Patents by Inventor Hozumi Yasuda

Hozumi Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10213896
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 10092992
    Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: October 9, 2018
    Assignee: EBARA CORPORATION
    Inventors: Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
  • Publication number: 20180236630
    Abstract: A polisher for locally polishing a substrate is provided. The polisher includes a polishing member having a processing surface that comes into contact with the substrate and is smaller than the substrate, a pressing mechanism for pressing the polishing member against the substrate, a first drive mechanism for imparting motion to the polishing member in a first motion direction parallel to a surface of the substrate, a second drive mechanism for imparting motion to the polishing member in a second motion direction perpendicular to the first motion direction and having a component parallel to the surface of the substrate, and a controller for controlling the action of the polisher.
    Type: Application
    Filed: February 20, 2018
    Publication date: August 23, 2018
    Applicant: Ebara Corporation
    Inventors: Hozumi YASUDA, Itsuki KOBATA, Nobuyuki TAKAHASHI, Suguru SAKUGAWA, Nobuyuki TAKADA
  • Patent number: 10040166
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: August 7, 2018
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Patent number: 10035239
    Abstract: A polishing apparatus which can allow easy replacement of a retainer ring and can allow the retainer ring to be secured to a drive ring without causing deformation of the retainer ring is disclosed. The polishing head includes a head body having a substrate contact surface, a drive ring coupled to the head body, and a retainer ring surrounding the substrate contact surface and coupled to the drive ring. A first screw thread is formed on the drive ring, a second screw thread, which engages with the first screw thread, is formed on the retainer ring. The second screw thread extends in a circumferential direction of the retainer ring.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: July 31, 2018
    Assignee: EBARA CORPORATION
    Inventors: Hozumi Yasuda, Makoto Fukushima, Osamu Nabeya
  • Patent number: 9999956
    Abstract: A polishing device is provided to suppress deterioration in reproducibility of a polishing profile due to a variation or change with time of a shape of a retaining ring of a substrate holding member for each of retaining rings. The polishing device includes: a polishing head configured to press a substrate against a polishing pad and have a retainer ring surrounding the substrate pressed against the polishing pad; a measurement sensor configured to measure a surface shape of the retainer ring; and a controller configured to determine a polishing condition of the substrate based on the surface shape of the retainer ring measured by the measurement sensor.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: June 19, 2018
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Osamu Nabeya, Makoto Fukushima, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 9884401
    Abstract: An elastic membrane is used in a substrate holding apparatus for holding a substrate such as a semiconductor wafer and pressing the substrate against a polishing surface. The elastic membrane includes a plurality of concentrically circumferential walls configured to define a plurality of pressurizing areas for pressing the substrate. The pressurizing areas includes a central pressurizing area located at a central part of the elastic membrane, an annular edge pressurizing area located at the outermost part of the elastic membrane, and a plurality of intermediate pressurizing areas located between the central pressurizing area and the annular edge pressurizing area. The area width of at least one of the intermediate pressurizing areas is set in a range to allow a polishing rate responsive width not to vary even when the area width is varied.
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 6, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Osamu Nabeya, Shingo Togashi
  • Patent number: 9815171
    Abstract: A substrate holder capable of preventing an increase in a polishing rate of an edge portion of a substrate, even when polishing a plurality of substrates successively, is disclosed. The substrate holder includes: a top ring body configured to hold the substrate; and a retaining ring disposed so as to surround the substrate held by the top ring body. The retaining ring includes a pad pressing structure in an annular shape which is to be brought into contact with the polishing pad, and the pad pressing structure has a width in a range of 3 mm to 7.5 mm.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: November 14, 2017
    Assignee: EBARA CORPORATION
    Inventors: Satoru Yamaki, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Makoto Fukushima, Shingo Togashi
  • Publication number: 20170266779
    Abstract: According to one embodiment, a substrate polishing method includes: conveying a substrate to a position above a polishing pad by sucking the substrate by a first region of an elastic film; polishing the substrate while bringing the substrate into contact with the polishing pad; and lifting off the substrate by sucking the substrate by a second region of the elastic film, the second region being larger than the first region.
    Type: Application
    Filed: March 14, 2017
    Publication date: September 21, 2017
    Inventors: Shintaro ISONO, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI, Satoru YAMAKI
  • Publication number: 20170259395
    Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises: a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.
    Type: Application
    Filed: March 8, 2017
    Publication date: September 14, 2017
    Applicant: Ebara Corporation
    Inventors: Itsuki KOBATA, Katsuhide WATANABE, Hozumi YASUDA, Yuji YAGI, Nobuyuki TAKAHASHI, Koichi TAKEDA
  • Patent number: 9724797
    Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: August 8, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
  • Publication number: 20170173756
    Abstract: A polishing object is prevented from slipping out without depending on the process type or the polishing condition.
    Type: Application
    Filed: December 14, 2016
    Publication date: June 22, 2017
    Inventors: Satoru YAMAKI, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Makoto FUKUSHIMA, Shingo TOGASHI, Shintaro ISONO
  • Patent number: 9676076
    Abstract: A polishing method is used for polishing a film formed on a substrate by pressing the substrate against a polishing pad. The polishing method includes preparing, in advance, an algorithm for correction of polishing time from a relationship between a known amount of wear of the polishing pad or a known thickness of the polishing pad, and a polishing time and a polishing amount; setting a polishing target value for the film; and measuring an amount of wear of the polishing pad or a thickness of the polishing pad. The polishing method further includes determining an optimal polishing time for the polishing target value from the measured amount of wear of the polishing pad or the measured thickness of the polishing pad and from the algorithm; and polishing the film for the determined optimal polishing time.
    Type: Grant
    Filed: June 12, 2013
    Date of Patent: June 13, 2017
    Assignee: Ebara Corporation
    Inventors: Keisuke Namiki, Hozumi Yasuda, Shingo Togashi
  • Patent number: 9662764
    Abstract: The substrate holder is a device for holding a substrate and pressing it against a polishing pad. The substrate holder includes: an inner retaining ring vertically movable independently of the top ring body and arranged around the substrate; an inner pressing mechanism to press the inner retaining ring against the polishing surface of the polishing pad; an outer retaining ring to vertically movable independently of the inner retaining ring and the top ring body; an outer pressing mechanism to press the outer retaining ring against the polishing surface; and a supporting mechanism to receive a lateral force applied to the inner retaining ring from the substrate during polishing of the substrate and to tiltably support the outer retaining ring.
    Type: Grant
    Filed: January 29, 2013
    Date of Patent: May 30, 2017
    Assignee: Ebara Corporation
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Publication number: 20170144267
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion, The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Application
    Filed: January 10, 2017
    Publication date: May 25, 2017
    Inventors: Makoto FUKUSHIMA, Hozumi YASUDA, Keisuke NAMIKI, Osamu NABEYA, Shingo TOGASHI, Satoru YAMAKI, Shintaro ISONO
  • Patent number: D793976
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: August 8, 2017
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D794585
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: August 15, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Hozumi Yasuda, Makoto Fukushima, Keisuke Namiki, Shingo Togashi, Satoru Yamaki
  • Patent number: D799437
    Type: Grant
    Filed: February 24, 2016
    Date of Patent: October 10, 2017
    Assignee: EBARA CORPORATION
    Inventors: Osamu Nabeya, Hozumi Yasuda, Makoto Fukushima, Shingo Togashi, Keisuke Namiki, Satoru Yamaki
  • Patent number: D808349
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: January 23, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki
  • Patent number: D813180
    Type: Grant
    Filed: October 7, 2016
    Date of Patent: March 20, 2018
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki