Patents by Inventor Horst Gröninger

Horst Gröninger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof
    Publication number: 20070113305
    Abstract: An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having carbonized plastic and/or agglomerated nanoparticles. The conductors are connected to the connections of the components and/or to external connections of the electronic device.
    Type: Application
    Filed: May 4, 2004
    Publication date: May 17, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Thomas Bemmerl, Markus Flink, Edward Fuergut, Horst Groeninger, Hermann Vilsmeier
  • Method for Contacting Semiconductor Components with a Test Contact
    Publication number: 20070007514
    Abstract: A method for contacting an external contact area with a test contact is provided. The external contact area has a galvanically applied coating of a metal or a metal alloy. Before the contact is established between the external contact area and the test contact, the external contact area is wetted with a fluid including an inhibitor which contains an aliphatic hydrocarbon, a binder such as a white mineral oil and/or ethyl acetate, and a lubricant. The fluid lowers the contact resistance between the external contact area and the test contact.
    Type: Application
    Filed: July 7, 2006
    Publication date: January 11, 2007
    Inventor: Horst Groeninger
  • Electronic component and leadframe for producing the component
    Publication number: 20060151879
    Abstract: An electronic component includes a semiconductor chip and a leadframe. The leadframe includes a metal coating pattern on its underside to facilitate the application of solder to the electronic component. The metal coating pattern includes wetting regions that are wettable with solder material and anti-wetting regions that are unwettable with solder material, and the electronic component includes solder deposits formed on the wetting regions on the underside of the component.
    Type: Application
    Filed: January 17, 2006
    Publication date: July 13, 2006
    Inventors: Georg Ernst, Horst Groeninger, Simon Jerebic, Thomas Zeiler
  • Method and apparatus for the production of an electronic component with external contact areas
    Publication number: 20050140009
    Abstract: A method is provided for producing an electronic component with external contact areas which have a layer of metal, the thickness of the layer of the external contact areas decreasing from a central region to a border region. To realize a layer of this type, the electronic component is fluidically processed after its completion, such that the electronic component is heated in a protective gas atmosphere containing formic acid vapor up to at least the flow temperature of the surface of the layer.
    Type: Application
    Filed: December 16, 2004
    Publication date: June 30, 2005
    Inventor: Horst Groeninger
  • Integrated circuit packages with marked product tracking information
    Publication number: 20040257230
    Abstract: An integrated circuit package having at least a product identity information and a product tracking information. The integrated circuit package includes an integrated circuit device and a package body. The package body has a top surface and a bottom surface. The product tracking information is located on the top surface of the package body and indicates a unique orientation of the integrated circuit device.
    Type: Application
    Filed: May 12, 2004
    Publication date: December 23, 2004
    Inventor: Horst Groeninger
  • Method of producing an integrated circuit and an integrated circuit
    Patent number: 6649450
    Abstract: A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor tracks and an area of the plastic housing surrounding the relevant dividing surface, as viewed in plan view of the dividing surface, a spacing is provided in each case.
    Type: Grant
    Filed: December 18, 2001
    Date of Patent: November 18, 2003
    Assignee: Infineon Technologies AG
    Inventors: Georg Ernst, Horst Gröninger, Thomas Zeiler