Abstract: A photoresist includes a solvent, a polymer and an additive. The polymer is dissolved in the solvent, and the additive is dispersed in the solvent. The additive includes a double bond or includes an epoxy group. The additive has a surface tension different from a surface tension of the polymer.

Abstract: An atomization module includes a main fixing member, an auxiliary fixing member, an atomization component and a piezoelectric component. The main fixing member includes a first bonding part, a second bonding part and a connecting part. The first bonding part has a first opening and a first bonding surface surrounding the first opening. The second bonding part is connected to the first bonding part, and the connecting part and the second bonding part surround the first bonding part. The auxiliary fixing member has a second opening and a second bonding surface surrounding the second opening. The piezoelectric component surrounds the first bonding part. The main fixing member has a first adhesive groove, which is jointly defined at least by the main fixing member, the auxiliary fixing member and the atomization component. The first adhesive is provided in the first adhesive groove.

Abstract: An electronic device is provided. The electronic device includes a display panel, a light-controlling layer, a retardation layer, and a first linear polarizer. The light-controlling layer is disposed between the display panel and the retardation layer. The retardation layer is disposed between the light-controlling layer and the first linear polarizer. A first transmission direction of the first linear polarizer is different from a second transmission direction of at least a portion of an incident light. The incident light passes through the retardation layer so as to enter the first linear polarizer.

Abstract: An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Abstract: A control system of a dual power supply type electrolyzer includes an electrolyzer, a first power supply circuit, and a second power supply circuit. The electrolyzer includes a first electrode and a second electrode. The first power supply circuit connected to the first electrode. The second power supply circuit connected to the second electrode. The first power supply circuit and the second power supply circuit simultaneously supply power respectively to the first electrode and the second electrode. The first electrode and the second electrode have a same amount of power, but the first electrode and the second electrode have different polarities and their polarities alternate periodically.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer comprising an organic material over a substrate. A second layer is formed over the first layer, wherein the second layer includes a silicon-containing material and one or more selected from the group consisting of a photoacid generator, an actinic radiation absorbing additive including an iodine substituent, and a silicon-containing monomer having iodine or phenol group substituents. A photosensitive layer is formed over the second layer, and the photosensitive layer is patterned.

Abstract: A semiconductor device includes a semiconductor substrate, a first semiconductor fin, a second semiconductor fin, an isolation structure, and a gate structure. The first and second semiconductor fins extend upwards from a top surface of the semiconductor substrate. The isolation structure is between the first semiconductor fin and the second semiconductor fin. The gate structure includes a first work function layer, a second work function layer, and a third work function layer. The first work function layer surrounds the first semiconductor fin and the second semiconductor fin. The second work function layer surrounds the first semiconductor fin and is over the first work function layer. The third work function layer surrounds the first semiconductor fin and is over the second work function layer and the isolation structure. The first work function layer is in contact with the second work function layer and the third work function layer.

Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.

Abstract: A method for bicycle fitting includes receiving evaluation factors based on one or more scenario parameters; positioning at least one of a saddle and a handlebar to one or more positions when a user is pedaling; determining values for the evaluation factors according to data received from one or more sensors at the one or more positions; and processing the values to identify one or more recommended positions for the saddle or the handlebar.

Abstract: An ultraviolet disinfection apparatus being integral to existing pipe system is provided, comprising a hollow body with at least two open ends and an arbitrary cross-section, a UV module and a control module. The hollow body is configured for receiving the UV module, and to communicate with at least one end of a pipe structure such that a medium passing therethrough will not leak. The hollow body has an inner surface and an outer surface; the inner surface includes one or more interior structures defined by one or more partition walls for sub-dividing hollow space of the hollow body into at least two relatively smaller hollow spaces. The UV module comprises one or more UV LED arrays arranged independently or severally on the inner surface and/or the interior structures to increase UV exposure to the medium. The control module is remotely connected to the UV module outside the hollow body.

Abstract: An ultraviolet device is provided, which includes a gas jetting module, a flow rate adjustment module, an ultraviolet module and a first gas channel. The gas jetting module includes an upper panel, a lower panel and a frame. The upper panel is disposed on the upper side of the frame. The lower panel is disposed on the lower side of the frame and includes one or more gas outlets. A gas chamber is formed between the upper panel, lower panel and frame. The first gas channel is connected to the gas jetting module. The flow rate adjustment module is connected to the first gas channel and adjusts the flow rate of the gas inputted into the gas chamber via the first gas channel. The ultraviolet module includes an ultraviolet light source and is connected to the gas jetting module.

Abstract: A photoelectric conversion compound is provided. The photoelectric conversion compound has a structure represented by formula (I): wherein D represents an inorganic luminescent group; each of R1, R2, and R3 independently represents a hydrogen atom or a C1-6 alkyl group; R4 represents a single bond or a C1-6 alkylene group; m represents an integer of 1-10; k represents an integer of 1-1,000; and n represents an integer of 1-10,000.

Abstract: A solar cell module is provided. The solar cell module includes a first substrate, a second substrate opposite the first substrate, a cell unit disposed between the first and second substrates, a first thermosetting resin layer disposed between the cell unit and the first substrate, a first thermoplastic resin layer disposed between the cell unit and the first thermosetting resin layer, a second thermosetting resin layer disposed between the cell unit and the second substrate, and a second thermoplastic resin layer disposed between the cell unit and the second thermosetting resin layer.

Abstract: A heat sink and power interconnect for a UV LED array are provided. A first circuit is disposed on a surface of a first substrate. A UV LED array is positioned thereon. A second substrate and second circuit are spaced apart from the first substrate and a first heat sink is positioned adjacent thereto. An aperture passes through each of the first substrate, the second substrate, and the heat sink. An electrical insulator lines the aperture with an electrically and thermally conductive liner positioned adjacent to the electrical insulator. A fastener is positioned in the aperture and electrically interconnects the first circuit and the second circuit through the electrically and thermally conductive liner and electrically communicates with an external power supply. The fastener carries one or more of a power or an electrical signal, and dissipates heat through the electrically and thermally conductive liner to the heat sink.

Abstract: A soft start module includes a power component, a current sensing component, a reference voltage generating circuit, and a constant current control circuit. The power component has a first terminal connected to a first node, a second terminal connected to an Output node, and a third terminal connected to a third node. The current sensing component has a fourth terminal connected to an input node and a fifth terminal connected to the first node. The reference voltage generating circuit has a seventh terminal connected to a fourth node and an eighth terminal connected to a ground node. The constant current control circuit has a ninth terminal connected directly or indirectly to the fifth terminal of the current sensing component, a tenth terminal connected the fourth node, and an eleventh terminal connected to the third node.

Abstract: A method of manufacturing a semiconductor device includes forming a protective layer over a substrate. The hydrophilicity of the protective layer is reduced. A resist layer is formed over the protective layer, and the resist layer is patterned.

Abstract: A method of manufacturing a semiconductor device includes forming a first layer including an organic material over a substrate. A second layer including a reaction product of a silicon-containing material and a photoacid generator is formed over the first layer. A photosensitive layer is formed over the second layer, and the second layer is patterned.

Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.

Abstract: A mount bracket is adapted to fix a storage device to a first side plate. The mount bracket includes a base part and a handle. The base part includes a first support portion and a second support portion. The first support portion is configured to be removably disposed on the first side plate. The first support portion has at least one first buffering structure configured to be in contact with the first side plate. The second support portion is connected to the first support portion and configured to support the storage device. The handle is pivotably disposed on the base part.

Abstract: A touch panel includes a substrate, touch signal lines, sub-pixels, touch electrode groups, and at least one common signal array. The touch signal lines and the sub-pixels are located on substrate. Each of the sub-pixels includes a switch element and a pixel electrode. The switch element is electrically connected to a corresponding scan line and a corresponding data line. The touch electrode groups include touch electrodes. The touch electrodes overlap the pixel electrodes of the sub-pixels. Each of the touch electrode groups is electrically connected to a corresponding one of the touch signal lines. The common signal array includes common electrodes. Each of the common electrodes overlaps at least one of the scan line and the data line. The number of the sub-pixels overlapped by the common signal array is greater than the number of the sub-pixels overlapped by each of the touch electrode groups.