Patents by Inventor Hsiang-Ling Wu

Hsiang-Ling Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136291
    Abstract: Semiconductor devices and methods of forming the same are provided. In some embodiments, a method includes receiving a workpiece having a redistribution layer disposed over and electrically coupled to an interconnect structure. In some embodiments, the method further includes patterning the redistribution layer to form a recess between and separating a first conductive feature and a second conductive feature of the redistribution layer, where corners of the first conductive feature and the second conductive feature are defined adjacent to and on either side of the recess. The method further includes depositing a first dielectric layer over the first conductive feature, the second conductive feature, and within the recess. The method further includes depositing a nitride layer over the first dielectric layer. In some examples, the method further includes removing portions of the nitride layer disposed over the corners of the first conductive feature and the second conductive feature.
    Type: Application
    Filed: January 12, 2023
    Publication date: April 25, 2024
    Inventors: Hsiang-Ku SHEN, Chen-Chiu HUANG, Chia-Nan LIN, Man-Yun WU, Wen-Tzu CHEN, Sean YANG, Dian-Hao CHEN, Chi-Hao CHANG, Ching-Wei LIN, Wen-Ling CHANG
  • Publication number: 20240088208
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming an interconnect structure over a substrate. The method includes forming a first conductive pad and a mask layer over the interconnect structure. The mask layer covers a top surface of the first conductive pad. The method includes forming a metal oxide layer over a sidewall of the first conductive pad. The method includes forming a second conductive pad over the first conductive pad and passing through the mask layer. The first conductive pad and the second conductive pad are made of different materials.
    Type: Application
    Filed: January 11, 2023
    Publication date: March 14, 2024
    Inventors: Tzu-Ting LIU, Hsiang-Ku SHEN, Wen-Tzu CHEN, Man-Yun WU, Wen-Ling CHANG, Dian-Hau CHEN
  • Publication number: 20050086739
    Abstract: A ventilation mattress is constructed to include an outer bag, the outer bag having air vents in a top fabric sheet layer thereof and an air inlet, a flexible tube connected to the air inlet of the outer bag, an electric fan installed in the flexible tube and adapted to draw currents of air into the inside of the outer bag, a fabric stuffing member formed of interwoven spandex fibers and stuffed in the outer bag, a flexible pad provided at the bottom side of the fabric stuffing member, the flexible pad having springy support members connected between top and bottom cover layers thereof for enabling air to circulate through the flexible pad between the air inlet and the air vents at the outer bag.
    Type: Application
    Filed: October 22, 2003
    Publication date: April 28, 2005
    Inventor: Hsiang-Ling Wu
  • Publication number: 20050011009
    Abstract: A ventilation mattress is constructed to include an outer bag, the outer bag having air vents in a top fabric sheet layer thereof and an air inlet, a flexible tube connected to the air inlet of the outer bag, an electric fan installed in the flexible tube and adapted to provide currents of air into the inside of the outer bag, and a fabric stuffing member formed of interwoven nylon fibers and stuffed in the outer bag.
    Type: Application
    Filed: July 15, 2003
    Publication date: January 20, 2005
    Inventor: Hsiang-Ling Wu