Power module
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Description
The broken lines in the figures illustrate the portions of the design that form no part of the claimed design.
Claims
The ornamental design for a power module, as shown and described.
Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D976852
Type: Grant
Filed: Jun 18, 2020
Date of Patent: Jan 31, 2023
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Sheng-Tsai Wu (Taoyuan), Hsin-Han Lin (Hsinchu County), Yuan-Yin Lo (Hsinchu County), Kuo-Shu Kao (Zhubei), Tai-Jyun Yu (Taoyuan), Han-Lin Wu (Hsinchu), Yen-Ting Lin (Hsinchu)
Primary Examiner: Christy Nemeth
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/738,677
Type: Grant
Filed: Jun 18, 2020
Date of Patent: Jan 31, 2023
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Sheng-Tsai Wu (Taoyuan), Hsin-Han Lin (Hsinchu County), Yuan-Yin Lo (Hsinchu County), Kuo-Shu Kao (Zhubei), Tai-Jyun Yu (Taoyuan), Han-Lin Wu (Hsinchu), Yen-Ting Lin (Hsinchu)
Primary Examiner: Christy Nemeth
Assistant Examiner: Leah E Hoeferkamp
Application Number: 29/738,677
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)