Patents by Inventor Hsin-Tuan Hsiao

Hsin-Tuan Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210247577
    Abstract: A connector has a case, a circuit board, a thermal diffusing unit, and a first heat sink. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. A heat transfer coefficient of the thermal diffusing unit is larger than a heat transfer coefficient of the case. The first heat sink abuts the thermal diffusing unit and is exposed from the case. A heat transfer coefficient of the first heat sink is larger than the heat transfer coefficient of the case. By the first heat sink abutting the thermal diffusing unit and exposed from the case, and the heat transfer coefficients of both the thermal diffusing unit and the first heat sink being larger than that of the case, the heat dissipation efficiency is improved.
    Type: Application
    Filed: November 17, 2020
    Publication date: August 12, 2021
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Patent number: 11075476
    Abstract: A high speed wire end connector includes a printed circuit board, a cable, an inner film, an outer casing, and a molded bonding layer. The cable is soldered to the printed circuit board, the inner film covers a part of the cable and a part of the printed circuit board, and the outer casing is used to fix the printed circuit board, the cable and the printed circuit board, and a part of the printed circuit board is passed through a guide hole of the outer casing. The molded bonding layer bonds the outer casing to the inner film. In addition, a metal spring latch is mounted on the outer casing.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: July 27, 2021
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Publication number: 20210227717
    Abstract: A connector has a case, a circuit board, and a thermal diffusing unit. The case has an inner surface. The circuit board is mounted in the case and has a heating source. The thermal diffusing unit abuts the inner surface of the case and the heating source of the circuit board. An area of the thermal diffusing unit abutting the inner surface is bigger than an area of the thermal diffusing unit abutting the heating source. A heat transfer coefficient of the thermal diffusing unit is bigger than a heat transfer coefficient of the case. With the structure above, the thermal diffusing unit is allowed to transmit heat from a small area to a big area, thereby improving the heat dissipation efficiency of the connector.
    Type: Application
    Filed: November 16, 2020
    Publication date: July 22, 2021
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Publication number: 20210175650
    Abstract: A connector has a casing and a circuit board structure. The circuit board structure is mounted through the casing and has a board main body, a projecting body, and multiple metal electrodes. The projecting body is mounted on a connecting end surface of the board main body and projects from the connecting end surface in an insertion direction of the connector. When the connector is connected to another device, the projecting body of the circuit board structure may push a part of pins of the device first, so the user may exert less force to insert the projecting body into the device. Then, when the circuit board structure is inserted further, the board main body may abut the remaining pins. Because part of the pins have been pushed away by the projecting body, the board main body only needs to counteract resistance from the remaining pins.
    Type: Application
    Filed: September 15, 2020
    Publication date: June 10, 2021
    Applicant: BIZLINK INTERNATIONAL CORPORATION
    Inventors: Hsin Tuan HSIAO, Chih-Feng CHENG, Jui Hung CHIEN
  • Publication number: 20210175663
    Abstract: An electronic device connection system has a cable, a cable connector, and an electronic device. The electronic device has a socket. When the cable connector is mounted through the socket, the cable is electrically connected to the electronic device. The cable connector has a casing, a resilient latch, and a pulling member. The casing forms a protrusion and a first engaged opening. The resilient latch forms a hooked opening and a first hook. The protrusion can be engaged in the hooked opening, and the first hook can be engaged in the first engaged opening so the resilient latch is firmly fixed on the casing. Thus, the resilient latch may not be separated from the casing when a user pulls the pulling member, which ensures that the casing will be detached from the socket when the pulling member is pulled.
    Type: Application
    Filed: September 15, 2020
    Publication date: June 10, 2021
    Inventors: HSIN TUAN HSIAO, JUI HUNG CHIEN
  • Patent number: 10978770
    Abstract: A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.
    Type: Grant
    Filed: June 20, 2019
    Date of Patent: April 13, 2021
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Chih-Feng Cheng
  • Publication number: 20210065932
    Abstract: A circuit board assembly has a circuit board and a high-speed cable. The high-speed cable has two signal lines, a ground conductor, an impedance-reducing conductor, and a covering material. The signal lines, the ground conductor, and the impedance-reducing conductor are mounted through the entire high-speed cable. The covering material wraps the signal lines, the ground conductor, and the impedance-reducing conductor, and has a conductive layer and an isolation layer as an inner layer and an outer layer respectively. The conductive layer has multiple loops electrically connected to the ground conductor and the impedance-reducing conductor. Thus, the impedance in the covering material, the ground conductor, and the impedance-reducing conductor is decreased, which prevents from attenuating the signal intensity during transmission at high frequency.
    Type: Application
    Filed: August 24, 2020
    Publication date: March 4, 2021
    Inventors: Hsin Tuan Hsiao, Chih Feng Cheng
  • Publication number: 20210028579
    Abstract: An interface card is provided with an oblique-insert-proof structure. The interface card has an inserting portion configured to be inserted into a slot of a motherboard. The oblique-insert-proof structure is configured to abut the slot. The oblique-insert-proof structure has a connecting portion and two end blocking portions. The connecting portion has a groove in an inserting direction and extending in a length direction. The end blocking portions are configured to abut two shorter side surfaces of the slot. The oblique-insert-proof structure is securely mounted on the interface card and the inserting portion is mounted through the groove. When the interface card is mounted on the motherboard, the oblique-insert-proof structure can assist in aligning the inserting portion with the slot. Also, the oblique-insert-proof structure can enhance the strength of the connection between the interface card and the motherboard, so the interface card can be disposed with more components and bear more weight.
    Type: Application
    Filed: July 20, 2020
    Publication date: January 28, 2021
    Inventors: HSIN TUAN HSIAO, JUI HUNG CHIEN
  • Patent number: 10868387
    Abstract: A high speed wire end connector manufacturing method includes the following steps. First, a cable is soldered to a printed circuit board, and then an inner film is formed to cover a portion of the cable and a portion of the printed circuit board by an insert molding process. Another portion of the printed circuit board is passed through a guide hole of an outer casing, and a molded bonding layer is formed by an outer molding process to bond to the outer casing and the inner film. In addition, a metal spring latch is fixed on the outer casing. In addition, a high speed wire end connector is also disclosed herein.
    Type: Grant
    Filed: October 4, 2019
    Date of Patent: December 15, 2020
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Jui-Hung Chien
  • Publication number: 20200366025
    Abstract: A high speed wire end connector manufacturing method includes the following steps. First, a cable is soldered to a printed circuit board, and then an inner film is formed to cover a portion of the cable and a portion of the printed circuit board by an insert molding process. Another portion of the printed circuit board is passed through a guide hole of an outer casing, and a molded bonding layer is formed by an outer molding process to bond to the outer casing and the inner film. In addition, a metal spring latch is fixed on the outer casing. In addition, a high speed wire end connector is also disclosed herein.
    Type: Application
    Filed: October 4, 2019
    Publication date: November 19, 2020
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Publication number: 20200366016
    Abstract: A connector assembly includes a wire end connector for electrically connecting to a board end connector. The wire end connector includes a main body portion and an insertion portion. The insertion portion is connected to the main body portion, and the insertion portion is configured to couple to the board end connector. The main body portion is provided with a plurality of elastic claws extending outward from the main body portion to press on the board end connector when the insertion portion is coupled to the board end connector so as to stably connect the wire end connector to the board end connector.
    Type: Application
    Filed: November 10, 2019
    Publication date: November 19, 2020
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Publication number: 20200366019
    Abstract: A high speed wire end connector includes a printed circuit board, a cable, an inner film, an outer casing, and a molded bonding layer. The cable is soldered to the printed circuit board, the inner film covers a part of the cable and a part of the printed circuit board, and the outer casing is used to fix the printed circuit board, the cable and the printed circuit board, and a part of the printed circuit board is passed through a guide hole of the outer casing. The molded bonding layer bonds the outer casing to the inner film. In addition, a metal spring latch is mounted on the outer casing.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 19, 2020
    Inventors: Hsin-Tuan HSIAO, Jui-Hung CHIEN
  • Publication number: 20200161024
    Abstract: A flexible flat cable structure includes a conductor layer, a first low-k dielectric and impedance adjusting adhesive layer, a first metal isolation layer, a second low-k dielectric and impedance adjusting adhesive layer, and a second metal isolation layer. The first low-k dielectric and impedance adjusting adhesive layer is adhered to one side of the conductor layer, the first metal isolation layer is adhered to a surface of the first low-k dielectric and impedance adjusting adhesive layer, the second low-k dielectric and impedance adjusting adhesive layer is adhered to another side of the conductor layer, and the second metal isolation layer is adhered to a surface of the second low-k dielectric and impedance adjusting adhesive layer so as to adjust the impedance of the flexible flat cable structure according to requirements and reduce the electromagnetic interference thereof.
    Type: Application
    Filed: June 20, 2019
    Publication date: May 21, 2020
    Inventors: Hsin-Tuan HSIAO, Chih-Feng CHENG
  • Publication number: 20200161733
    Abstract: A high frequency flexible flat cable includes a first metal isolation layer, a first low-k dielectric adhesive layer attached to one side of the first metal isolation layer, a second low-k dielectric adhesive layer attached another side of the first metal isolation layer and at least two conductor layers respectively attached to the first low-k dielectric adhesive layer and the second low-k dielectric adhesive layer. In addition, the high frequency flexible flat cable further includes a third low-k dielectric adhesive layer, a fourth low-k dielectric adhesive layer, a second metal isolation layer and a third metal isolation layer. The second metal isolation layer and the third metal isolation layer are respectively adhered to outsides of the conductor layers by using the third low-k dielectric adhesive layer and the fourth low-k dielectric adhesive layer to adjust the impedance of the high frequency flexible flat cable according to requirements.
    Type: Application
    Filed: June 20, 2019
    Publication date: May 21, 2020
    Inventors: Hsin-Tuan HSIAO, Chih-Feng CHENG
  • Patent number: 10658795
    Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connection sections, and the wire connection sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first center distance and a reduced center distance. The first center distance is adjacent to the contact sections, and the reduced center distance is between the first center distance and the wire connecting sections. In addition, the first center distance is greater than the reduced center distance to improve signal integrity.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: May 19, 2020
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Kuo-Yang Tsai
  • Publication number: 20200127418
    Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connection sections, and the wire connection sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first center distance and a reduced center distance. The first center distance is adjacent to the contact sections, and the reduced center distance is between the first center distance and the wire connecting sections. In addition, the first center distance is greater than the reduced center distance to improve signal integrity.
    Type: Application
    Filed: April 2, 2019
    Publication date: April 23, 2020
    Inventors: Hsin-Tuan HSIAO, Kuo-Yang TSAI
  • Publication number: 20200127406
    Abstract: A cable assembly includes a plurality of wires and a plurality of electrical contacts. The electrical contacts include contact sections and wire connecting sections, and the wire connecting sections of the electrical contacts are respectively connected to the wires. Two adjacent electrical contacts for transmitting signals have a first edge distance and an expanded edge distance. The first edge distance is adjacent to the contact sections, and the expanded edge distance is between the first edge distance and the wire connecting sections. In addition, the first edge distance is smaller than the expanded edge distance to improve signal integrity.
    Type: Application
    Filed: April 2, 2019
    Publication date: April 23, 2020
    Inventors: Hsin-Tuan HSIAO, Kuo-Yang TSAI
  • Patent number: 10530078
    Abstract: An electronic signal processing device includes a printed circuit board, a signal processing chip, a plurality of conductive lines, a plurality of copper pads, and a fixing device. The signal processing chip is mounted on the printed circuit board, and a plurality of conductive lines are formed on the printed circuit board and connected to the signal processing chip. The copper pads are respectively formed at the ends of the conductive lines. The fixing device is fixed on the printed circuit board and exposes the copper pads to connect to a cable assembly so as to improve signal integrity.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: January 7, 2020
    Assignee: BizLink International Corp.
    Inventors: Hsin-Tuan Hsiao, Kuo-Yang Tsai
  • Patent number: 10461473
    Abstract: A pull strip cable module includes a connector, a U-shaped spring latch and a pull strip. The U-shaped spring latch includes a U-shaped elastic portion, a first end portion extending outwardly from one end of the U-shaped elastic portion and a second end portion extending outwardly from another end of the U-shaped elastic portion. In addition, a sliding opening is formed on the first end portion. The U-shaped spring latch is fixed on the connector, and one end of the pull strip is fixed to the second end portion of the U-shaped spring latch and the pull strip passes through the sliding opening of the first end portion of the U-shaped spring latch.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: October 29, 2019
    Assignee: BizLink International Corp.
    Inventor: Hsin-Tuan Hsiao
  • Publication number: 20120279078
    Abstract: A tilt sensor capable of sensing tilt in multiple directions includes a backplane, a base, a cover, and a moving component. A light emitting component and light sensing components are disposed on the backplane. The base, disposed on the backplane, includes a recess the bottom of which having a plurality of through-holes. The through-holds expose the light emitting and light sensing components. The cover, disposed on the base, covers the recess. The moving component, disposed in the recess and between the base and the cover, includes a shelter portion where center of gravity of the moving component is located. The moving component moves in directions toward which the tilt sensor is titled, and the shelter portion covers some of the through-holes and blocks light to or from the light emitting and light sensing components. The moving component is highly sensitive and not subject to malfunction caused by friction-induced static electricity.
    Type: Application
    Filed: May 3, 2012
    Publication date: November 8, 2012
    Applicant: EVERLIGHT ELECTRONICS CO., LTD.
    Inventor: Hsin-Tuan Hsiao