Patents by Inventor Howard Heck

Howard Heck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8538698
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: September 17, 2013
    Assignee: Live Oak Ministries
    Inventor: Jay Howard Heck, Sr.
  • Patent number: 8380436
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Grant
    Filed: January 10, 2012
    Date of Patent: February 19, 2013
    Assignee: Live Oak Ministries
    Inventor: Jay Howard Heck, Sr.
  • Publication number: 20120109602
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Application
    Filed: January 10, 2012
    Publication date: May 3, 2012
    Applicant: LIVE OAK MINISTRIES
    Inventor: Jay Howard Heck, SR.
  • Patent number: 8099240
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: January 17, 2012
    Assignee: Live Oak Ministries
    Inventor: Jay Howard Heck, Sr.
  • Patent number: 7977581
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: July 12, 2011
    Assignee: Intel Corporation
    Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
  • Publication number: 20110010149
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, bore-hole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one ex-plosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Application
    Filed: September 24, 2010
    Publication date: January 13, 2011
    Applicant: LIVE OAK MINISTRIES
    Inventor: Jay Howard Heck, SR.
  • Patent number: 7800459
    Abstract: In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: September 21, 2010
    Assignee: Intel Corporation
    Inventors: Stephen H. Hall, Michael T. White, Howard Heck, Bryce D. Horine
  • Publication number: 20100202118
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Application
    Filed: April 9, 2010
    Publication date: August 12, 2010
    Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
  • Patent number: 7723618
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Grant
    Filed: August 18, 2008
    Date of Patent: May 25, 2010
    Assignee: Intel Corporation
    Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
  • Publication number: 20090119078
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Application
    Filed: July 25, 2008
    Publication date: May 7, 2009
    Applicant: LIVE OAK MINISTRIES
    Inventor: Jay Howard Heck, SR.
  • Publication number: 20080308306
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Application
    Filed: August 18, 2008
    Publication date: December 18, 2008
    Applicant: Intel Corporation
    Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
  • Patent number: 7427719
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Grant
    Filed: March 21, 2006
    Date of Patent: September 23, 2008
    Assignee: Intel Corporation
    Inventors: Tao Liang, Stephen H. Hall, Howard Heck, Gary A. Brist, Bryce Horine
  • Patent number: 7418373
    Abstract: Methods for evaluating drill pattern parameters such as burden, spacing, borehole diameter, etc., at a blast site are disclosed. One method involves accumulating the burden contributed by successive layers of rock and matching the accumulated rock burden to a target value for a borehole having a length related to the average height of the layers. Another method relates to varying drill pattern parameters and characteristics to match blast design constraints, including the substitution of one explosive material for another by the proper balance of materials and/or output energies to the associated rock burden. Analysis of deviations from target rock burdens and corrective measures are disclosed, as well as cost optimization methods. The various methods can be practiced using an appropriately programmed general purpose computer.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: August 26, 2008
    Assignee: Live Oak Ministries
    Inventor: Jay Howard Heck, Sr.
  • Publication number: 20080172872
    Abstract: In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.
    Type: Application
    Filed: March 26, 2008
    Publication date: July 24, 2008
    Applicant: INTEL CORPORATION
    Inventors: Stephen H. Hall, Bryce D. Horine, Gary A. Brist, Howard Heck
  • Publication number: 20080157903
    Abstract: In some embodiments an interconnect includes a waveguide and a transmission line coupled in parallel with the waveguide. Other embodiments are described and claimed.
    Type: Application
    Filed: December 29, 2006
    Publication date: July 3, 2008
    Inventors: Stephen H. Hall, Michael T. White, Howard Heck, Bryce D. Horine
  • Publication number: 20070235214
    Abstract: A printed circuit board structure includes a plurality of layers. The plurality of layers includes at least one metal layer or partial metal layer and at least one dielectric layer of a first type. The plurality of layers also includes two dielectric layers of a second type that is different from the first type. The at least one dielectric layer of the first type is between the two dielectric layers of the second type. The dielectric layers of the second type have a moisture absorption characteristic not in excess of 0.1%.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 11, 2007
    Inventors: Stephen Hall, Bryce Horine, Gary Brist, Howard Heck
  • Publication number: 20070223205
    Abstract: An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis.
    Type: Application
    Filed: March 21, 2006
    Publication date: September 27, 2007
    Inventors: Tao Liang, Stephen Hall, Howard Heck, Gary Brist, Bryce Horine
  • Patent number: 7271680
    Abstract: A method, system, and apparatus for high data rate parallel plate mode signaling.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: September 18, 2007
    Assignee: Intel Corporation
    Inventors: Stephen Hall, Tao Liang, Howard Heck, Bryce Horine, Gary Brist
  • Publication number: 20070145595
    Abstract: In some embodiments a high speed interconnect includes a layer of FR4 material, a trench in the layer of FR4 material, and a pair of transmission lines located near the trench. The trench is filled with a homogenous material. Other embodiments are described and claimed.
    Type: Application
    Filed: December 27, 2005
    Publication date: June 28, 2007
    Inventors: Stephen Hall, Bryce Horine, Gary Brist, Howard Heck
  • Publication number: 20070001907
    Abstract: A method, system, and apparatus for high data rate parallel plate mode signaling.
    Type: Application
    Filed: June 29, 2005
    Publication date: January 4, 2007
    Inventors: Stephen Hall, Tao Liang, Howard Heck, Bryce Horine, Gary Brist