Abstract: A method for manufacturing micro light-emitting diode chips includes the steps of: providing a to-be-divided light-emitting component, which includes a metal substrate and a plurality of micro light-emitting diode dies disposed on the metal substrate to permit the metal substrate to define a to-be-etched region among the micro light-emitting diode dies; and etching the metal substrate to remove the to-be-etched region so as to divide the light-emitting component into a plurality of the micro light-emitting diode chips.

Abstract: An electronic display device includes a frame assembly, a first antenna, a display module, and a metal grounding member. The frame assembly includes a housing body, and the housing body includes an inner side surface, an outer side surface corresponding to the inner side surface, and a groove running through the outer side surface and the inner side surface. The first antenna is disposed on the inner side surface of the housing body, and the first antenna includes a grounding portion. The display module is disposed on the outer side surface of the housing body. The metal grounding member is disposed on the outer side surface of the housing body, and the metal grounding member is disposed between the housing body and the display module. The metal grounding member is coupled to the grounding portion of the first antenna through the groove.

Abstract: A signal processing system includes a transmission module and a receiving module. The transmission module generates and transmits a transmitted radio frequency signal according to a data signal and a first spread vector. The transmission module includes a spread spectrum unit, a digital-to-analog converter and a mixer. The spread spectrum unit generates a spread spectrum signal according to the data signal and the first spread vector. The digital-to-analog unit generates an analog signal according to the spread spectrum signal. The mixer mixes the analog signal and a carrier signal so as to generate the transmitted radio frequency signal. The receiving module receives a received radio frequency signal and a second spread vector so as to generate a spectrum despread signal and generate object detection information data accordingly. The received radio frequency signal is generated by having the transmitted radio frequency signal reflected by a measured object.

Abstract: A moving object detection circuit for detecting movement information of a measured object. The moving object detection circuit includes a mixing circuit, an analog-to-digital conversion circuit, a mixing unit, and a distance detecting unit. The mixing circuit mixed the RF carrier signal and a first analog signal to generate a second analog signal. The first analog signal is generated by a signal reflected from the measured object. The analog-to-digital conversion circuit coupled to the mixing circuit for generating a digital signal according to the second analog signal. The mixing unit mixed an IF signal and a first/second IF carrier signal to generate a first/second signal. The distance detecting unit generated a detection result according to the first signal and the second signal. The detection result is corresponding to a distance between the measured object and the moving object detection circuit.

Abstract: A communication device includes a ground element, an antenna structure, a first reflector, a second reflector, a first tuning element, and a switch element. The first reflector is disposed adjacent to the antenna structure. The second reflector is disposed adjacent to the antenna structure. The second reflector is separate from the first reflector. The switch element is coupled to the first tuning element. When the switch element is enabled, the switch element couples the first tuning element to the first reflector or the second reflector. When the switch element is disabled, the first tuning element is separate from the first reflector and the second reflector.

Abstract: An ultra-wideband radar transceiver and an operating method thereof are provided. The ultra-wideband radar transceiver includes a receiving module. The receiving module includes an I/Q signal generator, a first sensing circuit and a second sensing circuit. The I/Q signal generator receives M consecutive echo signals and generates M consecutive in-phase signals and M consecutive quadrature-phase signals accordingly, wherein M is an integer greater than 1. The first sensing circuit is coupled to the I/Q signal generator to receive the M consecutive in-phase signals and is configured to perform integration and analog-to-digital conversion on the M consecutive in-phase signals to generate a first digital data. The second sensing circuit is coupled to the I/Q signal generator to receive the M consecutive quadrature-phase signals and is configured to perform integration and analog-to-digital conversion on the M consecutive quadrature-phase signals to generate a second digital data.

Abstract: A radar apparatus and a leakage correction method thereof are provided. The radar apparatus includes a transmitter and a receiver. The transmitter includes a sinewave signal generator. The sinewave signal generator generates a sinewave signal. The receiver includes another sinewave signal generator and a correcting circuit. The receiver receives transmitting signals including the sinewave signal from the transmitter. The sinewave signal generator of the receiver generates another sinewave signal according to the amplitude of the transmitting signals or received transmitting signals. The correcting circuit corrects leakage situation on the received transmitting signals according to another sinewave signal. The phasor of sinewave form corresponding to the leakage situation relates to the phasor of another sinewave signal. Accordingly, the performance of receiver may be improved effectively.

Abstract: A vertical type light emitting diode die and a method for fabricating the same is disclosed. A growth substrate is provided and an epitaxial layer is formed on the growth substrate. A metallic combined substrate is connected to the epitaxial layer. Then, the growth substrate is removed. Electrode units are formed on the top surface of the epitaxial layer. The epitaxial layer is divided into epitaxial dies according to the number of the plurality of electrode units. Each vertical type light emitting diode die formed in the abovementioned way includes the metallic combined substrate having a first metal layer and second metal layers. The first metal layer is combined with the two second metal layers by cutting, vacuum heating, and polishing, so as to enable the metallic combined substrate to have a high coefficient of thermal conductivity, a low coefficient of thermal expansion, and initial magnetic permeability.

Abstract: A vertical type light emitting diode die and a method for fabricating the same is disclosed. A growth substrate is provided and an epitaxial layer is formed on the growth substrate. A metallic combined substrate is connected to the epitaxial layer. Then, the growth substrate is removed. Electrode units are formed on the top surface of the epitaxial layer. The epitaxial layer is divided into epitaxial dies according to the number of the plurality of electrode units. Each vertical type light emitting diode die formed in the abovementioned way includes the metallic combined substrate having a first metal layer and second metal layers. The first metal layer is combined with the two second metal layers by cutting, vacuum heating, and polishing, so as to enable the metallic combined substrate to have a high coefficient of thermal conductivity, a low coefficient of thermal expansion, and initial magnetic permeability.

Abstract: A gas etching device includes an upper cover having a first gas exhausting channel that surrounds a first accommodation space. A lower cover has a second accommodation space where a wafer is located. The lower cover can connect with the upper cover. A gas jetting element is arranged in the first accommodation space to communicate with the upper cover. The gas jetting element receives etching gas from outside the upper cover and jets the etching gas in the first accommodation space and the second accommodation space to react with the wafer. The reacted etching gas is exhausted through the first gas exhausting channel. The first gas entering channel continues receives high-pressure gas from outside the upper cover and transmits the high-pressure gas to the second gas entering channel, so as to avoid leaking the etching gas.

Abstract: Doppler signal processing device for detecting an object according to a received wireless signal. The Doppler signal processing device includes a frequency analysis unit for generating a frequency domain signal vector according to at least one digital signal, an interference suppression unit for performing a suppression operation according to the frequency domain signal vector and a frequency domain interference estimation signal vector to generate an interference suppressed frequency domain signal vector, an interference estimation unit for generating the frequency domain interference estimation signal vector according to the frequency domain signal vector, a detection unit for generating a result signal according to the interference suppressed frequency domain signal vector, an error detection unit for optionally providing an error detection control signal to the interference estimation unit to adjust a rate of updating the frequency domain interference estimation signal vector.

Abstract: An antenna system includes at least a first tunable antenna. The first tunable antenna includes a first radiation element, a second radiation element, a transmission line, and a switch circuit. The transmission line includes a first segment, a second segment, and a phase-adjustment segment. The first radiation element is coupled through the first segment to a first feeding point. The second radiation element is coupled through the second segment to a second feeding point. The switch circuit is configured to switch between the first feeding point and the second feeding point, so that the first feeding point or the second feeding point is arranged for receiving a feeding signal. The phase-adjustment segment has a first end and a second end. The first feeding point is positioned at the first end of the phase-adjustment segment. The second feeding point is positioned at the second end of the phase-adjustment segment.

Abstract: A moving object detection circuit for detecting movement information of a measured object. The moving object detection circuit includes a mixing circuit, an analog-to-digital conversion circuit, a mixing unit, and a distance detecting unit. The mixing circuit mixed the RF carrier signal and a first analog signal to generate a second analog signal. The first analog signal is generated by a signal reflected from the measured object. The analog-to-digital conversion circuit coupled to the mixing circuit for generating a digital signal according to the second analog signal. The mixing unit mixed an IF signal and a first/second IF carrier signal to generate a first/second signal. The distance detecting unit generated a detection result according to the first signal and the second signal. The detection result is corresponding to a distance between the measured object and the moving object detection circuit.

Abstract: A phase information extraction circuit includes a first mixer circuit for generating a second analog signal by mixing a carrier signal with a first analog signal generated by a transmitted signal reflected by the object, an analog-to-digital converter (ADC) coupled to the first mixer circuit for generating a first digital signal according to the second analog signal, an in-phase quadrature (I/Q) signal generator coupled to the ADC for generating a digital I signal and a digital Q signal according to the first digital signal, and a first phase acquisition unit for extracting phase information according to the digital I signal and the digital Q signal.

Abstract: A vertical type light emitting diode die and a method for fabricating the same is disclosed. A growth substrate is provided and an epitaxial layer is formed on the growth substrate. A metallic combined substrate is connected to the epitaxial layer. Then, the growth substrate is removed. Electrode units are formed on the top surface of the epitaxial layer. The epitaxial layer is divided into epitaxial dies according to the number of the plurality of electrode units. Each vertical type light emitting diode die formed in the abovementioned way includes the metallic combined substrate having a first metal layer and second metal layers. The first metal layer is combined with the two second metal layers by cutting, vacuum heating, and polishing, so as to enable the metallic combined substrate to have a high coefficient of thermal conductivity, a low coefficient of thermal expansion, and initial magnetic permeability.

Abstract: A vertical type light emitting diode die and a method for fabricating the same is disclosed. A growth substrate is provided and an epitaxial layer is formed on the growth substrate. A metallic combined substrate is connected to the epitaxial layer. Then, the growth substrate is removed. Electrode units are formed on the top surface of the epitaxial layer. The epitaxial layer is divided into epitaxial dies according to the number of the plurality of electrode units. Each vertical type light emitting diode die formed in the abovementioned way includes the metallic combined substrate having a first metal layer and second metal layers. The first metal layer is combined with the two second metal layers by cutting, vacuum heating, and polishing, so as to enable the metallic combined substrate to have a high coefficient of thermal conductivity, a low coefficient of thermal expansion, and initial magnetic permeability.

Abstract: This invention relates to a high-speed signal transmission connector with high water resistance, which includes at least a casing and a terminal block. A first seal ring is provided on said casing, a second seal ring is set between said casing and said terminal block and a third seal ring is mounted inside said terminal block. So that the second seal ring and the third seal ring of the present invention enable the connector to have an internal waterproof function, and the first seal ring also enable the connector to have a waterproof connection function. With this triple-waterproof technology, the present invention ensures that the external moisture will not infiltrate into the connector and enhances the water resistance and safety of the high-speed signal transmission connector.

Abstract: A signal processing system includes a transmission module and a receiving module. The transmission module generates and transmits a transmitted radio frequency signal according to a data signal and a first spread vector. The transmission module includes a spread spectrum unit, a digital-to-analog converter and a mixer. The spread spectrum unit generates a spread spectrum signal according to the data signal and the first spread vector. The digital-to-analog unit generates an analog signal according to the spread spectrum signal. The mixer mixes the analog signal and a carrier signal so as to generate the transmitted radio frequency signal. The receiving module receives a received radio frequency signal and a second spread vector so as to generate a spectrum despread signal and generate object detection information data accordingly. The received radio frequency signal is generated by having the transmitted radio frequency signal reflected by a measured object.

Abstract: This invention relates to a high-speed signal transmission connector with high water resistance, which includes at least a casing and a terminal block. A first seal ring is provided on said casing, a second seal ring is set between said casing and said terminal block and a third seal ring is mounted inside said terminal block. So that the second seal ring and the third seal ring of the present invention enable the connector to have an internal waterproof function, and the first seal ring also enable the connector to have a waterproof connection function. With this triple-waterproof technology, the present invention ensures that the external moisture will not infiltrate into the connector and enhances the water resistance and safety of the high-speed signal transmission connector.

Abstract: A controller applied to a secondary side of a power convertor includes a sampling/tracking circuit and a comparator. The sampling/tracking circuit is coupled to the secondary side of the power convertor for generating a sampling value corresponding to an output voltage of the power convertor when a sampling signal is enabled, and generating a tracking value corresponding to the output voltage. The comparator is coupled to the sampling/tracking circuit for generating a warning signal to a primary-side regulation controller of the power converter according to the sampling value and the tracking value during an enabling period of a tracking signal. The primary-side regulation controller adjusts a frequency of a gate control signal according to the warning signal, and the sampling signal and the tracking signal are not enabled simultaneously.