Abstract: A system configured to detect faults in signal lines. A system includes a first component configured to communicate with a second component via a signal path including one or more signal traces. Sense signal lines are manufactured such that at some point they are in close proximity to a signal trace which is to be monitored. The sense signal lines are configured to use parasitic coupling to redirect a portion of a signal conveyed via a signal trace to a monitoring component. The first component is configured to convey a test signal indicative of a type of test via the signal path, and a reference signal to the monitoring component. The monitoring component is configured to utilize the reference signal to ascertain a presence or absence, or characteristics of a received redirected signal. The monitoring component may optionally utilize a locally generated reference signal.

Abstract: An apparatus for cooling a number of electronic components comprises an enclosure within which the components are positioned, an arrangement for circulating a cooling fluid to the components so that the cooling fluid can evaporate on or proximate the components and thereby absorb the heat generated by the components, a mechanism for condensing the evaporated cooling fluid, and a reservoir which is in fluid communication with the circulating means and within which the condensed cooling fluid collects.

Abstract: An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.

Abstract: One embodiment of the present invention provides a system that facilitates adjusting the wavelengths of lasers via temperature control. This system includes a chip with an active face upon which active circuitry and signal pads reside. A thermal-control mechanism provides localized thermal control of two lasers mounted upon the active face of the chip. By individually controlling the temperature of the lasers, the thermal-control mechanism controls the wavelengths emitted by each respective laser. By creating a temperature gradient that causes a temperature difference between two or more lasers, the system can cause the lasers to emit different wavelengths.

Abstract: An electro-desorption actuator comprises a fixed member, a movable member which is coupled to the fixed member, a pressure chamber which is disposed between the fixed member and the movable member, and a sorption compression system which is in communication with the pressure chamber. The sorption compression system comprises first and second electrical conductors, a sorbent which is positioned between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, and a power supply which is connected to the conductors and which is selectively actuated to generate a current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction. The sorbate is communicated from the sorption compression system to the pressure chamber during the desorption reaction and from the pressure chamber back to the sorption compression system during the adsorption reaction.

Abstract: A system for cooling at least two electronic components comprises a plurality of graphitic foam products which are each thermally coupled to a corresponding component, a plurality of housings which are each mounted over a corresponding foam product and which each comprise an inlet and an outlet, a source of cooling fluid, and a conduit which is connected between the fluid source and each inlet. In operation, fluid is communicated from the fluid source to each housing through the conduit to thereby cool the components.

Abstract: One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active face upon which active circuitry and signal pads reside and a back face opposite the active face. The first and second semiconductor dies are positioned face-to-face within the assembly module so that signal pads on the first semiconductor die overlap with signal pads on the second semiconductor die, thereby facilitating capacitive communication between the first and second semiconductor dies. Additionally, the first and second semiconductor dies are pressed together between a first substrate and a second substrate so that a front side of the first substrate is in contact with the back face of the first semiconductor die and a front side of the second substrate is in contact with the back face of the second semiconductor die.

Abstract: A signal communication device for use within a computer includes a set of optical fibers configured to form an optical computer bus between a set of computer sub-system elements of a computer. A set of input optical connector cards are connected to the set of optical fibers. Each of the input optical connector cards includes a transmitting dynamic bandwidth allocator responsive to an optical bus clock signal operating at a multiple of a computer system clock signal such that a set of bus time slots are available for each computer system clock signal cycle. The transmitting dynamic bandwidth allocator allows a light signal to be applied to the optical computer bus during a dynamically assigned bus time slot. In this way, the optical computer bus bandwidth can be dynamically allocated to different computer sub-system elements during a single computer system clock signal cycle.

Abstract: One embodiment of the present invention provides an integrated circuit assembly module, including a first semiconductor die and a second semiconductor die, each semiconductor die with an active face upon which active circuitry and signal pads reside and a back face opposite the active face. The first and second semiconductor dies are positioned face-to-face within the assembly module so that signal pads on the first semiconductor die overlap with signal pads on the second semiconductor die, thereby facilitating capacitive communication between the first and second semiconductor dies. Additionally, the first and second semiconductor dies are pressed together between a first substrate and a second substrate so that a front side of the first substrate is in contact with the back face of the first semiconductor die and a front side of the second substrate is in contact with the back face of the second semiconductor die.

Abstract: A system for cooling at least two electronic components comprises a plurality of graphitic foam products which are each thermally coupled to a corresponding component, a plurality of housings which are each mounted over a corresponding foam product and which each comprise an inlet and an outlet, a source of cooling fluid, and a conduit which is connected between the fluid source and each inlet. In operation, fluid is communicated from the fluid source to each housing through the conduit to thereby cool the components.

Abstract: A electro-desorption compression system according to the present invention comprises an enclosure which includes first and second spaced-apart electrical conductors, a sorbent which is positioned in the enclosure between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, a power supply which is connected to the first and second conductors and which generates an electrical current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction, a controller which selectively activates the power supply to initiate and terminate each desorption reaction, and a transducer which is connected to the controller and which generates a signal indicative of the end of each desorption reaction.

Abstract: A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is subsequently deposited on the adhesion metal layer at low temperature to form a heat spreader.

Abstract: A electro-desorption compression system according to the present invention comprises an enclosure which includes first and second spaced-apart electrical conductors, a sorbent which is positioned in the enclosure between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, a power supply which is connected to the first and second conductors and which generates an electrical current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction, a controller which selectively activates the power supply to initiate and terminate each desorption reaction, and a transducer which is connected to the controller and which generates a signal indicative of the end of each desorption reaction.

Abstract: A electro-desorption compression system according to the present invention comprises an enclosure which includes first and second spaced-apart electrical conductors, a sorbent which is positioned in the enclosure between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, a power supply which is connected to the first and second conductors and which generates an electrical current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction, and a pressure chamber which is connected to the enclosure and which receives the sorbate from the enclosure during the desorption reaction and releases the sorbate into the enclosure during the adsorption reaction.

Abstract: To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.

Abstract: An apparatus and method are provided for bit synchronization in an optical time division multiplexed communication system. The apparatus is couplable to an optical gate, such as an optical demultiplexer. The apparatus includes a programmable optical delay line couplable to an input clock; an optical synchronizer coupled to the programmable optical delay line and couplable to the optical gate; and a processor coupled to the programmable optical delay line and to the optical synchronizer. The processor includes program instructions to track bit synchronization between a clock pulse and a selected data bit during a communication session; and when a bit tracking range is approaching a predetermined limit, the processor having further instructions to interrupt the communication session, return the bit tracking range to a zero offset and correspondingly adjust a programmable delay, and resume the communication session.

Abstract: Switching noise within an LGA-packaged or PGA-packaged IC Vdd and IC Vss nodes is reduced by spreading the electrical current in the bypass path to reduce the effective current loop area, and thus reduce the energy stored in the magnetic field surrounding the current path. This result is achieved by minimizing the horizontal components of the linkage paths between the IC nodes to be bypassed and the bypass capacitor. Since effective inductance Leff seen by the bypass capacitor is proportional to magnetic energy, Leff is reduced over a broad band of frequencies. For each bypass capacitor, a pair of conductive vias is formed. A first via is coupled to the LGA package Vcc plane and to the IC Vdd node, and a second via is coupled to the LGA package Vss plane and to the IC Vss node.

Abstract: Switching noise within an LGA-packaged or PGA-packaged IC Vdd and IC Vss nodes is reduced by spreading the electrical current in the bypass path to reduce the effective current loop area, and thus reduce the energy stored in the magnetic field surrounding the current path. This result is achieved by minimizing the horizontal components of the linkage paths between the IC nodes to be bypassed and the bypass capacitor. Since effective inductance Leff seen by the bypass capacitor is proportional to magnetic energy, Leff is reduced over a broad band of frequencies. For each bypass capacitor, a pair of conductive vias is formed. A first via is coupled to the LGA package Vcc plane and to the IC Vdd node, and a second via is coupled to the LGA package Vss plane and to the IC Vss node.

Abstract: To cool heat-emitting electronic components, a compact, non-moving-parts compressor, an evaporator in juxtaposition to the electronic components and a condenser are mounted as a unit, preferably within a vacuum can. A heat exchanger is mounted external to the can but in proximity to the condenser. The foregoing comprise a unit which may be detachably connected to a host pump and heat exchanger. The unit may be removed from the system of which it is a part for upgrade and maintenance. All its components are thermally isolated from the ambient atmosphere to prevent water vapor condensation corrosion.

Abstract: A electro-desorption compression system according to the present invention comprises an enclosure which includes first and second spaced-apart electrical conductors, a sorbent which is positioned in the enclosure between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, a power supply which is connected to the first and second conductors and which generates an electrical current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction, and a pressure chamber which is connected to the enclosure and which receives the sorbate from the enclosure during the desorption reaction and releases the sorbate into the enclosure during the adsorption reaction.