Patents by Inventor Hsien-Chang Hsieh

Hsien-Chang Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220285177
    Abstract: An exhaust structure includes a piping section, wherein the piping section has a first inner diameter in a central region of the piping section, the piping section has a second diameter in at least one of an inlet or an outlet, and the second diameter has a same value as the first inner diameter. The exhaust structure further includes a plurality of smoothing layers configured to resist turbulence and condensation produced by a flow of one or more gasses in the piping section.
    Type: Application
    Filed: May 26, 2022
    Publication date: September 8, 2022
    Inventors: Hsien-Chang HSIEH, Chun-Chih LIN, Tah-te SHIH, Wen-Hsong WU, Chune-Te YANG, Yu-Jen SU
  • Patent number: 11348811
    Abstract: An exhaust structure includes an intake section which includes an inlet, an output section which includes an outlet, and a piping section coupled to the intake section and the output section at a section interface. The piping section includes a first inner diameter from the intake section to the output section, wherein one of the intake section or the output section has a second inner diameter at the section interface. The second inner diameter includes a same value as a value of the first inner diameter. A plurality of smoothing layers are configured to resist turbulence and condensation produced by a flow of one or more gasses in the intake section, the output section, and the piping section.
    Type: Grant
    Filed: July 23, 2019
    Date of Patent: May 31, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Chang Hsieh, Chun-Chih Lin, Tah-Te Shih, Wen-Hsong Wu, Chune-Te Yang, Yu-Jen Su
  • Publication number: 20190348309
    Abstract: An exhaust structure includes an intake section which includes an inlet, an output section which includes an outlet, and a piping section coupled to the intake section and the output section at a section interface. The piping section includes a first inner diameter from the intake section to the output section, wherein one of the intake section or the output section has a second inner diameter at the section interface. The second inner diameter includes a same value as a value of the first inner diameter. A plurality of smoothing layers are configured to resist turbulence and condensation produced by a flow of one or more gasses in the intake section, the output section, and the piping section.
    Type: Application
    Filed: July 23, 2019
    Publication date: November 14, 2019
    Inventors: Hsien-Chang HSIEH, Chun-Chih LIN, Tah-te SHIH, Wen-Hsong WU, Chune-Te YANG, Yu-Jen SU
  • Patent number: 10366909
    Abstract: An exhaust structure includes an intake section including a first high thermal conductivity material, the intake section having an inlet, an output section including a second high thermal conductivity material, the output section having an outlet, and a piping section including a third high thermal conductivity material, the piping section being configured to communicatively couple the intake section with the output section. The exhaust structure provides a high thermal conductivity path from the inlet to the outlet, the high thermal conductivity path including the first high thermal conductivity material, the second high thermal conductivity material, and the third high thermal conductivity material.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: July 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Chang Hsieh, Chun-Chih Lin, Tah-te Shih, Wen-Hsong Wu, Chune-Te Yang, Yu-Jen Su
  • Publication number: 20190035653
    Abstract: An exhaust structure includes an intake section including a first high thermal conductivity material, the intake section having an inlet, an output section including a second high thermal conductivity material, the output section having an outlet, and a piping section including a third high thermal conductivity material, the piping section being configured to communicatively couple the intake section with the output section. The exhaust structure provides a high thermal conductivity path from the inlet to the outlet, the high thermal conductivity path including the first high thermal conductivity material, the second high thermal conductivity material, and the third high thermal conductivity material.
    Type: Application
    Filed: September 1, 2017
    Publication date: January 31, 2019
    Inventors: Hsien-Chang HSIEH, Chun-Chih LIN, Tah-te SHIH, Wen-Hsong WU, Chune-Te YANG, Yu-Jen SU
  • Publication number: 20070062944
    Abstract: A receptacle closure device includes a receptacle having an open upper end, and a closure having a top wall and a marginal flange portion bent downwardly from the top wall for engaging onto the upper end of the receptacle. The closure includes one or more hand grips extended from the marginal flange portion of the closure, and each has two ends secured to the marginal flange portion of the closure with connectors, for allowing the hand grip to be folded relative to the closure to carry and lift the closure and the receptacle. The closure includes one or more hinge connectors coupled between the hand grip and the marginal flange portion of the closure, and breakable by users.
    Type: Application
    Filed: September 27, 2004
    Publication date: March 22, 2007
    Inventor: Hsien-Chang Hsieh
  • Patent number: D286751
    Type: Grant
    Filed: March 7, 1984
    Date of Patent: November 18, 1986
    Inventor: Hsien-Chang Hsieh