Patents by Inventor Hsin-Hua Hu

Hsin-Hua Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DISPLAY WITH EMBEDDED PIXEL DRIVER CHIPS
    Publication number: 20190096864
    Abstract: Embodiments describe a display integration scheme in which an array of pixel driver chips embedded front side up in an insulator layer. A front side redistribution layer (RDL) spans across and is in electrical connection with the front sides of the array of pixel driver chips, and an array of light emitting diodes (LEDs) is bonded to the front side RDL. The pixel driver chips may be located directly beneath the display area of the display panel.
    Type: Application
    Filed: February 28, 2018
    Publication date: March 28, 2019
    Inventors: Edzer Huitema, Vaibhav Patel, Tore Nauta, Xia Li, Hsin-Hua Hu
  • MICRO DEVICE TRANSFER HEAD HEATER ASSEMBLY AND METHOD OF TRANSFERRING A MICRO DEVICE
    Publication number: 20190096846
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Light emitting structure
    Patent number: 10192858
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 29, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • BACKPLANE LED INTEGRATION AND FUNCTIONALIZATION STRUCTURES
    Publication number: 20190006329
    Abstract: Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.
    Type: Application
    Filed: January 11, 2017
    Publication date: January 3, 2019
    Inventors: Imran Hashim, Vaibhav D. Patel, Hsin-Hua Hu, Kapil V. Sakariya, Ralph E. Kauffman
  • LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
    Publication number: 20180374831
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: July 6, 2018
    Publication date: December 27, 2018
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Micro device transfer head heater assembly and method of transferring a micro device
    Patent number: 10121864
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: November 6, 2018
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Light emitting device reflective bank structure
    Patent number: 10043784
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: August 7, 2018
    Assignee: APPLE INC.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • LIGHT EMITTING STRUCTURE
    Publication number: 20180197844
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: March 5, 2018
    Publication date: July 12, 2018
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Method and structure for receiving a micro device
    Patent number: 9911722
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: January 12, 2017
    Date of Patent: March 6, 2018
    Assignee: APPLE INC.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Compliant micro device transfer head
    Patent number: 9895902
    Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
    Type: Grant
    Filed: September 28, 2016
    Date of Patent: February 20, 2018
    Assignee: APPLE INC.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
  • MICRO-LIGHT EMITTING DIODE WITH METAL SIDE MIRROR
    Publication number: 20170373228
    Abstract: Light emitting diodes and display systems are disclosed. In an embodiment a light emitting diode (150) includes a p-n diode (120) including a mesa structure (129) that protrudes from a base structure (131). A reflective metallization (130) laterally surrounds the mesa structure, which also includes a quantum well layer of the p-n diode.
    Type: Application
    Filed: September 30, 2015
    Publication date: December 28, 2017
    Inventors: Kevin K.C. CHANG, Hsin-Hua HU, Chein-Hsing HUANG
  • LED array
    Patent number: 9831383
    Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
    Type: Grant
    Filed: November 4, 2013
    Date of Patent: November 28, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
  • Method of transferring and bonding an array of micro devices
    Patent number: 9773750
    Abstract: Electrostatic transfer head array assemblies and methods of transferring and bonding an array of micro devices to a receiving substrate are described. In an embodiment, a method includes picking up an array of micro devices from a carrier substrate with an electrostatic transfer head assembly supporting an array of electrostatic transfer heads, contacting a receiving substrate with the array of micro devices, transferring energy from the electrostatic transfer head assembly to bond the array of micro devices to the receiving substrate, and releasing the array of micro devices onto the receiving substrate.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: September 26, 2017
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu, Hung-Fai Stephen Law
  • LED with current injection confinement trench
    Patent number: 9768345
    Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: September 19, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kelly McGroddy
  • Micro device stabilization post
    Patent number: 9741592
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: August 22, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • MICRO DEVICE STABILIZATION POST
    Publication number: 20170170049
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: February 28, 2017
    Publication date: June 15, 2017
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • LIGHT EMITTING DEVICE REFLECTIVE BANK STRUCTURE
    Publication number: 20170148773
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Application
    Filed: February 7, 2017
    Publication date: May 25, 2017
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • METHOD AND STRUCTURE FOR RECEIVING A MICRO DEVICE
    Publication number: 20170125391
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: January 12, 2017
    Publication date: May 4, 2017
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Light emitting device reflective bank structure
    Patent number: 9620487
    Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
  • Micro device with stabilization post
    Patent number: 9620695
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: June 24, 2016
    Date of Patent: April 11, 2017
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl