Abstract: A tin (Sn) auto-filling device and system provided to provide new liquid Sn to an inner sidewall surface of a rotation crucible. A laser is exposed to the liquid Sn at the inner sidewall surface of the rotation crucible to generate extreme-ultraviolet-light (EUV) that is utilized to process workpieces within a semiconductor manufacturing plant (FAB). The auto-filling device automatically refills as the liquid Sn at the inner sidewall surface of the rotation crucible is consumed due to the liquid Sn at the inner sidewall surface of the rotation crucible being exposed to the laser.

Abstract: A laser produced plasma (LPP)-extreme ultraviolet (EUV) light source includes a vacuum chamber, a rotatable crucible disposed in the vacuum chamber with an annular inner surface for carrying a liquid metal, and a laser arranged to apply laser light to the liquid metal carried on the annular inner surface of the rotatable crucible to cause the liquid metal to emit EUV light. The LPP-EUV light source further includes a stationary component disposed in the vacuum chamber and positioned proximate to the annular inner surface of the rotatable crucible or surrounding the rotatable crucible, a coolant fluid delivery inlet or nozzle, and a cooling element secured with the stationary component and including a feature configured to operatively couple with coolant fluid delivered by the coolant fluid delivery inlet or nozzle.

Abstract: An EUV radiation source apparatus includes an EUV source vessel including a chamber; a crucible disposed in the chamber; a tin layer disposed on the crucible; a catcher disposed in the chamber and configured to collect fuel debris generated from a collision of the tin layer and a laser beam; a heat dissipation structure disposed over the catcher; and a venting system coupled to the EUV source vessel and communicable with the chamber. A method for generating EUV radiation includes: collecting fuel debris on a catcher disposed in a chamber of an EUV source vessel; dissipating heat from the catcher to the chamber; and venting a gas out of the EUV source vessel to cool the chamber to a decreased temperature through an opening disposed on the EUV source vessel.

Abstract: An EUV radiation source apparatus includes an EUV source vessel; a tin layer disposed in the EUV source vessel; a chamber disposed adjacent to the EUV source vessel; and a first filter disposed in the chamber, wherein the first filter includes a membrane and a mesh disposed on the membrane, and the membrane and the mesh are integrally formed. A method for generating EUV radiation includes: forming a first filter including a membrane and a mesh integrally formed with the membrane; disposing the first filter in a chamber adjacent to an EUV source vessel; and collecting fuel debris on the first filter in the chamber.

Abstract: An inspection apparatus includes: an inspection apparatus includes: a stage configured to receive a photomask; a radiation source configured to emit a first radiation beam for inspecting the photomask; and an aperture stop configured to receive a second radiation beam reflected from the photomask through an aperture of the aperture stop, wherein the aperture is tangent at a center of the aperture stop.

Abstract: An inspection apparatus includes: a stage configured to receive a photomask; a radiation source configured to inspect the photomask; a mirror configured to direct a first radiation beam from the radiation source to the photomask at a first tilt angle; an aperture stop configured to receive a second radiation beam reflected from the photomask through an aperture of the aperture stop, wherein the aperture is tangent at a center of the aperture stop; and a detector configured to generate an image of the photomask according to the second radiation beam.

Abstract: In a mask review method, a vacuum is drawn in a vacuum chamber that contains an extreme ultraviolet (EUV) actinic mask review system including an EUV illuminator, a mask stage, a projection optics box, and an EUV imaging sensor. With the vacuum drawn, a position is adjusted of at least one component of the EUV actinic mask review system. After the adjusting and with the vacuum drawn, an actinic image is acquired of an EUV mask mounted on the mask stage using the EUV imaging sensor. The acquiring includes transmitting EUV light from the EUV illuminator onto the EUV mask and projecting at least a portion of the EUV light reflected by the EUV mask onto the EUV imaging sensor using the projection optics box.

Abstract: To improve EUV emission stability, bumps and eaves are added to the interior wall of a rotating crucible that produces EUV light by vaporizing a pre-heated metal, such as tin, using a laser. The bumps and eaves prevent migration of debris and control liquid metal flow, which is otherwise distributed over time by the centrifugal forces generated as the crucible rotates. The bumps and eaves stabilize EUV emissions by changing turbulent liquid metal flow to a predominately laminar flow. Tin catchers of various designs are available to collect and recycle a significant portion of the debris and unused liquid metal. A closed crucible chamber design alleviates non-uniform heating issues.

Abstract: An inspection apparatus includes: a stage configured to receive a photomask; a radiation source configured to inspect the photomask; a mirror configured to direct a first radiation beam from the radiation source to the photomask at a first tilt angle; an aperture stop configured to receive a second radiation beam reflected from the photomask through an aperture of the aperture stop, wherein the aperture is tangent at a center of the aperture stop; and a detector configured to generate an image of the photomask according to the second radiation beam.

Abstract: A method includes: receiving a photomask; patterning a wafer by directing a first radiation beam to the wafer through the photomask at a first tilt angle; and inspecting the photomask. The inspecting includes: directing a second radiation beam to the photomask at a second tilt angle greater than the first tilt angle; receiving a third radiation beam reflected from the photomask; and generating an image of the photomask according to the third radiation beam.

Abstract: A method includes: receiving a photomask; patterning a wafer by directing a first radiation beam to the wafer through the photomask at a first tilt angle; and inspecting the photomask. The inspecting includes: directing a second radiation beam to the photomask at a second tilt angle greater than the first tilt angle; receiving a third radiation beam reflected from the photomask; and generating an image of the photomask according to the third radiation beam.

Abstract: A dual or multi-energy range x-ray image sensor is implemented as side-by-side pixel arrays on a planar and monolithic semiconductor substrate as part of an x-ray object detector. Each pixel array in this side-by-side monolithic arrangement is designed to be responsive to a particular x-ray energy range or spectrum (i.e. a high-energy (HE) range or a low-energy (LE) range) to provide high object sensitivity and material discrimination capabilities. The side-by-side monolithic construction of pixel arrays improves alignment and spacing precision for improved image alignment among different arrays specialized in detecting different energy levels and signatures. Furthermore, integrated signal processing circuitry, placed on a radiation-shielded periphery of the pixel arrays, enables improved detection performance with enhanced noise reduction and/or sensitivity.

Abstract: A dual or multi-energy range x-ray image sensor is implemented as side-by-side pixel arrays on a planar and monolithic semiconductor substrate as part of an x-ray object detector. Each pixel array in this side-by-side monolithic arrangement is designed to be responsive to a particular x-ray energy range or spectrum (i.e. a high-energy (HE) range or a low-energy (LE) range) to provide high object sensitivity and material discrimination capabilities. The side-by-side monolithic construction of pixel arrays improves alignment and spacing precision for improved image alignment among different arrays specialized in detecting different energy levels and signatures. Furthermore, integrated signal processing circuitry, placed on a radiation-shielded periphery of the pixel arrays, enables improved detection performance with enhanced noise reduction and/or sensitivity.

Abstract: A dual/multi-energy x-ray image sensor with stacked two-dimensional pixel arrays. Each pixel in one pixel array has a corresponding “overlaid” pixel in the other pixel array. The pixel arrays are stacked parallel and aligned so that they are nominally normal to the x-ray path, and so that a straight path taken by an x-ray photon from the x-ray source to a pixel in one pixel array will also nominally intersect the corresponding pixel in the other pixel array(s). The energy image sensor provides an x-ray scanning detector system, which has increased signal levels and signal-to-noise ratios over dual- or multi-energy detectors using linear diode arrays, specifically when the pixel arrays are TDI pixel arrays that offer higher sensitivities in high-speed line-scan applications. Signal processing circuitry is placed on a periphery of the pixel arrays and shielded. Dual-to-multiple energy applications can be accomplished by increasing the number of stacked pixel arrays.

Abstract: A dual/multi-energy x-ray image sensor with stacked two-dimensional pixel arrays. Each pixel in one pixel array has a corresponding “overlaid” pixel in the other pixel array. The pixel arrays are stacked parallel and aligned so that they are nominally normal to the x-ray path, and so that a straight path taken by an x-ray photon from the x-ray source to a pixel in one pixel array will also nominally intersect the corresponding pixel in the other pixel array(s). The energy image sensor provides an x-ray scanning detector system, which has increased signal levels and signal-to-noise ratios over dual- or multi-energy detectors using linear diode arrays, specifically when the pixel arrays are TDI pixel arrays that offer higher sensitivities in high-speed line-scan applications. Signal processing circuitry is placed on a periphery of the pixel arrays and shielded. Dual-to-multiple energy applications can be accomplished by increasing the number of stacked pixel arrays.

Abstract: An X-ray line-scan camera utilizes an image transferring means to alter the optical path and thus eliminates the X-ray radiation damage on the electrical components of the camera system. The camera comprises a layer of scintillating material, a fiber optic face plate (FOFP) block, and an array of image sensors. One face of the FOFP block is bonded to the surface of the image sensors. The layer of scintillating material is placed on other face of the FOFP block and used to convert an impinging X-ray beam into visible light. The FOFP block is used to transfer the visible light from the scintillating layer onto the image sensor array, which in turn converts the visible light into electrical video signals. The FOFP block has a rotation angle of 32 to 40 degree relative to the impinging X-ray beam to prevent direct impingement of the X-ray beam onto the image sensors.

Abstract: A radiation damage resistant linear X-ray detector array system based on a unique buttable monolithic image sensor design and precision chip-on-board assembly technology includes at least one of the detector chips. Multiple chips of the image sensor may be butted end-to-end on a common printed circuit board to accommodate larger detection systems. A layer of scintillating material, such as Gd2O2S:Tb (GOS), CsI(Tl), or CdWO4, is placed on the image sensor to convert the impinging X-ray energies into visible light which can be detected efficiently by the image sensor array. A protective metal shield is fastened to the substrate to protect the sensitive circuits of the image sensor from X-ray radiation damage. A proper separation of sensitive circuits from the photodiode array on the sensor chip, coupled with precision registration of the sensor chips on the substrate, allows easy installation of the protective metal shield.

Abstract: A radiation damage resistant linear X-ray detector system based on a unique image transferring principle to alter the optical path and thus reduces or eliminates the X-ray radiation damage on the electrical components of the detector system. The system includes a layer of scintillating material, a fiber optic face plate (FOFP), and an array of image sensors. One face of the FOFP is bonded to the surface of the image sensors. The layer of scintillating material, such as Gd2O2S:Tb (GOS or GADOX), CsI(TI), or CdWO4, is placed on other face of the FOFP and used to convert the impinging X-ray energies into visible light which can be detected efficiently by the image sensor array. The FOFP is used to transfer the visible light from the scintillating layer onto the image sensor array after the X-ray flux has been converted.

Abstract: A radiation damage resistant linear X-ray detector array system based on a unique focusing principle reduces or eliminates the X-ray radiation damage on the electrical components of the detector system. The system includes a layer of scintillating material, a rod lens array, and an array of image sensors. The layer of scintillating material, such as Gd2O2S:Tb (GOS or GADOX), CsI(TI), or CdWO4, is placed on an image plane and used to convert the impinging X-ray energies into visible light which can be detected efficiently by the image sensor array. The rod lens array is used to focus the visible light after the X-ray flux has been converted. The photon energy of the visible light is collected with a scanning image sensor array that converts the photon energy proportionally into electrical video signals and enables the signals to be processed using standard signal and image processing software and equipment.

Abstract: A radiation damage resistant linear X-ray detector array system based on a unique focusing principle reduces or eliminates the X-ray radiation damage on the electrical components of the detector system. The system includes a layer of scintillating material, a rod lens array, and an array of image sensors. The layer of scintillating material, such as Gd2O2S:Tb (GOS or GADOX), CsI(TI), or CdWO4, is placed on an image plane and used to convert the impinging X-ray energies into visible light which can be detected efficiently by the image sensor array. The rod lens array is used to focus the visible light after the X-ray flux has been converted. The photon energy of the visible light is collected with a scanning image sensor array that converts the photon energy proportionally into electrical video signals and enables the signals to be processed using standard signal and image processing software and equipment.