Patents by Inventor Hsin Fu Tseng

Hsin Fu Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5724094
    Abstract: A contact image sensing system that eliminates the use of npn phototransistors. The device comprises a plurality of sensing elements, a like number of dummy sensing elements, control and drive clocks, a digital scanning shift register, and a differential amplifier. The device operates by sequentially reading the voltage output of the sensors, then comparing that output with the output of the dummy sensors so that any noise or offset in the signal can be cancelled by a differential amplifier.
    Type: Grant
    Filed: September 22, 1995
    Date of Patent: March 3, 1998
    Assignee: ScanVision
    Inventors: Hsin-Fu Tseng, Weng-Lyang Wang
  • Patent number: 5650864
    Abstract: A color-reproducing contact image sensing (CORCIS) system that eliminates the use of multiple arrays of photodetectors with separate color filters and which permits the use of any of various signal-processing improvements such as voltage pickoff, transducer gain and correlated double sample and hold processing. The device operates by sequentially illuminating the colored object to be reproduced by primary color illumination means, with each illumination transferring in parallel the appropriate color response to a readout register for sequential readout. The sample and hold, and the parallel transfer operation, allow the CORCIS system to be able to read out signal while the detector array is integrating the next color signal, thus improving the sensitivity.
    Type: Grant
    Filed: April 8, 1996
    Date of Patent: July 22, 1997
    Assignee: Scanvision
    Inventors: Hsin-Fu Tseng, Weng-Lyang Wang
  • Patent number: 4250517
    Abstract: An improved BBD structure is disclosed which is realized with MOS, two layer, polysilicon technology. In the tetrode structure, the transfer gate overlaps the tetrode gate with no intermediate substrate region. The storage capacitor is off-set from the propagation channel and is formed by the two layers of polysilicon without using a p-n junction. High transfer efficiency is obtained over a wide frequency range with a shorter length per stage.
    Type: Grant
    Filed: November 30, 1979
    Date of Patent: February 10, 1981
    Assignee: Reticon Corporation
    Inventor: Hsin-fu Tseng
  • Patent number: 4087833
    Abstract: A photodiode array employing an analog shift register with a line of interlaced photodiodes. Alternate diodes are coupled to one of a pair of analog shift registers which are disposed on opposite sides of the line of photodiodes. An "anti-blooming" polysilicon line and a "transfer" polysilicon line are disposed along each side of the line of photodiodes adjacent to the shift registers. Each of the diffused region forming the photodiodes are coupled by a metal line to another diffused region formed between the anti-blooming and transfer polysilicon lines. This latter region acts as a remote, common region for both the anti-blooming function and transfer function.
    Type: Grant
    Filed: January 3, 1977
    Date of Patent: May 2, 1978
    Assignee: Reticon Corporation
    Inventor: Hsin Fu Tseng