Abstract: A three-dimensional compact array of electronic circuitry includes a plurality of stacked modular compact arrays of electronic circuitry. Each modular compact array of electronic circuitry includes a substrate-less multi-chip module supporting a number of integrated circuits and interconnect which electrically connects the integrated circuits. Each modular compact array of electronic circuitry further includes an integrated heat exchanger and stacking connector supporting the substrate-less multi-chip module. The integrated heat exchanger and stacking connector includes a transverse connector region including a plurality of connector vias for connection to the interconnect of the substrate-less multi-chip module, and a transverse flow region including channels for circulating a coolant to remove heat from the substrate-less multi-chip module.

Abstract: An inorganic chip-to-package interconnection circuit is described. The circuit has a set of electrical conductors that are held together by a set of insulating inorganic tie bars. The circuit constitutes a high-density chip-to-package interconnection circuit that does not absorb vapor or volatile gases. A variety of methods for forming the circuit are described. Advantageously, the methods utilize known processing techniques.

Abstract: An optical transdermal link. The interface consists of two modules. An internal module is placed just inside the skin, and an external module is placed just outside the skin and facing the internal module. The external module is connected to a host processor via high speed serial lines. The external module contains one or two laser diodes with drivers, and one photodetector with preamplifier. The internal module contains a photocell array to provide power for itself, a photo detector, preamplifier and a clock recovery circuit for detecting the incoming signal, and a laser diode and driver for the outgoing signal. The internal module also contains modulation/demodulation and neural interface circuits peculiar to the specific application.

Abstract: An optical transdermal link. The interface consists of two modules. An internal module is placed just inside the skin, and an external module is placed just outside the skin and facing the internal module. The external module is connected to a host processor via high speed serial lines. The external module contains one or two laser diodes with drivers, and one photodetector with preamplifier. The internal module contains a photocell array to provide power for itself, a photo detector, preamplifier and a clock recovery circuit for detecting the incoming signal, and a laser diode and driver for the outgoing signal. The internal module also contains modulation/demodulation and neural interface circuits peculiar to the specific application.

Abstract: An integral heat pipe, heat exchanger, and clamping plate. A base plate functioning as an evaporator has disposed in it a multiplicity of intersecting parallel and perpendicular internal channels extending laterally substantially across the base plate. A sintered copper thermal wick is applied to all channels. Thin-walled condenser tubes forming a condenser region are joined to the base plate at intersections of width wise and cross wise channels contained in the base plate. A multiplicity of fins extend to all condenser tubes. For heat pipe arrangements operating in horizontal configurations, all wick-lined channels within the base plate remain open. For heat pipe arrangements intended to operate in oblique or vertical configurations, horizontally extending channels vertically displaced relative to other horizontal channels are isolated from the latter by a multiplicity of plugs.

Abstract: An optimized integral heat pipe and electronic circuit module arrangement is described. A ceramic multi-chip module bearing electronic circuit components has applied to the side opposite the electronic circuit components preparatory metallization and a thermal wick. A heat pipe evaporator chamber and condenser assembly is attached to the multi-chip module and wick assembly. A suitable working fluid is introduced into the vapor chamber and the vapor chamber hermetically sealed. Application of the thermal wick to the heat producing multi-chip module eliminates the thermal impedance contributed by thermal transmission media used in prior art heat pipe assemblies, permitting a doubling of heat flux from the multi-chip module to the heat pipe evaporator.

Abstract: Heatpipe elements having a thin flat, rectangular geometry are contstructed according to known heatpipe techniques. An electronic circuit module incorporating multiple discrete and integrated circuit elements is integrally imbedded into a recessed top exterior surface of each heatpipe element. The heatpipe elements are longer in one dimension that the circuit modules imbedded therein, the excess length being partitioned equally on each side of a circuit module. The remaining opposing edges of each circuit module equally overhanging the lateral edges of the heatpipe are configured as area array connectors. The resultant heatpipe/circuit module forms bilateral thermal contact areas for thermally contacting complementary surfaces of immediately adjoining heatpipe/circuit modules. Circuit modules electrically contact preceding and succeeding circuit modules via stacking connectors interposed between the respective area array connectors.

Abstract: In an arrangement for packaging planar arrays of circuit components including a plurality of essentially parallel layers in which the layers lie closely adjacent one another, one or more of the layers including a substrate of insulating material having circuit board apparatus imbedded therein, the improvement including apparatus positioned against at least one of the layers for removing heat from the arrangement.

Abstract: A three dimensional arrangement for packaging planar arrays of circuit components in a plurality of essentially planar layers in which the layers lie closely adjacent to one another is disclosed. Each layer is separated by a shell that interposes slots for allowing coolant to pass between the layers and electrical conductors through the shell, so that when the layers are placed together, the conductors form a bus through the structure.

Abstract: An arrangement for packaging thin planar arrays of circuit components including a plurality of essentially thin parallel layers in which the layers lie closely adjacent one another, one or more of the layers including a substrate of insulating material having circuit board means imbedded therein, the improvement including heat-conducting means positioned against at least one of the layers for removing heat from the arrangement, the heat-conducting means having an interior channel for transferring a fluid to accomplish the heat removal, and means providing electrical conduits through the heat-conducting means.