Patents by Inventor Hsiang-Jung Huang

Hsiang-Jung Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7728138
    Abstract: The present invention discloses a bis-triphenylsilyl compound and its applications as a host material, electron transport material, or hole transport material in an organic electronic device. The general structure of the bis-triphenylsilyl compound is as follows: where G represents any atomic moiety or single bond of the functional group selected from the group consisting of the following: aryl group, cyclene group, and heterocyclic ring group; and R1˜R32 represent substituents on aryl groups.
    Type: Grant
    Filed: November 20, 2007
    Date of Patent: June 1, 2010
    Assignee: National Tsing Hua University
    Inventors: Chien-Hong Cheng, Jin-Ju Lin, Hsiang-Jung Huang
  • Publication number: 20090131670
    Abstract: The present invention discloses a bis-triphenylsilyl compound and its applications as a host material, electron transport material, or hole transport material in an organic electronic device. The general structure of the bis-triphenylsilyl compound is as follows: where G represents any atomic moiety or single bond of the functional group selected from the group consisting of the following: aryl group, cyclene group, and heterocyclic ring group; and R1˜R32 represent substituents on aryl groups.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 21, 2009
    Inventors: Chien-Hong Cheng, Jin-Ju Lin, Hsiang-Jung Huang