Abstract: A method of process technology assessment is provided. The method includes: defining a scope of the process technology assessment, the scope comprising an original process technology and a first process technology; modeling a first object in an integrated circuit into a resistance domain and a capacitance domain; generating a first resistance scaling factor and a first capacitance scaling factor based on the modeling, the original process technology, and the first process technology; and utilizing, by an electronic design automation (EDA) tool, the first resistance scaling factor and the first capacitance scaling factor for simulation of the integrated circuit.

Abstract: The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.

Abstract: The present disclosure is a heat sink used for an electronic component. The heat sink includes a shell body, a fan, and a thermally-conductive strip. The thermally-conductive strip abuts against the shell body. The shell body has an internal space and a side wall, and a channel is formed in the side wall of the shell body for a coolant fluid to flow. At two ends of the channel, a coolant fluid inlet and a coolant fluid outlet are respectively formed on an outer wall surface of the side wall. In this way, when flowing through the shell body, the coolant fluid brings heat of the shell body away. Therefore, heat dissipation efficiency can be substantially increased.

Abstract: A heat dissipating module includes a case, a fan, a heat dissipating part, at least one first fastening device, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide an air flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening. The first fastening device is located at the second air opening and disposed between the case and the heat dissipating part. The dust removal device has a side arm, and the side arm has a second fastening device that is capable of attaching to and detaching from the first fastening device.

Abstract: A heat dissipating module includes a case, a fan, a heat dissipating part, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide air to flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening, and the heat dissipating part includes a plurality of heat conducting fins. The dust removal device is disposed between the second air opening and the heat dissipating part, and the dust removal device includes a window structure and a plurality of dust scraping parts. The window structure is used to allow the air guided by the fan to pass through. The dust scraping parts and the heat conducting fins are placed interlacedly.