Fan module cover
Latest CHENBRO MICOM CO., LTD. Patents:
Description
Shading is used to illustrate the curvature of the part and not color.
Claims
The ornamental design for a fan module cover, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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Patent History
Patent number: D1033436
Type: Grant
Filed: Jul 1, 2021
Date of Patent: Jul 2, 2024
Assignee: CHENBRO MICOM CO., LTD. (New Taipei)
Inventors: Chiung-Wei Lin (New Taipei), Hsin-Lin Teng (New Taipei)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/797,520
Type: Grant
Filed: Jul 1, 2021
Date of Patent: Jul 2, 2024
Assignee: CHENBRO MICOM CO., LTD. (New Taipei)
Inventors: Chiung-Wei Lin (New Taipei), Hsin-Lin Teng (New Taipei)
Primary Examiner: Jack Reickel
Assistant Examiner: Russell Carnell Smith, Jr.
Application Number: 29/797,520
Classifications
Current U.S. Class:
Element Or Attachment (D14/432)