Abstract: A semiconductor device includes a semiconductor substrate, a photo sensing region, and a plurality of nanostructures. The semiconductor substrate has a first dopant. The photo sensing region is embedded in the semiconductor substrate, has a top surface level with a top surface of the semiconductor substrate, and has a second dopant that is of a different conductivity type than the first dopant. The plurality of nanostructures is on the photo sensing region and is made of a material the same as the photo sensing region.

Abstract: A memory device includes a non-volatile (NV) memory including a plurality of NV memory elements. A method for performing programming management of the NV memory includes: setting a programming sequence of the NV memory elements; determining a selection interval between each of the NV memory elements according to the programming sequence and a serial number of each of the NV memory elements; for a target NV memory element of the plurality of NV memory elements in the programming sequence, determining a serial number of an immediately previous NV memory element in the programming sequence according to the selection interval and a serial number of the target NV memory element; determining whether the immediately previous NV memory element is in a busy state; and only when the immediately previous NV memory element is not in the busy state, programming the target NV memory element.

Abstract: A method for manufacturing a memory device is provided. The method includes etching an opening in a first dielectric layer; forming a bottom electrode, a resistance switching element, and a top electrode in the opening in the first dielectric layer; forming a second dielectric layer over the bottom electrode, the resistance switching element, and the top electrode; and forming an electrode via connected to a top surface of the top electrode in the second dielectric layer.

Abstract: A memory device includes a substrate, an etch stop layer, a protective layer, and a resistance switching element. The substrate has a memory region and a logic region, and includes a metallization pattern therein. The etch stop layer is over the substrate, and has a first portion over the memory region and a second portion over the logic region. The protective layer covers the first portion of the etch stop layer. The protective layer does not cover the second portion of the etch stop layer. The resistance switching element is over the memory region, and the resistance switching element is electrically connected to the metallization pattern through the etch stop layer and the protective layer.

Abstract: A method for performing read acceleration, an associated data storage device and controller thereof are provided, where the method is applicable to the data storage device and the controller. The method includes: receiving a write command from a host device, and performing programming on a non-volatile (NV) memory element within a plurality of NV memory elements according to the write command; recording operation command-related information corresponding to the write command; when a read command having high priority exists in a queue corresponding to the NV memory element, suspending performing programming on the NV memory element; executing the read command; and after executing the read command, continuing performing programming on the NV memory element at least according to the operation command-related information.

Abstract: A memory device includes a non-volatile (NV) memory including a plurality of NV memory elements. A method for performing programming management of the NV memory includes: setting a programming sequence of the NV memory elements; determining a selection interval between each of the NV memory elements according to the programming sequence and a serial number of each of the NV memory elements; for a target NV memory element of the plurality of NV memory elements in the programming sequence, determining a serial number of an immediately previous NV memory element in the programming sequence according to the selection interval and a serial number of the target NV memory element; determining whether the immediately previous NV memory element is in a busy state; and only when the immediately previous NV memory element is not in the busy state, programming the target NV memory element.

Abstract: A method for performing programming management, associated memory device and a controller thereof are provided. The memory device may include a non-volatile (NV) memory, and the NV memory may include a plurality of NV memory elements. The method may include: before programming a target NV memory element of the plurality of NV memory elements, checking whether another NV memory element of the plurality of NV memory elements is in a busy state or in a non-busy state; and when the other NV memory element enters the non-busy state, programming the target NV memory element.

Abstract: A memory device includes a substrate, an etch stop layer, a protective layer, and a resistance switching element. The substrate has a memory region and a logic region, and includes a metallization pattern therein. The etch stop layer is over the substrate, and has a first portion over the memory region and a second portion over the logic region. The protective layer covers the first portion of the etch stop layer. The protective layer does not cover the second portion of the etch stop layer. The resistance switching element is over the memory region, and the resistance switching element is electrically connected to the metallization pattern through the etch stop layer and the protective layer.

Abstract: A semiconductor device includes a semiconductor substrate, a photo sensing region, and a plurality of nanostructures. The semiconductor substrate has a first dopant. The photo sensing region is embedded in the semiconductor substrate, has a top surface level with a top surface of the semiconductor substrate, and has a second dopant that is of a different conductivity type than the first dopant. The plurality of nanostructures is on the photo sensing region and is made of a material the same as the photo sensing region.

Abstract: A method of forming a semiconductor device includes forming a photo sensing region in a semiconductor substrate, wherein the semiconductor substrate is of a first type dopant and the photo sensing region is of a second type dopant that has a different conductivity type than the first type dopant; forming a nanostructure layer in contact with an interface between the photo sensing region and the semiconductor substrate; and etching the nanostructure layer until exposing the photo sensing region to form a plurality of nanostructures.

Abstract: A method for performing read acceleration, an associated data storage device and controller thereof are provided, where the method is applicable to the data storage device and the controller. The method includes: receiving a write command from a host device, and performing programming on a non-volatile (NV) memory element within a plurality of NV memory elements according to the write command; recording operation command-related information corresponding to the write command; when a read command having high priority exists in a queue corresponding to the NV memory element, suspending performing programming on the NV memory element; executing the read command; and after executing the read command, continuing performing programming on the NV memory element at least according to the operation command-related information.

Abstract: A method of forming a semiconductor device includes forming a photo sensing region in a semiconductor substrate, wherein the semiconductor substrate is of a first type dopant and the photo sensing region is of a second type dopant that has a different conductivity type than the first type dopant; forming a nanostructure layer in contact with an interface between the photo sensing region and the semiconductor substrate; and etching the nanostructure layer until exposing the photo sensing region to form a plurality of nanostructures.

Abstract: A method for performing dynamic resource management in a memory device, the memory device, and a controller thereof are provided. The memory device includes a non-volatile (NV) memory, and the NV memory includes a plurality of NV memory elements. The method may include: storing a plurality of sets of physical region descriptor (PRD) information related to a plurality of host commands, respectively, and storing a plurality of intermediate PRDs respectively corresponding to the plurality of sets of PRD information into a first queue; obtaining an intermediate PRD of the plurality of intermediate PRDs from the first queue, and storing the intermediate PRD into a second queue; sending a command to the NV memory according to the intermediate PRD in the second queue to access data; and when an operation of accessing the data is successful, releasing the intermediate PRD from the second queue to the first queue.

Abstract: A semiconductor device is provided, which includes a substrate and at least one nanostructure. The substrate has sensing pixels, and each of the sensing pixels has a photo sensing region for absorbing incident light. The nanostructure is directly on the photo sensing region. The nanostructure of each of the sensing pixels has a projected portion on an upper surface of the substrate, and a circle equivalent diameter of the projected portion of the nanostructure of each of the sensing pixels is substantially within a wavelength range of 100 nm to 1900 nm of the incident light configured to enter the substrate through the nanostructure.

Abstract: A method for performing dynamic resource management in a memory device, the memory device, and a controller thereof are provided. The memory device includes a non-volatile (NV) memory, and the NV memory includes a plurality of NV memory elements. The method may include: storing a plurality of sets of physical region descriptor (PRD) information related to a plurality of host commands, respectively, and storing a plurality of intermediate PRDs respectively corresponding to the plurality of sets of PRD information into a first queue; obtaining an intermediate PRD of the plurality of intermediate PRDs from the first queue, and storing the intermediate PRD into a second queue; sending a command to the NV memory according to the intermediate PRD in the second queue to access data; and when an operation of accessing the data is successful, releasing the intermediate PRD from the second queue to the first queue.

Abstract: A method for performing programming management, associated memory device and a controller thereof are provided. The memory device may include a non-volatile (NV) memory, and the NV memory may include a plurality of NV memory elements. The method may include: before programming a target NV memory element of the plurality of NV memory elements, checking whether another NV memory element of the plurality of NV memory elements is in a busy state or in a non-busy state; and when the other NV memory element enters the non-busy state, programming the target NV memory element.

Abstract: A semiconductor device is provided, which includes a substrate and at least one nanostructure. The substrate has sensing pixels, and each of the sensing pixels has a photo sensing region for absorbing incident light. The nanostructure is directly on the photo sensing region. The nanostructure of each of the sensing pixels has a projected portion on an upper surface of the substrate, and a circle equivalent diameter of the projected portion of the nanostructure of each of the sensing pixels is substantially within a wavelength range of 100 nm to 1900 nm of the incident light configured to enter the substrate through the nanostructure.

Abstract: The present disclosure provides a semiconductor device and a method of fabricating the semiconductor device. In some embodiments, the semiconductor device includes a substrate having a well region, a first source/drain region, a second source/drain region, a buried channel and a gate structure. The first source/drain region is located within the well region. The gate structure includes a co-doped gate including polysilicon and having a first concentration of a n-type impurity and a second concentration of a p-type impurity, in which the n-type impurity and the p-type impurity are mixed and distributed.

Abstract: A flip chip light-emitting diode (LED) package structure includes a circuit board, an electrical conducting layer and a plurality of flip chip light-emitting elements. The circuit board includes a bearing surface. The electrical conducting layer is formed on the bearing surface, and includes a plurality of electrical connection regions independent of each other. Each flip chip light-emitting element includes a p-type electrode and an n-type electrode. The p-type electrodes and the n-type electrodes of the flip chip light-emitting elements are electrically connected to the electrical connection regions, so that the flip chip light-emitting elements are electrically connected in series to form a package structure. During packaging of the flip chip light-emitting elements, the structure formed by the serial connection forms a circuit that can withstand a high voltage, and further reduce the current.

Abstract: A segment positioning belt having a flexible belt body having a positioning end and an extension. A plurality of segment positioning portions are positioned in spaced relation to each other along the extension. A metal core is integrally formed into the belt body. The metal core extends within the positioning end and the extension of the belt body. The belt body has an elongated strip shape. The belt body is formed of a rubber or polymeric material.