterally to further move the adjusting pin upwards and downwards, so that to the coplanarity between the probe assembly and the device under test can be adjusted.

Abstract: A latch mechanism for a wafer container includes a box sealable to a base plate to form an air-tight space for holding at least one wafer therein. The latch mechanism is located on the base plate and includes a U-shaped latch plate and a cam mechanism. The latch plate has a hook member at a front end thereof. The hook member includes a 7-shape hook with a bottom end pivotly engaged with the base plate and a top end pivotly engaged with the front end of the latch plate. The cam mechanism includes a cam and a linkage bar with a roller disposed therein. One end of the linkage bar attached to the latch plate. Another end of the linkage bar has a pin engaging with a slot formed in the cam. The pin and the roller form a positive and movable engagement with the cam. By turning the cam, the linkage bar and latch plate will have linear motion and trigger the hook to engage the box securely to the base plate or allow the box disengaging with the base plate.

Abstract: Disclosed is a wafer retaining mechanism comprising a box, and more than one link unit affixed to appropriate locations of the box, the link units being operative in coordination with a wafer cassette and a chassis for retaining securely the wafers received within the cassette. The links each comprises a sliding link, a lower link, a front link, an upper link, and associated pins.