Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device comprises a workpiece including a conductive feature disposed in a first insulating material and a second insulating material disposed over the first insulating material, the second insulating material having an opening over the conductive feature. A graphene-based conductive layer is disposed over an exposed top surface of the conductive feature within the opening in the second insulating material. A carbon-based adhesive layer is disposed over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is disposed within the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.

Abstract: A manufacturing method for baseball and softball includes the steps of: providing a ball core, a first ball shell, and a second ball shell, and each of the first and second ball shells being substantially in an 8-shape and having a surface and an attaching surface; sewing stitches at the periphery of the first ball shell and the periphery of the second ball shell to form a first sewing portion and a second sewing portion respectively; coating an adhesive at the ball core and coating the adhesive on the attaching surfaces of the first ball shell and the second ball shell; heating the adhesive; and positioning and attaching the first ball shell and the second ball shell on a surface of the ball core, such that the stitches of the first sewing portion and the stitches of the second sewing portion are arranged symmetrically.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate and depositing a conductive layer on the substrate. A patterned hard mask and a catalyst layer are formed on the conductive layer. The method further includes growing a plurality of carbon nanotubes (CNTs) from the catalyst layer and etching the conductive layer by using the CNTs and the patterned hard mask as an etching mask to form metal features.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device comprises a workpiece including a conductive feature disposed in a first insulating material and a second insulating material disposed over the first insulating material, the second insulating material having an opening over the conductive feature. A graphene-based conductive layer is disposed over an exposed top surface of the conductive feature within the opening in the second insulating material. A carbon-based adhesive layer is disposed over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is disposed within the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate and depositing a conductive layer on the substrate. A patterned hard mask and a catalyst layer are formed on the conductive layer. The method further includes growing a plurality of carbon nanotubes (CNTs) from the catalyst layer and etching the conductive layer by using the CNTs and the patterned hard mask as an etching mask to form metal features.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including a conductive feature formed in a first insulating material and a second insulating material disposed over the first insulating material. The second insulating material has an opening over the conductive feature. The method includes forming a graphene-based conductive layer over an exposed top surface of the conductive feature within the opening in the second conductive material, and forming a carbon-based adhesive layer over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is formed in the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.

Abstract: A light head, a lamp using the light head, and an assembling method of the light head are provided. The lamp includes the light head, a circuit board, a light source, and a light cover. The circuit board is disposed on the light head and electrically connected to the light source. The light cover is assembled to the light head. The circuit board and the light source are located in the light cover. The light head includes a first assembling element, a second assembling element, first pins, and a second pin. The first assembling element has an axial direction and a radial direction. The second and first assembling elements are telescoped and are coaxial. The first pins pass through the first assembling element along the axial direction, and the second pin passes through the first and second assembling elements along the radial direction.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate and depositing a conductive layer on the substrate. A patterned hard mask and a catalyst layer are formed on the conductive layer. The method further includes growing a plurality of carbon nanotubes (CNTs) from the catalyst layer and etching the conductive layer by using the CNTs and the patterned hard mask as an etching mask to form metal features.

Abstract: Semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece including a conductive feature formed in a first insulating material and a second insulating material disposed over the first insulating material. The second insulating material has an opening over the conductive feature. The method includes forming a graphene-based conductive layer over an exposed top surface of the conductive feature within the opening in the second conductive material, and forming a carbon-based adhesive layer over sidewalls of the opening in the second insulating material. A carbon nano-tube (CNT) is formed in the patterned second insulating material over the graphene-based conductive layer and the carbon-based adhesive layer.

Abstract: An illuminating device including a hollow body and a circuit board is provided. The hollow body includes a first opening end, a second opening end and a pair of first hooking portions, wherein a bore of the second opening end is larger than a bore of the first opening end. The first hooking portions are disposed on the first opening end. The circuit board is disposed in the hollow body and has a pair of second hooking portions, wherein the first hooking portions interfere with the second hooking portions.

Abstract: A light head, light device, assembling method of light head and light device are provided. The light device includes a light head and a third unit. The light head includes a first unit, a second unit, a cable, a fixing sheet, a first pin, a conducting sheet, and multiple second pins. The first unit has a side surface, a bottom surface, a pair of slots, and a protrusion portion. The slots are on the bottom surface. The second unit encircling the first unit exposes the protrusion portion. The fixing sheet electrically connected to a first conducting terminal of the cable is inserted into the slots. The first pin inserts into the protrusion portion to make the cable contact the first pin and the protrusion portion. The conducting sheet is under the second unit. The second pins make the conducting sheet, the first and second units assembled together.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A conductive layer is deposited on the substrate. A patterned hard mask is formed on the conductive layer and then a patterned photoresist is formed on the patterned hard mask and the conductive layer. A local metal catalyst layer is formed on the conductive layer in the openings of the patterned photoresist. Carbon nanotubes (CNTs) are grown from the local metal catalyst layer. The conductive layer is etched by using the CNTs and the patterned hard mask as etching mask to form metal features. An inter-level dielectric (ILD) layer is deposited between metal features.

Abstract: An apparatus comprises a first dielectric layer formed over a substrate, a first metal line embedded in the first dielectric layer, a second dielectric layer formed over the first dielectric layer, a second metal line embedded in the second dielectric layer, an interconnect structure formed between the first metal line and the second metal line, a first carbon layer formed between the first metal line and the interconnect structure and a second carbon layer formed between the second metal line and the interconnect structure.

Abstract: An apparatus comprises a first dielectric layer formed over a substrate, a first metal line embedded in the first dielectric layer, a second dielectric layer formed over the first dielectric layer, a second metal line embedded in the second dielectric layer, an interconnect structure formed between the first metal line and the second metal line, a first carbon layer formed between the first metal line and the interconnect structure and a second carbon layer formed between the second metal line and the interconnect structure.

Abstract: A lighting bulb is provided. The lighting bulb has a housing, a lighting unit and an electrical connector. The housing is configured for accommodating a circuit board and a heat-dissipating sealant is filled in the housing. The lighting unit is coupled to the circuit board for emitting the light and the electrical connector is configured for providing power to the circuit board and the lighting unit. A protruding member disposed on the inner surface of the housing and the circuit board form a mechanical interference against the floating force of the heat-dissipating sealant to the circuit board.

Abstract: A light head, a lamp using the light head, and an assembling method of the light head are provided. The lamp includes the light head, a circuit board, a light source, and a light cover. The circuit board is disposed on the light head and electrically connected to the light source. The light cover is assembled to the light head. The circuit board and the light source are located in the light cover. The light head includes a first assembling element, a second assembling element, first pins, and a second pin. The first assembling element has an axial direction and a radial direction. The second and first assembling elements are telescoped and are coaxial. The first pins pass through the first assembling element along the axial direction, and the second pin passes through the first and second assembling elements along the radial direction.

Abstract: A light head, light device, assembling method of light head and light device are provided. The light device includes a light head and a third unit. The light head includes a first unit, a second unit, a cable, a fixing sheet, a first pin, a conducting sheet, and multiple second pins. The first unit has a side surface, a bottom surface, a pair of slots, and a protrusion portion. The slots are on the bottom surface. The second unit encircling the first unit exposes the protrusion portion. The fixing sheet electrically connected to a first conducting terminal of the cable is inserted into the slots. The first pin inserts into the protrusion portion to make the cable contact the first pin and the protrusion portion. The conducting sheet is under the second unit. The second pins make the conducting sheet, the first and second units assembled together.

Abstract: A light emitting diode lamp includes a lamp shade, a light emitting diode light source, a universal joint and a power connector. The light emitting diode light source is disposed in the lamp shade. The universal joint includes a first connecting part and a second connecting part. The first connecting part is fixed to the lamp shade. The second connecting part is rotatably connected to the first connecting part and fixed to the power connector.