Abstract: A method for forming an interconnect structure includes forming a first conductive layer over a dielectric layer, forming one or more openings in the first conductive layer to expose portions of dielectric surface of the dielectric layer and conductive surfaces of the first conductive layer, wherein the one or more openings separates the first conductive layer into one or more portions.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes an electrical interconnect structure, a thermal interconnect structure, and a thermal passivation layer over a substrate. The electrical interconnect structure includes interconnect vias and interconnect wires embedded within interconnect dielectric layers. The thermal interconnect structure is arranged beside the electrical interconnect structure and includes thermal vias, thermal wires, and/or thermal layers. Further, the thermal interconnect structure is embedded within the interconnect dielectric layers. The thermal passivation layer is arranged over a topmost one of the interconnect dielectric layers. The thermal interconnect structure has a higher thermal conductivity than the interconnect dielectric layers.

Abstract: A hard disk tray conducive to automated productions includes a loading frame, a base frame, an abutment member disposed within the base frame, a handle and a buckle. The loading frame includes a first frame body for loading a hard disk device therein. The base frame includes a base body connected to the first frame body, and an abutting elastic arm integrated to the base body. The handle includes a bracket pivoted to the base body, a first elastic arm integrated to the bracket to abut against the abutting elastic arm, and a first fastening portion disposed on the bracket. The buckle includes a buckle body pivoted to the base body, a second elastic arm integrated to the buckle body to abut against the abutment member, and a second fastening portion disposed on the buckle body for fastening to the first fastening portion.