Patents by Inventor Howard R. Test

Howard R. Test has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4874722
    Abstract: A method of producing a cavity package semiconductor device is disclosed. The method includes providing a bar pad having a plurality of bar pad straps, each strap extending outwardly from the outer edge of the bar pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the bar pad; molding a packing material onto a central portion of lead fingers and the bar straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a bar pad with the integrated circuit thereon within the cavity with the bar pad straps.
    Type: Grant
    Filed: April 28, 1988
    Date of Patent: October 17, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: George A. Bednarz, Reginald W. Smith, Gretchen W. Roeding, Howard R. Test
  • Patent number: 4423435
    Abstract: An electronic device, such as an integrated circuit formed on a single semiconductor chip, is mounted on a relatively flat insulative substrate, such as a chip carrier or printed circuit board, and electrically connected to electrical conductors on the substrate by means of a bonding material disposed between the device and substrate. The device is placed on the substrate with its electrically active surface in facing relationship with the substrate and with its electrical contact pads in registration with selected ones of the substrate conductors. The bonding material is substantially electrically conductive only along one axis which is orthogonal to the major planes of the device and substrate to provide an electrically conductive path between the contact pads and electrical conductors. The bonding material is allowed to accumulate along the perimeter of the electronic device to form a protective seal between the electronic device and the substrate.
    Type: Grant
    Filed: October 27, 1980
    Date of Patent: December 27, 1983
    Assignee: Texas Instruments Incorporated
    Inventor: Howard R. Test, II
  • Patent number: 4388696
    Abstract: A data processing system is disclosed having data processing means for providing data in either an encoded format or in a display format in respective first and second operating modes. Data display means responsive to the operating mode of the data processing means are provided for receiving the data provided thereby, converting any data received in the encoded format to the display format, and displaying all received data in the display format.
    Type: Grant
    Filed: July 14, 1980
    Date of Patent: June 14, 1983
    Assignee: Texas Instruments Incorporated
    Inventors: Howard R. Test, II, Michael J. Drury