HEAT DISSIPATING MODULE CAPABLE OF REMOVING DUST
A heat dissipating module includes a case, a fan, a heat dissipating part, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide air to flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening, and the heat dissipating part includes a plurality of heat conducting fins. The dust removal device is disposed between the second air opening and the heat dissipating part, and the dust removal device includes a window structure and a plurality of dust scraping parts. The window structure is used to allow the air guided by the fan to pass through. The dust scraping parts and the heat conducting fins are placed interlacedly.
1. Field of the Invention
The invention relates to a heat dissipating module and, more particularly, to a heat dissipating module capable of removing dust.
2. Description of the Related Art
With the progress of the electronic science and technology, functions of an electronic product become more and more complicated and powerful. The operating speed of an internal microprocessor of the electronic product should become quicker and quicker to deal with heavy system operating workloads. However, when the operating speed of the microprocessor continuously increases, heat generated in the operating process also continuously increases. Therefore, when manufacturers design the electronic product, heat dissipation should be considered.
As far as a notebook computer is considered, since it is light, slim, short, small, and portable, internal components are generally arranged closely. Thus, heat generated by every component (in particular, a central processing unit) accumulates quickly. If the heat dissipation problem is not well dealt with, the system may be down, and the internal components may even be burned. Therefore, the heat dissipation efficiency has a crucial effect on the performance of the notebook computer.
Generally speaking, in the notebook computer, a combination of a fan and a heat sink is used on an electronic component whose heat needs to be dissipated such as a central processing unit to achieve heat dissipation.
One objective of the invention is to provide a heat dissipating module capable of removing dust accumulating on a heat dissipating part to solve the above problem.
The embodiment of the invention discloses a heat dissipating module capable of removing dust. The heat dissipating module includes a case, a fan, a heat dissipating part, and a dust removal device. The case has a first air opening and a second air opening. The fan is installed in the case, and it is used to guide air to flow through the first air opening and the second air opening. The heat dissipating part is located at the second air opening, and it has a plurality of heat conducting fins. The dust removal device is disposed between the second air opening and the heat dissipating part. The dust removal device includes a window structure and a plurality of dust scraping parts. The window structure allows the air guided by the fan to pass through. The dust scraping parts and the heat conducting fins are placed interlacedly.
These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.
The structure of the dust removal device is described in detail hereinbelow.
The design of the gap structure in the first embodiment and the additional disposition of the filter and the pull handle in the second embodiment can be adapted for the first embodiment and the second embodiment mutually. In addition, the dust scraping parts may be located at other positions besides the bottom of the dust removal device, which depends on design requirements of a practical mechanism.
In the invention, the dust scraping parts of the dust removal device are used to remove dust in the heat dissipating part. When the heat dissipating module has much dust adhering to the heat conducting fins to affect heat dissipation of the heat dissipating module after being used a long time, the users only need to raise the dust removal device upward by the pull handle to take out the dust removal device from the heat dissipating module. In the process, since the dust scraping parts of the dust removal device have their own structure characteristics, they can scrape dust adhering to the heat conducting fins as the users raise the dust removal device. After cleaning the taken dust removal device, the users can insert the dust removal device to the corresponding space along relative positions (shown in
Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope and spirit of the invention. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.
Claims
1. A heat dissipating module capable of removing dust, comprising:
- a case having a first air opening and a second air opening;
- a fan installed in the case, for guiding air to flow through the first air opening and the second air opening;
- a heat dissipating part located at the second air opening, the heat dissipating part including a plurality of heat conducting fins; and
- a dust removal device disposed between the second air opening and the heat dissipating part, the dust removal device including: a window structure for allowing the air guided by the fan to pass through; and a plurality of dust scraping parts, wherein the dust scraping parts and the heat conducting fins are placed interlacedly.
2. The heat dissipating module according to claim 1, wherein the dust removal device comprises a filter, and the filter is installed in the window structure.
3. The heat dissipating module according to claim 1, wherein the heat conducting fins are parallel to each other.
4. The heat dissipating module according to claim 1, wherein a pull handle is disposed on the dust removal device.
5. The heat dissipating module according to claim 1, wherein the dust scraping parts are a plurality of toothed hooks.
6. The heat dissipating module according to claim 5, wherein the toothed hooks bend and extend upward at an angle.
7. The heat dissipating module according to claim 1, wherein the dust scraping parts are a plurality of post structures.
8. The heat dissipating module according to claim 1, wherein each of the heat conducting fins has a gap at the top, and the gap is used to allow the dust removal device to be inserted to the heat dissipating part from the top.
9. The heat dissipating module according to claim 1, wherein the dust scraping parts extend from the bottom of the dust removal device.
10. The heat dissipating module according to claim 1, wherein the first air opening is substantially perpendicular to the second air opening.
Type: Application
Filed: Oct 29, 2008
Publication Date: Sep 10, 2009
Inventor: Hsiang-Chih Lee (Taipei City)
Application Number: 12/260,097
International Classification: F28G 1/12 (20060101);