Abstract: A substrate assembly is disclosed, comprising a carrier board defining a planar direction and a plurality of substrates adjacently arranged thereon. Each substrate has opposite first and second surfaces, with a temporary adhesive layer bonding the second surface to the carrier board. A functional material fills the gaps between adjacent substrates. The carrier board's area is no less than the total area of the substrates. Crucially, in a direction perpendicular to the planar direction, the height difference between the first surfaces or the second surfaces of adjacent substrates is controlled to be no greater than 50?m. This structure ensures precise alignment and stability for subsequent processing.

Abstract: A stacked substrate includes a first tiling layer, a second tiling layer and a bonding layer. The first tiling layer includes plural first tiling substrates adjacent by one another and plural first gaps formed between adjacent two first tiling substrates. The second tiling layer includes plural second tiling substrates and plural second gaps formed between adjacent two second tiling substrates. The bonding layer is arranged between the first tiling layer and the second tiling layer, and defines a first bonding surface connecting to a second surface of the first tiling substrates and a second bonding surface connecting to a first surface of the second tiling substrates. Some projections of at least some of the first gaps and some of the second gaps are offset from each other along a direction perpendicular to one or both of the first bonding surface and the second bonding surface.

Abstract: An antenna device includes substrate layers, metallic layers, a non-shielding channel, an electronic component, a shielding layer and an antenna unit. The substrate layers include an upper substrate layer and a lower substrate layer located on two sides respectively. The metallic layers are disposed on the substrate layers. The non-shielding channel is at least defined at the upper substrate layer and communicates with the inner and outer surfaces of the upper substrate layer without being interfered by the first metallic layer. The electronic component is disposed on the outer surface of the upper substrate layer and corresponds to and at least partially covers the non-shielding channel. The shielding layer electrically shields the electronic component and is electrically connected to the first metallic layer. The antenna unit is disposed on an outer surface of the lower substrate layer and electrically coupled to the electronic component.

Abstract: An electronic detection system includes an electronic device, a detector and a memory. The electronic device includes a circuit substrate, a plurality of photoelectric components, and a plurality of tunable current source circuits. Each photoelectric component has one or more peak emission wavelengths in response to a plurality of current values. The tunable current source circuits are disposed on the circuit substrate and electrically connected to the photoelectric components. The detector captures a feature value of a corresponding one of the photoelectric components. One or more lookup tables stored in the memory are based on the feature values and the current values of the photoelectric components. Each tunable current source circuit transmits an input current to a corresponding one of the photoelectric components in response to the lookup table(s) to perform a selected peak emission wavelength.

Abstract: The present invention provides an electronic apparatus including a function board, at least one substrate assembly and a plurality of semiconductor components. Each of the substrate assembly includes a substrate, a composite-layered structure and a bonding layer. The composite-layered structure defines a conjunction plane, and one or more conductive-trace layers and one or more optical-trace layers are arranged either or both of over and beneath the conjunction plane; wherein the optical-trace layer defines a plurality of optical traces, and the conductive-trace layer defines a plurality of conductive traces. The bonding layer is adhesive between the substrate and the composite-layered structure. The semiconductor components are arranged on the composite-layered structure of the at least one substrate assembly; wherein some of the semiconductor components electrically connect the conductive layers, and some of the semiconductor components optically communicate with the optical-trace layers.

Abstract: The present invention provides a substrate assembly including a substrate, a composite-layered structure and a bonding layer. The composite-layered structure defines a conjunction plane, and one or more conductive-trace layers and one or more optical-trace layers are arranged either or both of over and beneath the conjunction plane; wherein the optical-trace layer defines a plurality of optical traces, and the conductive-trace layer defines a plurality of conductive traces. The bonding layer is adhesive between the substrate and the composite-layered structure. The present invention also provides an electronic device including a substrate assembly and a plurality of semiconductor components arranged on the composite-layered structure of the substrate assembly; wherein some of the semiconductor components are electrically connected to the conductive-trace layers, and some of the semiconductor components are optically communicated with the optical-trace layers.

Abstract: An antenna device includes a substrate and a plurality of antenna elements arranged in an array. The substrate has a driving circuit. The driving circuit defines a frame rate N and a refresh time, wherein the sum of N refresh times is 1 second. The antenna elements are arranged on the substrate and are electrically connected to the driving circuit. The antenna elements jointly define a beamforming in each refresh time (1/N second), and the beamforming defines a signal, which includes a carrier frequency that is not less than 10 GHz and a characteristic information for communicating with a satellite. M consecutive beamformings contain two or more kinds of the characteristic information, wherein M is an integer not greater than 20.

Abstract: An electronic device includes a functional substrate, a conductive layer having a plurality of circuitries on the functional substrate, a plurality of redistribution-layered substrates arranged along one surface of the functional substrate, a plurality of functional components arranged on the functional substrate, and a plurality of computing and memory components arranged on one side of the redistribution-layered substrate.

Abstract: An antenna device includes a first substrate, plural antenna elements, a second substrate, plural circuit units, plural circuit patterned layers and plural conductive structures. The first substrate is defined with a first surface and a second surface opposite to each other. The antenna elements are arranged on the first surface of the first substrate. The second substrate is connected to the second surface of the first substrate. The circuit units are arranged at the second substrate. The circuit patterned layers are arranged on the first substrate and the second substrate. The conductive structures are connected to at least ones of the circuit patterned layers. One of the circuit patterned layers includes plural induction units corresponding to the antenna elements, at least ones of the circuit units correspond to the induction units, and the induction units and the antenna elements transmit a carrier signal to each other by electromagnetic induction.

Abstract: An electronic device may include: a display panel comprising a substrate, a plurality of pixels, a driving circuit, a display medium formed from an organic light-emitting material, and a plurality of shielding units on a first side of the substrate; a plurality of micro-photoelectric units on a second side of the substrate; and a filling layer including a transparent material and disposed on the second side of the substrate. The plurality of micro-photoelectric units may comprise respective micro-photoelectric elements, and at least one of the micro-photoelectric elements may be, or may include, a sensor element. Each of the plurality of micro-photoelectric units may be configured to emit light in a direction opposite to the substrate.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a redistribution structure configured with a redistribution layer trace; a substrate configured with a substrate trace facing the redistribution structure; an adhesion layer attaching the redistribution structure to the substrate; and a plurality of conductive members arranged at least through the adhesion layer and electrically connecting the RDL trace of the redistribution structure to the substrate trace of the substrate.

Abstract: An electronic device includes a substrate, plural varactors, a memory element, a driving unit and plural antenna elements. Each varactor is defined with a capacitor-voltage characteristic curve. The memory element is defined with one or more lookup tables for recording the capacitance values and varactor voltage values of the capacitor-voltage characteristic curve. The driving unit outputs plural voltage signals respectively to the varactors, and each voltage signal respectively provided with one varactor voltage value. Each antenna element is provided with various phase values in response to the capacitance values of the corresponding varactor. A selective one of the varactor voltage values in response to the required capacitance value of the corresponding varactor is found out from the lookup table(s) and delivered by the driving unit. The antenna elements are together enabled to form a wave beam with a characteristic wavefront in accordance with the capacitance values.

Abstract: An antenna device includes substrate layers, metallic layers, a non-shielding channel, an electronic component, a shielding layer and an antenna unit. The substrate layers include an upper substrate layer and a lower substrate layer located on two sides respectively. The metallic layers are disposed on the substrate layers. The non-shielding channel is at least defined at the upper substrate layer and communicates with the inner and outer surfaces of the upper substrate layer without being interfered by the first metallic layer. The electronic component is disposed on the outer surface of the upper substrate layer and corresponds to and at least partially covers the non-shielding channel. The shielding layer electrically shields the electronic component and is electrically connected to the first metallic layer. The antenna unit is disposed on an outer surface of the lower substrate layer and electrically coupled to the electronic component.

Abstract: An electronic device may include: a display panel comprising a pixel flexible substrate, a driving circuit, a display medium formed from an organic light-emitting material, and a plurality of shielding units; and a plurality of micro photoelectric units adjacent to a protection layer and away from the display panel. The plurality of micro-photoelectric units may comprise respective micro-photoelectric elements, and at least one of the micro-photoelectric elements may be, or may include, a sensor element. The protection layer may serve to protect the plurality of micro-photoelectric units while being located at one side of the plurality of micro-photoelectric units.

Abstract: An electronic detection interface for testing micro photoelectric chips or micro semiconductor chips comprises a substrate structure and a plurality of detection units in array, responsive to the micro photoelectric chips or the micro semiconductor chips. The substrate structure includes a circuit film, which comprises a plurality of circuit units in array. The detection units are disposed on a surface of the substrate structure, and are corresponded to the circuit units in a respect manner. Each of the detection units includes at least one resilient conductive pillar, which is electrically connected to each of the circuit units through a conductive pad. Each of the resilient conductive pillars is a conductive photoresist.

Abstract: A luminance compensation method of a light-emitting device is disclosed. The light-emitting device has a plurality of light-emitting elements. The luminance compensation method includes following steps of: obtaining a position of at least one of the light-emitting elements in a brightness anomalous status; and changing a brightness of at least one of the light-emitting elements disposed adjacent to the light-emitting element in the brightness anomalous status for compensating a brightness of the light-emitting elements in the brightness anomalous status.

Abstract: An electronic device comprises a target substrate, a micro semiconductor structure array, a conductor array, and a connection layer. The micro semiconductor structure array is disposed on the target substrate. The conductor array corresponds to the micro semiconductor structure array, and electrically connects the micro semiconductor structure array to a pattern circuit of the target substrate. The conductors of the conductor array are independent from one another. Each conductor is an integrated member formed by eutectic bonding a conductive pad of the target substrate and a conductive electrode of the corresponding one of the micro semiconductor structures of the micro semiconductor structure array. The connection layer connects the micro semiconductor structures to the target substrate. The connection layer excludes a conductive material. The connection layer contacts and surrounds the conductors, so that the connection layer and the conductors together form a one-layer structure.

Abstract: An electronic device comprises a target substrate, a micro semiconductor structure array, a conductor array, and a connection layer. The micro semiconductor structure array is disposed on the target substrate. The conductor array corresponds to the micro semiconductor structure array, and electrically connects the micro semiconductor structure array to a pattern circuit of the target substrate. The conductors of the conductor array are independent from one another. Each conductor is an integrated member formed by eutectic bonding a conductive pad of the target substrate and a conductive electrode of the corresponding one of the micro semiconductor structures of the micro semiconductor structure array. The connection layer connects the micro semiconductor structures to the target substrate. The connection layer excludes a conductive material. The connection layer contacts and surrounds the conductors, so that the connection layer and the conductors together form a one-layer structure.

Abstract: A display device has a plurality of sub-pixels, and includes a circuit substrate, a plurality of micro light-emitting semiconductor elements, a light conversion layer and an opposite substrate. The micro light-emitting semiconductor elements are disposed separately on the circuit substrate and configured corresponding to the sub-pixels. The light conversion layer has a plurality of light conversion portions disposed respectively corresponding to at least partial of the micro light-emitting semiconductor elements. The light emitted from the micro light-emitting semiconductor element corresponding to the sub-pixel passes through the light conversion portion to generate white light. The opposite substrate is disposed at one side of the light conversion layer away from the circuit substrate. In another display device, the light emitted from the micro light-emitting semiconductor element passes through the light conversion layer to generate white light.