Abstract: This disclosure relates to a combined power module that includes a base structure, a terminal structure, a second terminal, and a cover. The terminal structure includes a mount assembly and a plurality of first terminals. The mount assembly is assembled on the base structure. The first terminals are disposed on the mount assembly. The second terminal is disposed on the base structure. The cover is disposed on the base structure and covers at least part of the first terminals and at least part of the second terminal.

Abstract: A power module with detachable function is provided. The power module includes a housing box part, a power component, a housing cover part, and a sensing component. The sensing component is configured to measure parameters of the power component and detachably installed on the housing cover part and the housing box part. When the housing cover part is mounted on the housing box part, the housing cover part and the housing box part can restrict the movement of the sensing component. Thus, a tight fit can be achieved.

Abstract: A defogging lens barrel structure includes a lens barrel, a heating module, and a lens assembly. The lens barrel includes a receiving groove with an inner wall. The heating module and the lens assembly are respectively disposed within the lens barrel. The lens assembly includes a first lens mounted in the receiving groove, supported by the heating module, and having a peripheral portion. A slot is provided between the peripheral portion and the inner wall. The receiving groove has a positioning part. The heating module has a positioned part correspondingly matching with the positioning part. A gap is provided between the heating module and the inner wall. With such design, the contact of the heating module and the first lens with the inner wall of the lens barrel could be reduced, thereby reducing the effect of the heat of the heating module and the first lens being dispersed.

Abstract: A defogging lens barrel structure includes a lens barrel, a lens assembly, a heating module, a temperature-sensing module, and a thermal insulating material. The lens barrel has a receiving groove. An inner portion of the receiving groove includes an abutting surface and a recess disposed on the abutting surface. The lens assembly is disposed inside the lens barrel and includes a first lens disposed in the receiving groove. The first lens has a lens abutting surface correspondingly facing the abutting surface. The heating module is disposed between the abutting surface of the lens barrel and the lens abutting surface of the first lens and is adapted to provide a heat source. The temperature-sensing module is engaged with the heating module and is received in the recess of the lens barrel. The thermal insulating material encloses around the temperature-sensing module to be filled into the recess.

Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

Abstract: This disclosure relates to a combined power module that includes a base structure, a terminal structure, a second terminal, and a cover. The terminal structure includes a mount assembly and a plurality of first terminals. The mount assembly is assembled on the base structure. The first terminals are disposed on the mount assembly. The second terminal is disposed on the base structure. The cover is disposed on the base structure and covers at least part of the first terminals and at least part of the second terminal.

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

Abstract: Provided are a power module and a manufacturing method thereof. The power module includes an insulating substrate, a first, a second and a third conductive layers, a first thermal interface material layer, a first and a second chips and a thermal conductive layer. The insulating substrate has a first and a second surfaces opposite to each other. The first and the second conductive layers are disposed on the first surface, and electrically separated from each other. The first thermal interface material layer is disposed on the first conductive layer. The third conductive layer is disposed on the first thermal interface material layer. The first chip is disposed on the third conductive layer and electrically connected to the third conductive layer. The second chip is disposed on the second conductive layer and electrically connected to the second conductive layer. The thermal conductive layer is disposed on the second surface.

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

Abstract: A chip package structure including first and second insulating layers, first and second circuit structures, a chip on the first circuit structure, an encapsulant, a conductive through via, and first and second heat dissipation layers is provided. The first circuit structure is disposed at the first surface of the first insulating layer. The bottom electrode of the chip is electrically connected to the first circuit structure. The second circuit structure is disposed on the chip and electrically connected to the top electrode of the chip. The encapsulant encapsulates the first and second circuit structures and the chip. The conductive through via is disposed in the encapsulant and connects the first and second circuit structures. The second insulating layer is disposed on the second circuit structure. The first heat dissipation layer is disposed on the first insulating layer. The second heat dissipation layer is disposed on the second insulating layer.

Abstract: A chip package structure including first and second insulating layers, first and second circuit structures, a chip on the first circuit structure, an encapsulant, a conductive through via, and first and second heat dissipation layers is provided. The first circuit structure is disposed at the first surface of the first insulating layer. The bottom electrode of the chip is electrically connected to the first circuit structure. The second circuit structure is disposed on the chip and electrically connected to the top electrode of the chip. The encapsulant encapsulates the first and second circuit structures and the chip. The conductive through via is disposed in the encapsulant and connects the first and second circuit structures. The second insulating layer is disposed on the second circuit structure. The first heat dissipation layer is disposed on the first insulating layer. The second heat dissipation layer is disposed on the second insulating layer.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.

Abstract: A method for making a cemented tungsten carbide-based material includes subjecting a cemented tungsten carbide substrate film to chromization so as to form the cemented tungsten carbide substrate with a chromized layer that contains a tungsten carbide and a chromium carbide and forming a diamond film on the chromized layer.

Abstract: A cemented tungsten carbide-based material includes: a cemented tungsten carbide substrate having a chromized layer that contains a tungsten carbide and a chromium carbide; and a diamond film formed on said chromized layer. A method for making the cemented tungsten carbide-based material involves subjecting a cemented tungsten carbide substrate to chromization so as to form the cemented tungsten carbide substrate with a chromized layer that contains a tungsten carbide and a chromium carbide; and forming a diamond film on the chromized layer.