Abstract: A radar apparatus and an interference suppression method are provided. The radar apparatus includes a clock generator, an analog to digital converter (ADC), and a notch filter. The clock generator is configured to generate a sampling frequency. The ADC is coupled to the clock generator, and is configured to convert an analog signal into a digital signal according to the sampling frequency. The notch filter is coupled to the ADC, and is configured to attenuate one or more interfered frequencies of the digital signal. The interfered frequencies are related to the sampling frequency. Accordingly, the interference at a specific frequency and harmonics thereof may be suppressed.

Abstract: A frequency modulated continuous wave (FMCW) radar device and a signal processing method thereof are provided. The frequency modulated continuous wave radar device includes a transmitter stage circuit, a frequency synthesizer, a receiver stage circuit, a pre-stage circuit, and a signal processing circuit. The transmitter stage circuit transmits a transmitting signal. The frequency synthesizer generates the transmitting signal associated with a chirp period. The receiver stage circuit receives a receiving signal including a periodic interference signal with a noise period associated with the chirp period. The pre-stage circuit outputs a to-be-processed signal including multiple frames according to the receiving signal and the transmitting signal. The signal processing circuit groups the frames into multiple frame groups. The signal processing circuit generates a processed signal by sampling at least one frame from the multiple frames in each of the frame groups with an identical sampling rule.

Abstract: The Doppler signal processing device includes a frequency analyzer, an interference suppressor, an interference baseline estimator and a synthesizer. The frequency analyzer can generate a frequency domain signal according to a digital signal. The interference suppressor can perform a suppression operation to generate an interference suppressed frequency domain signal. The interference baseline estimator can generate or update the frequency domain interference estimation signal according to the frequency domain signal. The synthesizer can generate an interference suppressed digital signal according to the interference suppressed frequency domain signal, where the interference suppressed digital signal is related to the digital signal with the interference energy suppressed.

Abstract: An object recognition method includes generating Doppler spectrogram data according to an echo signal, the echo signal being relating to an object; transforming N sets of time-domain data of the Doppler spectrogram data corresponding to N velocities into N sets of cadence spectrogram data, respectively; combining the N sets of spectrogram data to obtain 1D/2D cadence spectrum data, and acquiring a series of cadence feature from the 1D/2D cadence spectrum data to recognize the object.

Abstract: A manufacturing method of a light-emitting diode package structure includes the steps as follows. A substrate is provided. At least one light-emitting diode and at least one dummy plug are arranged on the substrate in an arranging step. The light-emitting diode and the dummy plug are covered by the patternable material in a coating step. A portion of the light-emitting diode and a portion of the dummy plug are exposed in a patterning step. A conductive layer is in contact with and electrically connected to the light-emitting diode and the dummy plug in a deposition step. A protective layer is formed on the conductive layer in a protective layer forming step. The substrate is separated and a light-emitting diode package structure is formed in a releasing step. A material of the conductive layer includes an indium tin oxide material or a transparent conductive material.

Abstract: An encapsulation process method for wafer-level light-emitting diode dies is provided, in which a wafer structure having a plurality of light-emitting diode dies thereon is adhered to a temporary substrate, and by sequentially performing a laser cutting and a laser punch-through process, the light-emitting diode die turns to be conductive. Then, a transparent conductive film is sputtered thereon the die, and black matrix photoresist and quantum dot color filter are further disposed for performing a color conversion process. After that, the light-emitting diode dies are divided into package structures, and a glue removal process is used to separate the wafer structure from the temporary substrate, so that the wafer structure can be transferred to a target substrate. By employing the present invention, the conventional carrier board can be omitted, and the packaging yield of the vertical light emitting diode die packages is certainly optimized.

Abstract: The disclosure provides a radar apparatus, a signal processing circuit, and a signal processing method for radar apparatus. The radar apparatus includes a frequency synthesizer, a signal generator, and a transmitting front-end circuit. The frequency synthesizer generates a carrier signal. A frequency of the carrier signal changes with time within a sweep period of the carrier signal, and the carrier signal includes a frequency raising section and a frequency decreasing section. The signal generator generates a shaping signal. The shaping signal includes two sections. The two sections have different amplitudes. One of the two sections corresponds to a turn-around section between the frequency raising section and the frequency decreasing section. The transmitting front-end circuit is coupled to the frequency synthesizer and the signal generator and generates a transmitting signal according to the carrier signal and the shaping signal. In this way, the spurious peak on the spectrum is reduced.

Abstract: A radar apparatus includes a transmitting analog front-end circuit, a plurality of antenna ports, a switching controller, a switching circuit, and a receiving analog front-end circuit. The transmitting analog front-end circuit generates a transmitting signal according to a carrier wave signal. A frequency of the carrier wave signal changes with time during a frequency sweep period of the carrier wave signal. The antenna ports are respectively configured to receive an echo signal corresponding to the transmitting signal. The switching controller is coupled to the transmitting analog front-end circuit and configured to generate a control signal according to the frequency sweep period of the carrier wave signal. The switching circuit is coupled to the antenna ports and the switching controller, configured to select one of the antenna ports to receive the echo signal according to the control signal, and coupled to the receiving analog front-end circuit.

Abstract: A Doppler radar apparatus including a transmitting device, a receiving device and a narrowband interference suppression device is provided. The transmitting device is configured to transmit a first wireless signal. The receiving device is coupled to the transmitting device and is configured to receive a second wireless signal to generate a first digital signal. The first digital signal includes a Doppler signal component and a narrowband interference signal component, and a bandwidth of the narrowband interference signal component is smaller than a bandwidth of the Doppler signal component. The narrowband interference suppression device is coupled to the receiving device and is configured to perform interference suppression on the first digital signal to suppress the narrowband interference signal component in the first digital signal to generate an output digital signal.

Abstract: A laser diode includes an original substrate having a substrate coefficient of thermal expansion, an epitaxy structure formed on the original substrate, and a composite multi-layer metal board disposed below the original substrate and at least including a first metal layer and a second metal layer. The first metal layer and the second metal layer are stacked, a material of the first metal layer is different from a material of the second metal layer, and the composite multi-layer metal board has a modified coefficient of thermal expansion. The original substrate has an initial thickness as the epitaxy structure is grown thereon, the original substrate is thinned to a combining thickness for attaching the composite multi-layer metal board, and the modified coefficient of thermal expansion of the composite multi-layer metal board is proximate to the substrate coefficient of thermal expansion.

Abstract: A radar detector including a radar transmitting device, a radar receiving device, an analog-to-digital converter (ADC), and a digital processing unit, and an interference suppression method using the radar detector are provided. The radar transmitting device transmits a first wireless signal. The radar receiving device receives a second wireless signal to generate an analog reference signal in response to the first wireless signal is subdued from being transmitted, and receives a third wireless signal to generate an analog main signal in response to the first wireless signal is not subdued from being transmitted. The ADC generates a digital reference signal according to the analog reference signal, and generates a digital main signal according to the analog main signal. The digital processing unit adjusts the digital or analog main signal according to the digital reference signal to correspondingly suppress interference components in the digital main signal or in the analog main signal.

Abstract: A vertical light emitting diode die packaging method is provided, including a plurality of following steps. At first, a plurality of drill hole is formed in a substrate and a first metal material is used to fill the drill holes. Next, disposing and fixing a plurality of vertical light emitting diode die on the substrate through a second metal material, and a transparent glue is used to cover thereon. A laser process is then employed to dissolve the transparent glue for forming ditches. And, a conductive liquid is applied to fill the ditches and an insulating glue is provided to embrace and encapsulate the vertical light emitting diode dies. By employing the packaging method of the present invention, the current external wire bonding process can be effectively replaced, thereby die size miniaturization as well as packaging yield of the vertical light emitting diode dies are believed to be optimized.

Abstract: A via-filling method of a TGV substrate includes steps: filling a plurality of metal balls into a plurality of vias of the TGV substrate; using a heating process to melt the plurality of metal balls to form a liquid-state metal; and cooling down the liquid-state metal to form a solid-state metal inside the plurality of vias. Because the method needn't use solvents or fluxes, the solid-state metal inside the plurality of vias have better electric conductivity.

Abstract: A bonding and transferring method for die package structures is provided, including providing a die package structure which has a positioning adhesive disposed thereon, and providing a vibration base having at least one cavity corresponding to the positioning adhesive. By alignment of the positioning adhesive and the cavity, the die package structure can be positioned into the vibration base. A target substrate is further provided and bonded with the vibration base having the die package structure disposed thereon through a metal material. And a laser process is then performed to melt the metal material. At last, the vibration base and the positioning adhesive are removed so the die package structure is successfully bonded and transferred onto the target substrate. By employing the proposed process method of the present invention, rapid mass transfer result is accomplished, and the packaging yield of vertical light emitting diode die package structures is optimized.

Abstract: A method of detecting a life includes receiving an echo signal including an in-phase component and a quadrature component, performing a preprocessing procedure on the echo signal to generate a preprocessed signal, generating, according to the preprocessed signal, complex conjugate data associated with the in-phase component and the quadrature component, performing a first time-domain-to-frequency-domain transform on the complex conjugate data to generate Doppler spectrogram data comprising a plurality of positive velocity energies and a plurality of negative velocity energies, generating combined Doppler spectrogram data according to the plurality of positive velocity energies and the plurality of negative velocity energies, performing a second time time-domain-to-frequency-domain transform on the combined Doppler spectrogram data to generate spectrum data, and determining whether a life is detected according to the spectrum data.

Abstract: A magnetic LED die transferring device includes a substrate, a plurality of magnetic members and a vibrating mechanism. The substrate includes a plurality of die locating areas arranged in intervals, and each of the die locating areas includes a locating surface. Each of the magnetic members corresponds to each of the die locating areas and includes an alignment N-pole and an alignment S-pole. The vibrating mechanism is coupled to the substrate. The N-pole and the S-pole of each of the magnetic LED dice are used to be attracted by each of the alignment N-poles and each of the alignment S-poles, respectively, to allow each of the magnetic LED dice to be transferred and aligned to each of the die locating areas.

Abstract: A magnetic light-emitting structure and fabrication method for manufacturing a magnetic light-emitting element are provided. The fabrication method comprises providing a magnetic metal composite substrate, wherein a second metal layer is respectively disposed on an upper and lower surface of a first metal layer; forming a connecting metal layer, an epitaxial layer and a plurality of electrode unit on top; and performing a complex process, which removes the second metal layer on the lower surface of the first metal layer and part of the first metal layer and performs cutting according to the number of the electrode unit, so as to form a plurality of epitaxial die. Each epitaxial die corresponds to an electrode unit to form a magnetic light-emitting element. The proposed method improves soft magnetic properties of an original substrate and enables dies to reverse spontaneously, thereby used perfectly for industrial mass transfer technology.

Abstract: A light emitting diode (LED) driver circuit is configured to drive plural LEDs which are respectively coupled to m scan-lines and n data-lines, wherein m and n are both integers greater than or equal to one. During a driving stage, each of the LEDs is controlled to emit light according to the electrical characteristics on the corresponding scan-line and on the corresponding data-line where the LED is coupled to. The LED driver circuit includes: a power saving control circuit which includes a storage capacitor; a pre-discharging circuit configured to pre-discharge the charges on the m scan-lines to the storage capacitor during a pre-discharging stage; and a pre-charging circuit configured to pre-charge the n data-lines by the charges stored in the storage capacitor during a pre-charging stage.

Abstract: A light-emitting diode packaging structure and a method for fabricating the same is disclosed. A semiconductor wafer is provided, which includes semiconductor substrates. Each semiconductor substrate is penetrated with a first through hole and three second through holes. An insulation layer is formed on the surface of each semiconductor substrate and the inner surfaces of the first through hole, the first sub-through hole, and the second sub-through hole. A patterned electrode layer is formed on the top surface of the semiconductor substrate. A conductive material covering the insulation layer is formed in the first through hole and the second through hole and electrically connected to the patterned electrode layer. Three light-emitting diodes are respectively formed in the first sub-through holes of the second through holes of each semiconductor substrate and respectively electrically connected to the conductive material within the second through holes.

Abstract: An electronic display device includes a frame assembly, a first antenna, a display module, and a metal grounding member. The frame assembly includes a housing body, and the housing body includes an inner side surface, an outer side surface corresponding to the inner side surface, and a groove running through the outer side surface and the inner side surface. The first antenna is disposed on the inner side surface of the housing body, and the first antenna includes a grounding portion. The display module is disposed on the outer side surface of the housing body. The metal grounding member is disposed on the outer side surface of the housing body, and the metal grounding member is disposed between the housing body and the display module. The metal grounding member is coupled to the grounding portion of the first antenna through the groove.