Patents by Inventor Hsin-Tuan Hsiao

Hsin-Tuan Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769966
    Abstract: An anti-attenuation apparatus has an electronic device and a cable assembly. The electronic device has a circuit board and a plurality of metal pads mounted on the circuit board as female connecting spots. The cable assembly has a cable main body and an inserting connector. The inserting connector is mounted at an end of the cable main body and has multiple elastic components as male connecting spots. The female connecting spots and the male connecting spots selectively contact each other and thus the electric connection is formed. Therefore, the electronic device needs no additional socket and no additional connector as female connecting spots. Similarly, the cable assembly needs no additional connector for connecting the elastic component and the cable main body. In other words, twice attenuations are skipped in a set that has the electronic device and the cable assembly.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: September 26, 2023
    Assignee: Bizlink International Corp.
    Inventors: Hsin-Tuan Hsiao, Yi-Hsing Chung
  • Patent number: 11749918
    Abstract: A contact pad is provided. The contact pad may be a strip-shaped component and forms at least one opening. A circuit device is also provided. The circuit device has a circuit board, at least one contact pad as mentioned above, and a cable. The contact pad is mounted on the circuit board as a connecting spot. The cable has at least one wire. The wire is mounted on the contact pad and covers the opening of the contact pad. An interval is formed in the opening and between the circuit board and the wire. With such structure, a capacitance formed between the wire and the circuit board may be the smallest and the impedance value may be the largest. Besides, the capacitance value can be adjusted via changing the material inside the interval or an area of the contact pad or the opening.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: September 5, 2023
    Assignee: BIZLINK INTERNATIONAL CORP.
    Inventors: Hsin-Tuan Hsiao, Yi-Hsing Chung, Ting-Jhen Pan
  • Patent number: 11631945
    Abstract: A connector assembly includes a wire end connector for electrically connecting to a board end connector. The wire end connector includes a main body portion and an insertion portion. The insertion portion is connected to the main body portion, and the insertion portion is configured to couple to the board end connector. The main body portion is provided with a plurality of elastic claws extending outward from the main body portion to press on the board end connector when the insertion portion is coupled to the board end connector so as to stably connect the wire end connector to the board end connector.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: April 18, 2023
    Assignee: BIZLINK INTERNATIONAL CORP.
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Patent number: 11626690
    Abstract: A cable connector configured to secure a cable is provided. The cable connector has a casing, a latch, and a pulling member. The casing is configured to secure an end of the cable. The latch has a lower portion and an upper portion. The lower portion is secured on the casing and has a lower through hole. The upper portion has at least one upper through hole and at least one protrusion. The pulling member is connected with the upper through hole and penetrates the lower through hole. While the pulling member is pulled away from the latch along a first direction, the pulling member pulls the upper portion toward the lower portion along a second direction, so as to adjust a position of the protrusion. Thus, the latch may not be separated from the casing when a user pulls the pulling member.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: April 11, 2023
    Assignee: Bizlink International Corporation
    Inventors: Hsin Tuan Hsiao, Jui Hung Chien
  • Patent number: 11532913
    Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connecting sections, and the wire connecting sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first edge distance and an expanded edge distance. The first edge distance is adjacent to the contact sections, and the expanded edge distance is between the first edge distance and the wire connecting sections. In addition, the first edge distance is smaller than the expanded edge distance to improve signal integrity.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: December 20, 2022
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Kuo-Yang Tsai
  • Publication number: 20220393385
    Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.
    Type: Application
    Filed: August 18, 2022
    Publication date: December 8, 2022
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Patent number: 11523538
    Abstract: A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: December 6, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Publication number: 20220352664
    Abstract: A power connector has a casing, a first power terminal, and a second power terminal. The casing has at least one cable-in opening. The first power terminal has a first inner connecting portion and a first outer connecting portion. The first inner connecting portion is secured in the casing and has a first through hole matrix. The first through hole matrix faces the at least one cable-in opening and has multiple first through holes. The first outer connecting portion is located outside of the casing. The second power terminal is basically the same as the first power terminal. The first power terminal is located between the second power terminal and the at least one cable-in opening. The first power terminal shields part of the second power terminal and allows the second through hole matrix of the second power terminal to be exposed to the at least one cable-in opening.
    Type: Application
    Filed: April 21, 2022
    Publication date: November 3, 2022
    Inventors: Hsin-Tuan Hsiao, Shi-Jung Chen
  • Patent number: 11454774
    Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: September 27, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Patent number: 11381027
    Abstract: An electronic connector has a first shell, a second shell, a space, and at least one fixing unit. The first shell has a cover segment and at least one first assembling segment mounted securely on the cover segment. The second shell has at least one second assembling segment arranged with the first assembling segment of the first shell along the width direction of the electronic connector. The space is formed between the cover segment of the first shell and the second shell. The first assembling segment of the first shell is located in the space. The fixing unit is mounted through the first assembling segment of the first shell and the second assembling segment of the second shell along the width direction. Therefore, wires will not be restricted by the first assembling segment and the second assembling segment in the width direction.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: July 5, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Patent number: 11289840
    Abstract: A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: March 29, 2022
    Assignee: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin Tuan Hsiao, Chih-Feng Cheng, Jui Hung Chien
  • Publication number: 20220094107
    Abstract: A cable connector configured to secure a cable is provided. The cable connector has a casing, a latch, and a pulling member. The casing is configured to secure an end of the cable. The latch has a lower portion and an upper portion. The lower portion is secured on the casing and has a lower through hole. The upper portion has at least one upper through hole and at least one protrusion. The pulling member is connected with the upper through hole and penetrates the lower through hole. While the pulling member is pulled away from the latch along a first direction, the pulling member pulls the upper portion toward the lower portion along a second direction, so as to adjust a position of the protrusion. Thus, the latch may not be separated from the casing when a user pulls the pulling member.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 24, 2022
    Inventors: HSIN TUAN HSIAO, JUI HUNG CHIEN
  • Publication number: 20220037815
    Abstract: A contact pad is provided. The contact pad may be a strip-shaped component and forms at least one opening. A circuit device is also provided. The circuit device has a circuit board, at least one contact pad as mentioned above, and a cable. The contact pad is mounted on the circuit board as a connecting spot. The cable has at least one wire. The wire is mounted on the contact pad and covers the opening of the contact pad. An interval is formed in the opening and between the circuit board and the wire. With such structure, a capacitance formed between the wire and the circuit board may be the smallest and the impedance value may be the largest. Besides, the capacitance value can be adjusted via changing the material inside the interval or an area of the contact pad or the opening.
    Type: Application
    Filed: July 23, 2021
    Publication date: February 3, 2022
    Inventors: Hsin-Tuan Hsiao, Yi-Hsing Chung, Ting-Jhen Pan
  • Publication number: 20220037834
    Abstract: An anti-attenuation apparatus has an electronic device and a cable assembly. The electronic device has a circuit board and a plurality of metal pads mounted on the circuit board as female connecting spots. The cable assembly has a cable main body and an inserting connector. The inserting connector is mounted at an end of the cable main body and has multiple elastic components as male connecting spots. The female connecting spots and the male connecting spots selectively contact each other and thus the electric connection is formed. Therefore, the electronic device needs no additional socket and no additional connector as female connecting spots. Similarly, the cable assembly needs no additional connector for connecting the elastic component and the cable main body. In other words, twice attenuations are skipped in a set that has the electronic device and the cable assembly.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: Hsin-Tuan Hsiao, Yi-Hsing Chung
  • Patent number: 11228140
    Abstract: An electronic device connection system has a cable, a cable connector, and an electronic device. The electronic device has a socket. When the cable connector is mounted through the socket, the cable is electrically connected to the electronic device. The cable connector has a casing, a resilient latch, and a pulling member. The casing forms a protrusion and a first engaged opening. The resilient latch forms a hooked opening and a first hook. The protrusion can be engaged in the hooked opening, and the first hook can be engaged in the first engaged opening so the resilient latch is firmly fixed on the casing. Thus, the resilient latch may not be separated from the casing when a user pulls the pulling member, which ensures that the casing will be detached from the socket when the pulling member is pulled.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: January 18, 2022
    Assignee: Bizlink International Corporation
    Inventors: Hsin Tuan Hsiao, Jui Hung Chien
  • Patent number: 11227705
    Abstract: A circuit board assembly has a circuit board and a high-speed cable. The high-speed cable has two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The signal lines, the ground conductor, and the impedance-reducing conductor are mounted through the entire high-speed cable. The covering material wraps the signal lines, the ground conductor, and the impedance-reducing conductor, and has a conductive layer and an isolation layer as an inner layer and an outer layer respectively. The conductive layer has multiple loops electrically connected to the ground conductor and the impedance-reducing conductor. Thus, the impedance in the covering material, the ground conductor, and the impedance-reducing conductor is decreased, which prevents from attenuating the signal intensity during transmission at high frequency.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: January 18, 2022
    Assignee: Bizlink International Corporation
    Inventors: Hsin Tuan Hsiao, Chih Feng Cheng
  • Publication number: 20210391660
    Abstract: A connector assembly includes a wire end connector for electrically connecting to a board end connector. The wire end connector includes a main body portion and an insertion portion. The insertion portion is connected to the main body portion, and the insertion portion is configured to couple to the board end connector. The main body portion is provided with a plurality of elastic claws extending outward from the main body portion to press on the board end connector when the insertion portion is coupled to the board end connector so as to stably connect the wire end connector to the board end connector.
    Type: Application
    Filed: August 30, 2021
    Publication date: December 16, 2021
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Patent number: 11165201
    Abstract: An interface card is provided with an oblique-insert-proof structure. The interface card has an inserting portion configured to be inserted into a slot of a motherboard. The oblique-insert-proof structure is configured to abut the slot. The oblique-insert-proof structure has a connecting portion and two end blocking portions. The connecting portion has a groove in an inserting direction and extending in a length direction. The end blocking portions are configured to abut two shorter side surfaces of the slot. The oblique-insert-proof structure is securely mounted on the interface card and the inserting portion is mounted through the groove. When the interface card is mounted on the motherboard, the oblique-insert-proof structure can assist in aligning the inserting portion with the slot. Also, the oblique-insert-proof structure can enhance the strength of the connection between the interface card and the motherboard, so the interface card can be disposed with more components and bear more weight.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: November 2, 2021
    Assignee: Bizlink International Corporation
    Inventors: Hsin Tuan Hsiao, Jui Hung Chien
  • Patent number: 11139597
    Abstract: A connector assembly includes a wire end connector for electrically connecting to a board end connector. The wire end connector includes a main body portion and an insertion portion. The insertion portion is connected to the main body portion, and the insertion portion is configured to couple to the board end connector. The main body portion is provided with a plurality of elastic claws extending outward from the main body portion to press on the board end connector when the insertion portion is coupled to the board end connector so as to stably connect the wire end connector to the board end connector.
    Type: Grant
    Filed: November 10, 2019
    Date of Patent: October 5, 2021
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Publication number: 20210257773
    Abstract: An electronic connector has a first shell, a second shell, a space, and at least one fixing unit. The first shell has a cover segment and at least one first assembling segment mounted securely on the cover segment. The second shell has at least one second assembling segment arranged with the first assembling segment of the first shell along the width direction of the electronic connector. The space is formed between the cover segment of the first shell and the second shell. The first assembling segment of the first shell is located in the space. The fixing unit is mounted through the first assembling segment of the first shell and the second assembling segment of the second shell along the width direction. Therefore, wires will not be restricted by the first assembling segment and the second assembling segment in the width direction.
    Type: Application
    Filed: November 23, 2020
    Publication date: August 19, 2021
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN