Patents by Inventor Hsiang Chu

Hsiang Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packing lead frames for shipment thereof
    Patent number: 5448877
    Abstract: A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
    Type: Grant
    Filed: May 9, 1994
    Date of Patent: September 12, 1995
    Assignee: National Semiconductor Corporation
    Inventor: Hsiang Chu
  • Magazine and shipping tray for lead frames
    Patent number: 5310055
    Abstract: A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.
    Type: Grant
    Filed: March 24, 1993
    Date of Patent: May 10, 1994
    Assignee: National Semiconductor Corporation
    Inventor: Hsiang Chu