Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.

Abstract: A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.

Abstract: An in-mold electronic (IME) device includes a curved substrate, a first conductive layer, a dielectric layer, a gap compensation layer, and a second conductive layer. The curved substrate has a first surface. The first conductive layer is disposed on the first surface. The dielectric layer is disposed on the first conductive layer and has a first thickness. The gap compensation layer is disposed on the first surface and connected to the dielectric layer. The gap compensation layer has a second thickness. The second conductive layer is disposed on the gap compensation layer and electrically connected to the gap compensation layer. A curvature radius of the curved substrate is c, a ratio of the second thickness to the first thickness is r, and c and r satisfy a relationship: r=1.5?0.02c±15%.

Abstract: A transparent film heater is provided, including a transparent conductive film, at least two main electrodes and at least four multiple electrodes. The transparent conductive film is disposed on a transparent substrate. At least two main electrodes are arranged on two sides of the transparent conductive film along an edge of the transparent conductive film. The at least four multiple electrodes are composed of a first pair of multiple electrodes and a second pair of multiple electrodes, and are arranged on the transparent conductive film. A first spacing region and a second spacing region are respectively located between adjacent end points of the two main electrodes along the edge of the transparent conductive film. The first pair of multiple electrodes are arranged in the first spacing region, and the second pair of multiple electrodes are arranged in the second spacing region.

Abstract: A thin film heater includes a heat conductive layer, a heat insulation layer and a heat generation layer. The heat generation layer is disposed between the heat conductive layer and the heat insulation layer. The thermal conductivity of the heat conductive layer is greater than or equal to three times the thermal conductivity of the heat insulation layer.

Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: An electronic device package includes a substrate, an electronic device, and a first packaging layer. The electronic device and the first packaging layer are disposed on the substrate and the electronic device is located between the substrate and the first packaging layer. The first packaging layer includes a first oxynitride layer and a second oxynitride layer, wherein the second oxynitride layer is located between the first oxynitride layer and the electronic device. A composition of the first oxynitride layer includes SiNx1Oy1, a composition of the second oxynitride layer includes SiNx2Oy2, and x1>x2.

Abstract: A package of electronic device including a substrate, at least one electronic device and an encapsulation layer is provided. The substrate has a device area and a light transmitting area located outside the device area. The at least one electronic device is disposed on the device area of the substrate. The encapsulation layer is disposed on the substrate and covers the at least one electronic device. The encapsulation layer extends continuously from the device area to the light transmitting area, and a nitrogen content of the encapsulation layer on the device area is higher than a nitrogen content of the encapsulation layer on the light transmitting area. A display panel is also provided.

Abstract: The present invention employs the printable process to fabricate a multi-layered laminate gas barrier film. According to an embodiment of the present invention, after providing a plastic substrate, a first organic layer is printed with a first pattern on the plastic substrate. A first inorganic layer is printed to the first organic layer, filling up openings within the first pattern of the first organic layer and covering a surface of the first organic layer. A second organic layer is printed with a second pattern on the first inorganic layer. A second inorganic layer is printed to the second organic layer, filling up openings within the second pattern of the second organic layer and covering a surface of the second organic layer.

Abstract: According an embodiment of the disclosure, a flexible electronic device is provided. The flexible electronic device may include a flexible substrate, a device layer, and a barrier planarization layer. The device layer is located on the flexible substrate and has an upper surface. The upper surface has a maximum height difference less than or equal to 900 nm in a film stacking direction. The barrier planarization layer covers the device layer and the flexible substrate and has a covering surface and a planarization surface opposite to the covering surface. The barrier planarization layer has a water vapor transmission rate lower than or equal to 10?2 g/m2-day.

Abstract: A composite plate structure including a flexible substrate and a release layer is provided. The flexible substrate has an upper surface and a lower surface. The release layer is disposed on the lower surface of the flexible substrate, and includes a hydrophobic material and a bonding material. The hydrophobic material includes at least one fluorine atom. The bonding material at least includes an amide functional group or an epoxy functional group. The bonding material is bonded to the flexible substrate through the amide functional group or the epoxy functional group. A flexible apparatus including the composite plate structure is also provided.

Abstract: A substrate structure including a bottom organic layer, at least one inorganic layer, at least one organic layer and at least one protruding object is provided. The at least one protruding object is protruded from an upper surface of the bottom organic layer or the organic layer. A maximum height of the protruding object protruded from the upper surface of the bottom organic layer or the organic layer is H, and a thickness of the organic layer covering the protruding object is T, wherein T?1.1H.

Abstract: A substrate structure and a device employing the same are disclosed. An embodiment of the disclosure provides the substrate structure including a flexible substrate and a first barrier layer. The flexible substrate has a top surface, a side surface, and a bottom surface. The first barrier layer is disposed on and contacting the top surface of the flexible substrate, wherein the first barrier layer consists of Si, N, and Z atoms, wherein the Z atom is selected from a group of H, C, and O atoms, and wherein Si of the first barrier layer is present in an amount from 35 to 42 atom %, N of the first barrier layer is present in an amount from 10 to 52 atom %, and Z of the first barrier layer is present in an amount from 6 to 48 atom %.

Abstract: A substrate structure and a device employing the same are disclosed. An embodiment of the disclosure provides the substrate structure including a flexible substrate and a first barrier layer. The flexible substrate has a top surface, a side surface, and a bottom surface. The first barrier layer is disposed on and contacting the top surface of the flexible substrate, wherein the first barrier layer consists of Si, N, and Z atoms, wherein the Z atom is selected from a group of H, C, and 0 atoms, and wherein Si of the first barrier layer is present in an amount from 35 to 42 atom %, N of the first barrier layer is present in an amount from 10 to 52 atom %, and Z of the first barrier layer is present in an amount from 6 to 48 atom %.

Abstract: A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

Abstract: The present invention employs the printable process to fabricate a multi-layered laminate gas barrier film. According to an embodiment of the present invention, after providing a plastic substrate, a first organic layer is printed with a first pattern on the plastic substrate. A first inorganic layer is printed to the first organic layer, filling up openings within the first pattern of the first organic layer and covering a surface of the first organic layer. A second organic layer is printed with a second pattern on the first inorganic layer. A second inorganic layer is printed to the second organic layer, filling up openings within the second pattern of the second organic layer and covering a surface of the second organic layer.

Abstract: A composite plate structure including a flexible substrate and a release layer is provided. The flexible substrate has an upper surface and a lower surface. The release layer is disposed on the lower surface of the flexible substrate, and includes a hydrophobic material and a bonding material. The hydrophobic material includes at least one fluorine atom. The bonding material at least includes an amide functional group or an epoxy functional group. The bonding material is bonded to the flexible substrate through the amide functional group or the epoxy functional group. A flexible apparatus including the composite plate structure is also provided.

Abstract: The present invention employs the totally printable process to fabricate an organic/inorganic multi-layered laminate gas barrier film. Such totally printable process is simple with lower costs. Moreover, through the pattern design, the adhesion between the organic and inorganic layers is improved.