Patents by Inventor Howard E. Grunes
Howard E. Grunes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20130168232Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: ApplicationFiled: February 25, 2013Publication date: July 4, 2013Inventors: Jaim NULMAN, Sergio EDELSTEIN, Mani SUBRAMANI, Zheng XU, Howard E. GRUNES, Avi TEPMAN, John C. FORSTER, Praburam GOPALRAJA
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Patent number: 8398832Abstract: A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.Type: GrantFiled: September 15, 2005Date of Patent: March 19, 2013Assignee: Applied Materials Inc.Inventors: Jaim Nulman, Sergio Edelstein, Mani Subramani, Zheng Xu, Howard E. Grunes, Avi Tepman, John C. Forster, Praburam Gopalraja
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Patent number: 7138014Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.Type: GrantFiled: January 28, 2002Date of Patent: November 21, 2006Assignee: Applied Materials, Inc.Inventors: Joseph J. Stevens, Dmitry Lubomirsky, Ian Pancham, Donald J. K. Olgado, Howard E. Grunes, Yeuk-Fai Edwin Mok
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Patent number: 7048837Abstract: Plasma etching or resputtering of a layer of sputtered materials including opaque metal conductor materials may be controlled in a sputter reactor system. In one embodiment, resputtering of a sputter deposited layer is performed after material has been sputtered deposited and while additional material is being sputter deposited onto a substrate. A path positioned within a chamber of the system directs light or other radiation emitted by the plasma to a chamber window or other optical view-port which is protected by a shield against deposition by the conductor material. In one embodiment, the radiation path is folded to reflect plasma light around the chamber shield and through the window to a detector positioned outside the chamber window.Type: GrantFiled: September 11, 2003Date of Patent: May 23, 2006Assignee: Applied Materials, Inc.Inventors: Sasson R. Somekh, Marc O. Schweitzer, John C. Forster, Zheng Xu, Roderick C. Mosely, Barry L. Chin, Howard E. Grunes
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Patent number: 6824612Abstract: A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.Type: GrantFiled: December 26, 2001Date of Patent: November 30, 2004Assignee: Applied Materials, Inc.Inventors: Joseph J. Stevens, Dmitry Lubomirsky, Ian Pancham, Donald J. Olgado, Howard E. Grunes, Yeuk-Fai Edwin Mok, Girish Dixit
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Publication number: 20040083021Abstract: A system, method and medium for facilitating communication between tools in a semiconductor (e.g., wafer) processing facility. In particular, the present invention provides greater control of the overall semiconductor product output of groups of tools in terms of the quantity and/or quality of a final semiconductor product.Type: ApplicationFiled: October 17, 2003Publication date: April 29, 2004Applicant: Applied Materials, Inc.Inventors: Sasson Somekh, Howard E. Grunes
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Publication number: 20040055893Abstract: A method and apparatus for electrochemically plating on a production surface of a substrate are provided. The apparatus generally includes a plating cell having a plating solution reservoir configured to contain a volume of an electrochemical plating solution, and a substrate support member positioned above the plating solution reservoir, the substrate support member being configured to electrically engage a non-production side of a substrate secured thereto.Type: ApplicationFiled: September 23, 2002Publication date: March 25, 2004Applicant: Applied Materials, Inc.Inventors: Dmitry Lubomirsky, Michael X. Yang, Sheshraj Tulshibagwale, Yezdi Dordi, Howard E. Grunes, Jick M. Yu, Fusen Chen
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Patent number: 6640151Abstract: A system/method for interactively monitoring and adjusting product output from a module that includes two or more preparation tools. The output is a result of the coordinated effort of the two or more semiconductor preparation tools making up the module. The first of the tools is capable of implementing a first process on a semiconductor product and producing a first output. The second of the tools is configured to receive as input the first output from the first tool. The second tool is also capable of implementing a second process on the semiconductor product and producing a second output. A module control mechanism is capable of facilitating the exchange of information between the first tool and the second tool so that the module yields a desired semiconductor product output. Certain information can also be exchanged between the first and second tools. Other system/method embodiments for output/production control are also envisioned.Type: GrantFiled: December 22, 1999Date of Patent: October 28, 2003Assignee: Applied Materials, Inc.Inventors: Sasson Somekh, Howard E. Grunes
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Publication number: 20030196901Abstract: A method for chemical plating a substrate is provided. Embodiments of the method include evacuating an enclosure having a substrate disposed therein under vacuum, filling the enclosure with an electrolyte solution having a pressure between about 0.5 atm and about 200 atm, chemical plating a metal layer on a surface of the substrate, and draining the electrolyte solution from the enclosure. In another aspect, the method includes energizing an ultrasonic source to agitate the electrolyte solution substantially simultaneous with the step of chemical plating a metal layer on a surface of the substrate. In still another aspect, the method includes varying the pressure of the plating cell to agitate the electrolyte solution. In yet another aspect, the method includes increasing a pressure of the electrolyte solution by heating the electrolyte solution.Type: ApplicationFiled: April 23, 2002Publication date: October 23, 2003Applicant: Applied Materials, Inc.Inventor: Howard E. Grunes
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Publication number: 20030141018Abstract: An apparatus and a method of depositing a catalytic layer comprising at least one metal selected from the group consisting of noble metals, semi-noble metals, alloys thereof, and combinations thereof in sub-micron features formed on a substrate. Examples of noble metals include palladium and platinum. Examples of semi-noble metals include cobalt, nickel, and tungsten. The catalytic layer may be deposited by electroless deposition, electroplating, or chemical vapor deposition. In one embodiment, the catalytic layer may be deposited in the feature to act as a barrier layer to a subsequently deposited conductive material. In another embodiment, the catalytic layer may be deposited over a barrier layer. In yet another embodiment, the catalytic layer may be deposited over a seed layer deposited over the barrier layer to act as a “patch” of any discontinuities in the seed layer. Once the catalytic layer has been deposited, a conductive material, such as copper, may be deposited over the catalytic layer.Type: ApplicationFiled: January 28, 2002Publication date: July 31, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Joseph J. Stevens, Dmitry Lubomirsky, Ian Pancham, Donald J. K. Olgado, Howard E. Grunes, Yeuk-Fai Edwin Mok
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Publication number: 20030118732Abstract: A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.Type: ApplicationFiled: December 26, 2001Publication date: June 26, 2003Inventors: Joseph J. Stevens, Dmitry Lubomirsky, Ian Pancham, Donald J. Olgado, Howard E. Grunes, Yeuk-Fai Edwin Mok, Girish Dixit
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Patent number: 6575737Abstract: A transfer chamber is provided. The transfer chamber has a temperature adjustment plate located in an upper portion of the chamber, a substrate handler located in a lower portion of the chamber, and a rotatable substrate carriage adapted so as to raise and lower between an elevation above a substrate supporting surface of the temperature adjustment plate, and an elevation below a substrate supporting blade of the substrate handler. The rotatable substrate carriage is adapted to transfer a substrate to and from the substrate supporting surfaces of the temperature adjustment plate, and of the substrate handler blade.Type: GrantFiled: July 7, 2000Date of Patent: June 10, 2003Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Alexey Goder, Evgueni Gantvarg, Howard E Grunes
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Patent number: 6486444Abstract: The present invention generally provides a vacuum system having a small-volume load-lock chamber for supporting a substrate set of only two rows of substrates, which provides for quick evacuation and venting of the load-lock chamber to provide a continuous feed load-lock chamber. More particularly, the present invention provides a transfer chamber; one or more processing chambers connected to the transfer chamber; a substrate handling robot disposed in the transfer chamber; and at least one load-lock chamber connected to the transfer chamber, and having one or more substrate support members for supporting one or more stacks of only two substrates per stack. Another aspect of the invention provides a staging, or storage rack associated with or integrated with the load-lock chamber. More particularly, the staging, or storage rack may be located outside the transfer chamber and accessible by a staging robot serving the load-lock chamber.Type: GrantFiled: February 17, 2000Date of Patent: November 26, 2002Assignee: Applied Materials, Inc.Inventors: Kevin Fairbairn, Howard E. Grunes, Christopher Lane, Kelly A. Colborne
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Publication number: 20020170672Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. Numerous other aspects are provided.Type: ApplicationFiled: July 11, 2002Publication date: November 21, 2002Inventors: Ilya Perlov, Alexey Goder, Eugene Gantvarg, Howard E. Grunes
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Patent number: 6468353Abstract: A method and apparatus are provided for substrate handling. In a first aspect, a temperature adjustment plate is located below a substrate carriage and is configured such that a substrate may be transferred between the temperature adjustment plate and the substrate carriage by lifting and lowering the substrate carriage above and below the top surface of the temperature adjustment plate. The temperature adjustment plate may be configured to heat and/or cool a substrate positioned thereon. In a second aspect, the substrate carriage is magnetically coupled so as to rotate and/or lift and lower magnetically, thereby reducing particle generation via contact between moving parts (and potential chamber contamination therefrom). In a third aspect, a substrate handler positioned below the substrate carriage is both magnetically coupled and magnetically levitated, providing further particle reduction.Type: GrantFiled: March 29, 2000Date of Patent: October 22, 2002Assignee: Applied Materials, Inc.Inventors: Ilya Perlov, Alexey Goder, Eugene Gantvarg, Howard E. Grunes
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Patent number: 6409890Abstract: Embodiments include devices and methods for sputtering material onto a workpiece in a chamber which includes a plasma generation area and a target. A coil is positioned to inductively couple energy into the plasma generation area to generate a plasma. A body is positioned between the workpiece and the target to prevent an amount of target material from being sputtered onto the workpiece. The body prevents an amount of target material from being sputtered onto the workpiece. The body may act as a dark space shield and inhibit plasma formation between the body and the target. The body may also act as a physical shield to block sputtered material from accumulating on the workpiece.Type: GrantFiled: July 27, 1999Date of Patent: June 25, 2002Assignee: Applied Materials, Inc.Inventors: Howard E. Grunes, Zheng Xu, Praburam Gopalraja, John C. Forster, Ralf Hofmann, Anantha Subramani
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Publication number: 20020006322Abstract: A pod opening station moves a wafer-carrying pod horizontally to engage a door of the pod with a pod door receiver. The pod door receiver removes and holds the pod door with no vertical movement thereof. The pod is then moved horizontally in a reverse direction a short distance away from the pod door receiver. Then the pod is moved vertically into alignment with an opening in an interface wall. A wafer handler blade is extended through the opening into the pod. The pod is indexed downwardly to transfer a wafer to the wafer handler blade. The wafer handler blade then retracts to remove the wafer from the pod.Type: ApplicationFiled: June 14, 2001Publication date: January 17, 2002Applicant: Applied Materials, Inc.Inventors: Ilya Perlov, Eugene Gantvarg, Howard E. Grunes, Alexey Goder
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Publication number: 20010041121Abstract: A fabrication tool in which a single vacuum processing chamber is coupled to a load lock/transfer chamber (a chamber that functions both as a load lock and contains a substrate handler). A substrate handler transfers a substrate (preferably along a straight line) between the load lock/transfer chamber and the vacuum processing chamber. The load lock transfer chamber may contain one or more substrate storage locations such that a first substrate may be stored therein while a second substrate is processed. Thus, the load lock/transfer chamber need only pump and vent between vacuum and atmospheric pressure once for every two substrates processed within the vacuum processing chamber. The substrate storage locations may be coupled to a temperature adjustment mechanism for heating and/or cooling a stored substrate.Type: ApplicationFiled: February 27, 2001Publication date: November 15, 2001Inventors: Howard E. Grunes, Ilya Perlov
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Patent number: 5656093Abstract: A wafer spacing mask for supporting a workpiece in a spaced apart relation to a workpiece support chuck. More specifically, the wafer spacing mask contains a plurality of metallic support members deposited upon the support surface of the chuck. The support members maintain a wafer, or other workpiece, in a spaced apart relation to the support surface of the chuck. The distance between the underside surface of the wafer and the chuck is defined by the thickness of the support members. This distance should be larger than the expected diameter of contaminant particles that may lie on the surface of the chuck. In this manner, the contaminant particles do not adhere to the underside of the wafer during processing.Type: GrantFiled: March 8, 1996Date of Patent: August 12, 1997Assignee: Applied Materials, Inc.Inventors: Vincent E. Burkhart, Michael N. Sugarman, Howard E. Grunes
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Patent number: 5556248Abstract: A semiconductor cassette and transfer system for facilitating the direct loading and unloading of wafers from different sides of a cassette by a first robot handling device moveable along a first extension axis and second robot handling device moveable along a second extension axis intersecting said first extension axis at an acute angle, and at a predetermined point concurrent with the center of the cassette as it is disposed in a fixed position within a loadlock chamber of a wafer processing apparatus.Type: GrantFiled: January 30, 1995Date of Patent: September 17, 1996Assignee: Applied Materials, Inc.Inventor: Howard E. Grunes