Patents by Inventor Howard Heck
Howard Heck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8538698Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: GrantFiled: January 30, 2013Date of Patent: September 17, 2013Assignee: Live Oak MinistriesInventor: Jay Howard Heck, Sr.
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Patent number: 8380436Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: GrantFiled: January 10, 2012Date of Patent: February 19, 2013Assignee: Live Oak MinistriesInventor: Jay Howard Heck, Sr.
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Publication number: 20120109602Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: ApplicationFiled: January 10, 2012Publication date: May 3, 2012Applicant: LIVE OAK MINISTRIESInventor: Jay Howard Heck, SR.
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Patent number: 8099240Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: GrantFiled: September 24, 2010Date of Patent: January 17, 2012Assignee: Live Oak MinistriesInventor: Jay Howard Heck, Sr.
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Patent number: 7977581Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: GrantFiled: April 9, 2010Date of Patent: July 12, 2011Assignee: Intel CorporationInventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
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Publication number: 20110010149Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, bore-hole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one ex-plosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: ApplicationFiled: September 24, 2010Publication date: January 13, 2011Applicant: LIVE OAK MINISTRIESInventor: Jay Howard Heck, SR.
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Patent number: 7800459Abstract: In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.Type: GrantFiled: December 29, 2006Date of Patent: September 21, 2010Assignee: Intel CorporationInventors: Stephen H. Hall, Michael T. White, Howard Heck, Bryce D. Horine
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Publication number: 20100202118Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: ApplicationFiled: April 9, 2010Publication date: August 12, 2010Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
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Patent number: 7723618Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: GrantFiled: August 18, 2008Date of Patent: May 25, 2010Assignee: Intel CorporationInventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
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Publication number: 20090119078Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: ApplicationFiled: July 25, 2008Publication date: May 7, 2009Applicant: LIVE OAK MINISTRIESInventor: Jay Howard Heck, SR.
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Publication number: 20080308306Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: ApplicationFiled: August 18, 2008Publication date: December 18, 2008Applicant: Intel CorporationInventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
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Patent number: 7427719Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: GrantFiled: March 21, 2006Date of Patent: September 23, 2008Assignee: Intel CorporationInventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
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Patent number: 7418373Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.Type: GrantFiled: August 3, 2004Date of Patent: August 26, 2008Assignee: Live Oak MinistriesInventor: Jay Howard Heck, Sr.
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Publication number: 20080172872Abstract: In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.Type: ApplicationFiled: March 26, 2008Publication date: July 24, 2008Applicant: INTEL CORPORATIONInventors: Stephen H. Hall, Bryce D. Horine, Gary A. Brist, Howard Heck
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Publication number: 20080157903Abstract: In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.Type: ApplicationFiled: December 29, 2006Publication date: July 3, 2008Inventors: Stephen H. Hall, Michael T. White, Howard Heck, Bryce D. Horine
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Publication number: 20070235214Abstract: A printed circuit board structure includes a plurality of layers. The plurality of layers includes at least one metal layer or partial metal layer and at least one dielectric layer of a first type. The plurality of layers also includes two dielectric layers of a second type that is different from the first type. The at least one dielectric layer of the first type is between the two dielectric layers of the second type. The dielectric layers of the second type have a moisture absorption characteristic not in excess of 0.1%.Type: ApplicationFiled: March 30, 2006Publication date: October 11, 2007Inventors: Stephen Hall, Bryce Horine, Gary Brist, Howard Heck
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Publication number: 20070223205Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.Type: ApplicationFiled: March 21, 2006Publication date: September 27, 2007Inventors: Tao Liang, Stephen Hall, Howard Heck, Gary Brist, Bryce Horine
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Patent number: 7271680Abstract: A method, system, and apparatus for high data rate parallel plate mode signaling.Type: GrantFiled: June 29, 2005Date of Patent: September 18, 2007Assignee: Intel CorporationInventors: Stephen Hall, Tao Liang, Howard Heck, Bryce Horine, Gary Brist
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Publication number: 20070145595Abstract: In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.Type: ApplicationFiled: December 27, 2005Publication date: June 28, 2007Inventors: Stephen Hall, Bryce Horine, Gary Brist, Howard Heck
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Publication number: 20070001907Abstract: A method, system, and apparatus for high data rate parallel plate mode signaling.Type: ApplicationFiled: June 29, 2005Publication date: January 4, 2007Inventors: Stephen Hall, Tao Liang, Howard Heck, Bryce Horine, Gary Brist